Method of making package containing semiconductor devices and desiccant

Abstract

A method of making a moisture-proof package that holds semiconductor devices and desiccant is provided. A tray that retains desiccant is prepared. Semiconductor devices are placed on the tray, and the semiconductor devices and the desiccant carried by the tray are then heat treated before being sealed in a moisture-proof bag. Once the semiconductor devices are shipped to customers, the tray and desiccant are both reused until the moisture absorbing properties of the desiccant diminish.

What is claimed is:  
     
         1 . A method of making a package, comprising: 
 preparing a tray that retains a desiccant;    providing one or more semiconductor devices on the tray;    heating the tray; and    sealing the tray in a moisture-proof container.    
     
     
         2 . The method according to  claim 1 , wherein the tray and the desiccant retained therein are recovered after use.  
     
     
         3 . A method of reusing a desiccant, comprising: 
 recovering a tray in which a desiccant is retained;    providing one or more semiconductor devices on the tray;    heating the tray; and    sealing the tray in a moisture-proof container.    
     
     
         4 . A tray for containing semiconductor devices, comprising: 
 a plurality of pockets for accommodating one or more semiconductor devices having individual packages; and    a retainer that retains a desiccant,    wherein the tray sustains enough heat to substantially remove any moisture absorbed by the individual packages.    
     
     
         5 . The tray according to  claim 4 , wherein the retainer includes a groove in which the desiccant is placed, and a cover to retain the desiccant in the groove.