Etching method and apparatus

Abstract

The invention intends to provide an etching method in which a bank 12 is formed to a member to be processed 10, and thereby a precise etching can be applied to a predetermined position, and apparatus for the method. In a range outside of a predetermined pattern of the member to be processed 10, a liquid repelling bank 12 is formed, and by use of a discharge head 16 a coating liquid 14 such as an etching liquid 15 is coated on an etching portion 18 of the predetermined pattern. The etching portion 18 is rendered lyophilic by treatment to improve the fixing properties of the coating liquid 14, and the bank 12 is formed of a liquid repelling film, and thereby the coating liquid 14 is inhibited from adhering to the bank 12.

What is claimed is:  
     
         1 . An etching method characterized in that a bank is disposed in the surroundings of an etching portion of a member to be processed, an etching liquid is supplied into the bank by use of a liquid discharge means, and thereby the etching portion is etched.  
     
     
         2 . An etching method characterized in that a bank is disposed in the surroundings of an etching portion of a member to be processed, the surroundings of the etching portion are rendered a reactive gas atmosphere, and a liquid capable of dissolving the reactive gas is supplied into the bank by use of a liquid discharge means, and thereby the etching portion is etched.  
     
     
         3 . The etching method as set forth in  claim 1  or  2  characterized in that the etching portion is rendered lyophilic by treatment.  
     
     
         4 . An etching method characterized in that an etching portion of a member to be processed is rendered lyophilic by treatment, an etching liquid is supplied to the etching portion by use of a liquid discharge means, and thereby the etching portion is etched.  
     
     
         5 . An etching method characterized in that an etching portion of a member to be processed is rendered lyophilic by treatment, the surroundings of the etching portion are rendered a reactive gas atmosphere, and a liquid capable of dissolving the reactive gas is supplied to the etching portion by use of a liquid discharge means, and thereby the etching portion is etched.  
     
     
         6 . The etching method as set forth in any one of  claim 1 ,  2 ,  4  or  5  characterized in that the etching is carried out with a reaction product removed by suction.  
     
     
         7 . The etching method as set forth in any one of  claim 1 ,  2 ,  4  or  5  characterized in that the etching is carried out with the member to be processed heated.  
     
     
         8 . The etching method as set forth in  claim 7  characterized in that a member to be processed is heated to a temperature in the range of 30 to 60 degree centigrade.  
     
     
         9 . The etching method as set forth in  claim 1  or  2  characterized in that the bank is rendered liquid repelling by treatment, or has a characteristic of liquid repelling.  
     
     
         10 . The etching method as set forth in any one of  claim 1 ,  2 ,  4  or  5  characterized in that the bank is made of a fluororesin film.  
     
     
         11 . An etching apparatus characterized in comprising a liquid discharge means that supply an etching liquid to an etching portion of a member to be processed, and a suction portion that sucks a reaction product during the etching.  
     
     
         12 . The etching apparatus as set forth in  claim 11  characterized in that the suction portion is combined with the liquid discharge means.  
     
     
         13 . An etching apparatus characterized in comprising a discharge unit that includes a gas discharge portion that supplies a reactive gas to an etching portion of a member to be processed, a liquid discharge means that supply liquid capable of dissolving the reactive gas to the etching portion, and a suction portion that is disposed in the neighborhood of the gas discharge portion or the liquid discharge portion and capable of sucking a reaction product.  
     
     
         14 . The etching apparatus as set forth in any one of claims  11  through  13  characterized in that the discharge unit is disposed plurally.  
     
     
         15 . The etching apparatus as set forth in any one of claims  11  through  13  characterized in that the discharge head is provided with a heater.