Method and a device for producing an adhesive surface on a substrate

Abstract

A method and a device for producing an adhesive surface on a substrate which can be bonded to another substrate. In an implementation, the technique includes treating the surface of the substrate by wet chemical etching to remove an oxide layer and to provide a hydrophobic surface, and exposing the etched hydrophobic surface to a gaseous ozone atmosphere to provide a dry hydrophilic surface. A device for producing an adhesive surface on a substrate according to an implementation includes a bath with an etchant for removing an oxide layer from the surface of the substrate and to produce a hydrophobic surface, and a container having an inner volume that surrounds the bath. The inner volume also includes a gaseous ozone atmosphere to produce a dry hydrophilic surface.

What is claimed is:  
     
         1 . A method for producing an adhesive surface on a substrate which can be bonded to another substrate comprising: 
 treating the surface by wet chemical etching to remove an oxide layer and to provide a hydrophobic surface; and    exposing the etched hydrophobic surface to a gaseous ozone atmosphere to provide a dry hydrophilic surface.    
     
     
         2 . The method according to  claim 1  wherein the wet chemical etching includes an aqueous hydrofluoric acid solution (HF) as an etchant.  
     
     
         3 . The method according to  claim 1  further comprising the wet chemical etching includes an etchant that includes hydrofluoric acid (HF), ammonium fluoride (NH 4 F) and water.  
     
     
         4 . The method according to  claim 1  wherein the duration of wet chemical etching is in the range of about 5 seconds to about 30 minutes.  
     
     
         5 . The method according to  claim 1  wherein the temperature of wet chemical etching is in the range of between about room temperature to about 80° C.  
     
     
         6 . The method according to  claim 1  wherein etching comprises immersing the substrate into a bath and wherein exposing the etched surface comprises removing the substrate from the bath to contact a gaseous ozone atmosphere of a container volume.  
     
     
         7 . A device for producing an adhesive surface on a substrate which can be bonded to another substrate comprising: 
 a bath with an etchant for removing an oxide layer from the surface of the substrate and to produce a hydrophobic surface; and    a container having an inner volume that encompasses the bath, the inner volume also including a gaseous ozone atmosphere to produce a dry hydrophilic surface.    
     
     
         8 . The device according to  claim 7 , wherein the container is sealed.  
     
     
         9 . The device according to  claim 8  further comprising an ozone generator coupled to the sealed container.  
     
     
         10 . The device according to  claim 7  further comprising at least one of a wafer holder, a sensor associated with the bath, a heating element coupled to the bath, and an outlet coupled to the container.