Microelectronic contact structures, and methods of making same

Abstract

Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a “post” component, a “beam” component, and a “tip” component. The resulting contact structure, mounted to an electronic component, is useful for making an electrical connection with another electronic component. The post component can be fabricated on a sacrificial substrate, joined to the electronic component and its sacrificial substrate removed. Alternatively, the post component can be formed on the electronic component. The beam and tip components can each be fabricated on a sacrificial substrate. The beam component is joined to the post component and its sacrificial substrate is removed, and the tip component is joined to the beam component and its sacrificial substrate is removed.

What is claimed is:  
     
         1 . In combination with an electronic component, a contact structure, comprising: 
 a post component;    a beam component joined to the post component; and    a tip component joined to the beam component.    
     
     
         2 . A contact structure, according to  claim 1 , wherein: 
 the beam component is elongate, has a one end and an opposite end;    the post component is joined to the one end of the beam component; and    the tip component is joined to the opposite end of the beam component.    
     
     
         3 . A contact structure, according to  claim 1 , wherein: 
 the beam component has a one surface and an opposite surface;    the post component is joined to the one surface of the beam component; and    the tip component is joined to the opposite surface of the beam component.    
     
     
         4 . A contact structure, according to  claim 1 , wherein: 
 the beam component is elongate, has a one end, has an opposite end, has a one surface and has an opposite surface;    the post component is joined to the one end and to the one surface of the beam component; and    the tip component is joined to the opposite end and to the opposite surface of the beam component.    
     
     
         5 . A contact structure, according to  claim 1 , wherein: 
 the post component is joined to an electronic component.    
     
     
         6 . A contact structure, according to  claim 1 , further comprising an electronic component with a terminal, wherein: 
 the post component is joined to a terminal of the electronic component.    
     
     
         7 . A contact structure, according to  claim 1 , further comprising an electronic component wherein: 
 the post component is built up upon the electronic component.    
     
     
         8 . A contact structure, according to  claim 1 , further comprising an electronic component with a terminal, wherein: 
 the post component is built up upon a terminal of the electronic component.    
     
     
         9 . A contact structure, according to  claim 1 , wherein: 
 the contact structure is a spring contact element.    
     
     
         10 . An electronic component, according to  claim 1 , further comprising a second contact structure according to  claim 1  mounted thereon, wherein: 
 a spacing between the tip components of the two contact structures is different than a spacing between the post components of the two contact structures.  
 
     
     
         11 . An electronic component, according to  claim 1 , further comprising a second contact structure according to  claim 1  mounted thereon, wherein: 
 the beam component of a one of the two contact structures is disposed at a different height from a surface of the electronic component than the beam component of another of the two contact structures.  
 
     
     
         12 . A method of mounting a microelectronic contact structure to an electronic component, comprising: 
 providing a post component on an electronic component;    fabricating a beam component;    fabricating a tip component;    joining the beam component to the post component; and    joining the tip component to the beam component.    
     
     
         13 . Method, according to  claim 12 , further comprising providing the post component on the electronic component by: 
 fabricating a the post component on a sacrificial substrate;    joining the post component to the electronic component; and    removing the sacrificial substrate.    
     
     
         14 . Method, according to  claim 12 , wherein: 
 the beam component is fabricated on a sacrificial substrate; and    further comprising joining the beam component to the post component by:    joining the beam component to the post component; and    removing the sacrificial substrate.    
     
     
         15 . Method, according to  claim 12 , wherein: 
 the tip component is fabricated on a sacrificial substrate; and    further comprising joining the tip component to the beam component by:    joining the tip component to the beam component; and    removing the sacrificial substrate.    
     
     
         16 . Method, according to  claim 12 , wherein: 
 the post component is built up upon the electronic component.    
     
     
         17 . Method, according to  claim 12 , wherein: 
 the beam component is elongate, has a one end and an opposite end;    joining the post component to the one end of the beam component; and    joining the tip component to the opposite end of the beam component.    
     
     
         18 . Method, according to  claim 12 , wherein: 
 the beam component has a one surface and an opposite surface;    joining the post component to the one surface of the beam component; and    joining the tip component to the opposite surface of the beam component.    
     
     
         19 . Method, according to  claim 12 , wherein: 
 the beam component is elongate, has a one end, has an opposite end, has a one surface and has an opposite surface;    joining the post component to the one end and to the one surface of the beam component; and    joining the tip component to the opposite end and to the opposite surface of the beam component.    
     
     
         20 . Method of mounting two microelectronic contact structures to an electronic component, comprising, for each microelectronic contact structure: 
 providing a post component on an electronic component;    fabricating a beam component;    fabricating a tip component;    joining the beam component to the post component; and    joining the tip component to the beam component;    further comprising: 
 disposing the beam of a one of the two microelectronic contact structures at a different height from a surface of the electronic component than the beam component of another of the two microelectronic contact structures.