Semiconductor device having voltage feedback circuit therein, and electronic apparatus using the same

Abstract

When a double wire is used in a semiconductor device, it is difficult to detect the open failure of one of two wires. It is intended that this detection be carried out with a weak current and that the load regulation of the semiconductor device be improved. A series regulator is incorporated into an IC chip. A battery voltage is applied to an input pin. The output of a transistor that constitutes the regulator appears at an output pin via an output pad. A feedback signal of an output voltage appears at one end of a voltage-dividing resistor. The output pad is connected with a feedback pad via a protective resistor or diode.

What is claimed is:  
     
         1 . A semiconductor device, including: 
 an IC chip including: 
 a control circuit which, based on an input signal and a feedback signal in which an output voltage is fed back, controls the output voltage;  
 an output pad for outputting the output voltage; and  
 a feedback pad for inputting the feedback signal; and  
   a protective resistor connected between the output pad and the feedback pad.    
     
     
         2 . A semiconductor device, including: 
 an IC chip including: 
 a control circuit which, based on an input signal and a feedback signal in which an output voltage is fed back, controls the output voltage; and  
 an output pad for outputting the output voltage; and  
 a feedback pad for inputting the feedback signal;  
   an output terminal connected to the output pad; and    a feedback terminal connected to the feedback pad.    
     
     
         3 . A semiconductor device according to  claim 2 , wherein said IC chip includes a protective resistor connected between the output pad and the feedback pad.  
     
     
         4 . An electronic apparatus, comprising: 
 a semiconductor device including: 
 an IC chip including: 
 a control circuit which, based on an input signal and a feedback signal in which an output voltage is fed back, controls the output voltage;  
 an output pad for outputting the output voltage;  
 a feedback pad for inputting the feedback signal; and  
 a protective resistor connected between the output pad and the feedback pad; and  
 
 an output terminal connected to the output pad; and  
 a feedback terminal connected to the feedback pad;  
   a load device which includes an input terminal;    an output interconnection which connects the output terminal with the input terminal of said load device and which supplies an output of said semiconductor device to said load device; and    a feedback interconnection which connects the feedback terminal with the input terminal of said load device or said output interconnection and which feeds back a voltage supplied to said load device, to said semiconductor device.    
     
     
         5 . An electronic apparatus, comprising: 
 a semiconductor device including: 
 an IC chip including: 
 a control circuit which, based on an input signal and a feedback signal in which an output voltage is fed back, controls the output voltage;  
 an output pad for outputting the output voltage; and  
 a feedback pad for inputting the feedback signal;  
 
 an output terminal connected to the output pad; and  
 a feedback terminal connected to the feedback pad;  
   a load device which includes an input terminal;    an output interconnection which connects the output terminal with the input terminal of said load device and which supplies an output of said semiconductor device to said load device;    a feedback interconnection which connects the feedback terminal with the input terminal of said load device or said output interconnection and which feeds back a voltage supplied to said load device, to said semiconductor device; and    a protective resistor connected between said output interconnection and said feedback interconnection.    
     
     
         6 . A semiconductor device, including: 
 an IC chip which includes a first pad and a second pad; and    a terminal connected to both the first pad and the second pad,    wherein a fist signal connected to said first pad and a second signal connected to said second pad are coupled by a diode.    
     
     
         7 . A semiconductor device according to  claim 6  wherein said terminal is an input terminal, the semiconductor device further including: 
 a control circuit which generates a target voltage from a power supply voltage when the power supply voltage is applied to the input terminal; and  
 an output terminal which outputs the thus generated target voltage,  
 wherein said control circuit is structured such that the power supply voltage is received by two systems of the fist signal and the second signal so as to generate the target voltage by the two systems.  
 
     
     
         8 . A semiconductor device according to  claim 6  wherein said terminal is an output terminal, the semiconductor device further including: 
 an input terminal to which a predetermined power supply voltage is applied; and  
 a control circuit which generates a target voltage from the power supply voltage,  
 wherein the target voltage is applied to either the first signal or the second signal.  
 
     
     
         9 . A semiconductor device, including: 
 an input terminal to which a power supply voltage is applied;    a control circuit which generates a target voltage from the power supply voltage; and    an output terminal which outputs the thus generated target voltage,    wherein at an IC chip side there are provided a plurality of pads for use with at least one of said input terminal and said output terminal, so as to have duplicated signal transmission paths for the at least one of said input terminal and said output terminal, and wherein a diode is coupled between the duplicated signal transmission paths therefor.    
     
     
         10 . An electronic apparatus, including: 
 a semiconductor device including: 
 an input terminal to which a power supply voltage is applied;  
 a control circuit which generates a target voltage from the power supply voltage; and  
 an output terminal which outputs the thus generated target voltage; and  
   a load device,    wherein at an IC chip side there are provided a plurality of pads for use with at least one of said input terminal and said output terminal, so as to have duplicated signal transmission paths for the at least one of said input terminal and said output terminal, and wherein the duplicated signal transmission paths therefor are coupled by a diode at points inside said semiconductor device or between said semiconductor device and said load device.