US2004071989A1PendingUtilityA1
Insulating sheet, hard disk device and manufacturing method for insulating sheet
Est. expiryMar 2, 2021(expired)· nominal 20-yr term from priority
Inventors:Masayuki Kumakura
B32B 7/12Y10T156/1085G11B 33/08G11B 23/0316Y10T428/31667Y10T156/1075B32B 2457/04G11B 25/043G11B 23/0326Y10T29/49032B32B 2266/0278B32B 27/065Y10T29/4903B32B 37/00B32B 27/36B32B 2307/206
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Claims
Abstract
An insulating sheet 13 is manufactured by attaching a buffer layer 21 and a resin film 23 using an adhesive layer 8 that is not adhesive at a normal ambient temperature. Since there is no need to use a release liner when manufacturing the insulating sheet 13, there is no release of a silicone component. Accordingly, when installing a hard disk printed wiring board, the printed wiring board and electronic circuits inside the hard disk will not be damaged by the released silicone.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An insulating sheet comprising:
a buffer layer having buffering attributes; an adhesive layer that is not adhesive at normal ambient temperature but exhibits adhesiveness when heated; and an insulating resin film, wherein the buffer layer and the resin film are attached together by the adhesive layer.
2 . The insulating sheet according to claim 1 , wherein the adhesive layer is formed of resin that does not contain a silicone component.
3 . The insulating sheet according to claim 1 , wherein the resin film is formed from polyethylene terephthalate.
4 . The insulating sheet according to claim 1 , wherein the buffer layer is formed of urethane foam.
5 . A hard disk device comprising:
a case for housing a hard disk; a printed wiring board provided with a circuit for controlling the hard disk; and an insulating sheet interposed between the printed wiring board and the case, wherein the insulating sheet comprises
a buffer layer having buffering attributes,
an adhesive layer that is not adhesive at normal ambient temperature but exhibits adhesiveness when heated, and
an insulating resin film, wherein the buffer layer and the resin film layer are attached together by the adhesive layer.
6 . The hard disk device according to claim 5 , wherein the adhesive layer is formed of resin that does not contain a silicone component.
7 . The hard disk device according to claim 5 , wherein the resin film is formed from polyethylene terephthalate.
8 . The hard disk device according to claim 5 , wherein the buffer layer is formed of urethane foam.
9 . A method of manufacturing an insulating sheet, comprising the steps of:
bringing a sheet into contact with a buffer layer having buffering attributes, wherein the sheet comprises an insulating resin film and an adhesive layer attached to the insulating resin film, wherein the adhesive layer has a property of exhibiting adhesiveness when heated; and heating the adhesive layer while pressing against the buffer layer; thereby attaching the resin film to the buffer layer with the adhesive layer.Join the waitlist — get patent alerts
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