Electronic device

Abstract

An electronic device ( 1 ) is described, which comprises an envelope ( 2 ) comprising a closed chamber ( 4 ) and a printed-circuit board ( 3 ), the printed-circuit board ( 3 ) being positioned in the chamber ( 4 ) defining a dissipation chamber ( 4 ′), the printed-circuit board ( 3 ) comprising at least one electronic device ( 5 a ) positioned in the dissipation chamber ( 4 ′), the chamber ( 4 ′) comprising a filler ( 7 ) simultaneously in contact with the electronic component ( 5 a ), the printed-circuit board ( 3 ) and a dissipation film ( 10 ).

1 . An electronic device ( 1 ) characterized by comprising an envelope ( 2 ) comprising a closed chamber ( 4 ) and a printed-circuit board ( 3 ) having tracks; 
 the printed-circuit board ( 3 ) being positioned in the chamber ( 4 ) defining a dissipation chamber ( 4 ′) that is formed by the area between a surface ( 9 ) of the printed-circuit board ( 3 ) and the envelope ( 2 ),    the electronic device ( 1 ) comprising a dissipation film ( 10 ) arranged on an internal surface of the envelope ( 2 ) within the dissipation chamber ( 4 ′),    the printed-circuit board ( 3 ) comprising at least one electronic component ( 5   a ) positioned in the dissipation chamber ( 4 ′),    the chamber ( 4 ′) comprising a filler ( 7 ) that simultaneously contacts directly with a perimeter of the electronic component ( 5   a ), with the surface ( 9 ) of the printed-circuit board ( 3 ), with the tracks of the printed-circuit board ( 3 ) and the dissipation film ( 10 ).    
     
     
         2 . A device according to  claim 1 , characterized in that the perimeters of the components ( 5   b ) in contact with the filler ( 7 ) comprise the portions of these components ( 5   a ) which are above the surface ( 9 ) of the printed-circuit board ( 3 ).  
     
     
         3 . A device according to  claim 2 , characterized in that the dissipation film ( 10 ) embraces an area larger than the projected area of the electronic components ( 5   a ).  
     
     
         4 . A device according to  claim 3 , characterized in that the dissipation film ( 10 ) is constituted by a metallic material.  
     
     
         5 . A device according to  claim 3 , characterized in that the dissipation film ( 10 ) comprises an adhesive material on at least one surface.  
     
     
         6 . A device according to any one of claims  1 - 5 , characterized in that the filler ( 7 ) is directly in contact with terminals of the electronic component ( 5   a ).  
     
     
         7 . A device according to  claim 6 , characterized in that the filler ( 7 ) comprises an electrically-insulating gel.  
     
     
         8 . A device according to  claim 6 , characterized in that the filler ( 7 ) comprises an electrically-insulating paste.  
     
     
         9 . A device according to  claim 6 , characterized in that the filler ( 7 ) comprises an electrically-insulating elastomer.  
     
     
         10 . A device according to  claim 7 ,  8 , or  9 , characterized in that the filler ( 7 ) contains an additive or filler of a heat-conducting material.  
     
     
         11 . A device according to  claim 10 , characterized in that the printed-circuit board ( 3 ) comprises power-type electronic components ( 5   a ), associated to a second surface ( 6 ) thereof substantially opposed to the first surface ( 9 ).  
     
     
         12 . A device according to  claim 11 , characterized in that the envelope ( 2 ) is constituted by an electrically-insulating material.  
     
     
         13 . A device according to  claim 12 , characterized in that the envelope ( 2 ) is constituted by a rigid polymeric material.