US2004072508A1PendingUtilityA1
Method of treating ceramic surfaces
Priority: Dec 11, 1998Filed: Sep 30, 2003Published: Apr 15, 2004
Est. expiryDec 11, 2018(expired)· nominal 20-yr term from priority
G01N 27/44704C04B 41/91C04B 41/009B01J 2219/00527C40B 60/14G01N 27/44795C04B 41/84C04B 41/4922B01J 2219/00317B01D 57/02C04B 41/53
36
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Claims
Abstract
The invention relates to methods for treating ceramic surfaces to decrease their wettability by aqueous solutions. One method involves polishing the ceramic surface until wettability is decreased, and a second method involves a silane heat treatment. Both methods can be used to produce ceramic supports for IEF and electrophoresis gels, as well as microarray plates.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method for modifying a ceramic surface, comprising polishing the surface with an abrasive under conditions sufficient to decrease the wettability of the ceramic surface by aqueous solutions.
2 . The method according to claim 1 , wherein the abrasive comprises a slurry.
3 . The method according to claim 1 , wherein the abrasive comprises particles having a particle size ranging from about 3 microns to about 9 microns.
4 . The method according to claim 3 , wherein the abrasive comprises particles having an average particle size of about 6 microns.
5 . The method according to claim 1 , wherein the abrasive comprises particles having a particle size distribution:
5%
10%
50%
90%
95%
>7.8 μm
>7.2 μm
>5.8 μm
>4.8 μm
>4.5 μm
6 . The method according to claim 2 , wherein the abrasive comprises diamond particles.
7 . The method according to claim 2 , wherein the abrasive comprises silicon carbide particles.
8 . The method according to claim 2 , wherein the surface is polished by lapping, tumbling, vibratory milling, or by contact with a rotating polishing wheel.
9 . The method according to claim 1 , wherein the surface is polished for approximately 10-20 seconds/cm 2 of ceramic surface.
10 . The method according to claim 1 , wherein the surface is polished until it becomes visibly reflective.
11 . The method according to claim 1 , wherein the surface is polished until it has a surface finish of about 8 to about 15 microinches after polishing.
12 . The method according to claim 1 , wherein the ceramic surface exhibits a contact angle with the aqueous solution that increases from about 15-20° before polishing to about 40-50° after polishing.
13 . A method for modifying a ceramic surface, comprising contacting the ceramic surface with a silane and heating for a sufficient time at a sufficient temperature to decrease the wettability of the ceramic surface by aqueous solutions.
14 . A method for modifying a ceramic surface, comprising,
(a) contacting the surface with an alkyl-containing silane; and (b) heating the surface and the alkyl-containing silane under conditions sufficient to react at least a portion of the hydroxyl groups on ceramic surface with the alkyl-containing silane.
15 . The method according to claim 13 , wherein the silane is a methyl silane.
16 . The method according to claim 13 , wherein the silane is a halotrialkylsilane.
17 . The method according to claim 16 , wherein the halotrialkylsilane is trimethylchlorosilane.
18 . The method according to claim 13 , wherein the silane is a dihalodialklysilane.
19 . The method according to claim 18 , wherein the dihalodialklysilane is dichlorodimethylsilane.
20 . The method according to claim 13 , wherein the silane is a trihalomethylsilane.
21 . The method according to claim 20 , wherein the trihalomethylsilane is trichloromethylsilane.
22 . The method according to claim 13 , further comprising,
removing unreacted residual silane from the surface.
23 . The method according to claim 22 , wherein the removal is accomplished by heating.
24 . The method according to claim 13 , further comprising removing at least a portion of physically attached water on the ceramic surface prior to contacting.
25 . The method according to claim 24 , wherein said physically attached water is removed by heating the surface.
26 . The method according to claim 25 , wherein the surface is heated to a temperature between about 70° C. and about 150° C.
27 . The method according to claim 26 , wherein the surface is heated to a temperature between about 110° C. and about 120° C.
28 . The method according to claim 25 , wherein the surface is heated for a time between about 10 min. and about 120 min.
29 . The method according to claim 28 , wherein the surface is heated for a time between about 30 min. and about 60 min.
30 . The method according to claim 24 , wherein said physically attached water is removed by subjecting the surface to vacuum.
31 . The method according to claim 24 , wherein said physically attached water is removed by washing the surface with a solvent.
32 . The method according to claim 31 , wherein the solvent is water miscible.
33 . The method according to claim 32 , wherein the water miscible solvent is acetone.
34 . The method according to claim 13 , wherein the contacting comprises exposing the ceramic surface to a silane that is either a neat liquid or in the form of a solution or vapor for a time ranging between about 1 min. and about 60 min.
35 . The method according to claim 34 , wherein the silane is in the form of a neat liquid.
36 . The method according to claim 34 , wherein the silane is in the form of an ethanol solution having a concentration of silane between about 5 wt % and about 100 wt %.
37 . The method according to claim 13 , wherein the heating comprises exposing the ceramic surface and silane to a temperature between about room temperature and about 800° C. for a time between about 10 min. and about 90 min.
38 . The method according to claim 37 , wherein the heating comprises exposing the ceramic surface and silane to a temperature between about 200° C. and about 500° C.
39 . The method according to claim 37 , wherein the heating comprises exposing the ceramic surface and silane to said temperature for a time between about 10 min. and about 30 min.
40 . The method according to claim 13 , wherein the ceramic surface exhibits a contact angle with an aqueous solution that increases from about 15-20 degrees prior to modifying to about 80-90 degrees after modifying.
41 . A ceramic material comprising a surface that has been treated by polishing the surface with an abrasive under conditions sufficient to decrease the wettability of the ceramic surface by aqueous solutions.
42 . The ceramic material according to claim 41 , wherein the ceramic surface comprises alumina.
43 . A ceramic article made from the ceramic material of claim 41 .
44 . The ceramic article of claim 43 , which is selected from the group consisting of an IEF gel strip holder, a gel support, and a microarray plate.
45 . A ceramic material comprising a surface that has been treated by contacting the ceramic surface with a silane and heating for a sufficient time at a sufficient temperature to decrease the wettability of the ceramic surface by aqueous solutions.
46 . The ceramic material according to claim 45 , wherein the ceramic surface comprises alumina.
47 . A ceramic article made from the ceramic material of claim 45 .
48 . The ceramic article of claim 47 , which is selected from the group consisting of an IEF gel strip holder, a gel support, and a microarray plate.
49 . A sample holder for chemical analysis, comprising a ceramic surface having a contact angle of greater than about 40 with an aqueous solution comprising about 6 to about 9.8 M urea.
50 . The sample holder of claim 49 , which is adapted to hold a gel strip for isoelectric focusing.
51 . The sample holder of claim 49 , which is adapted to hold an electrophoresis gel.
52 . The sample holder of claim 49 , which is a multiwell microarray plate.Join the waitlist — get patent alerts
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