Reaction plate

Abstract

A reaction plate ( 10 ) comprising a welded plastics planar laminate consisting of an aperture plate ( 12 ) and a film ( 22 ), the aperture plate ( 12 ) having at least one planar surface and a plurality of apertures ( 14 ) in the planar surface of the apertured plate ( 12 ) and the film ( 22 ) being attached to the planar surface of the apertured plate ( 12 ) around the or each aperture ( 14 ) by welding. A method of forming such reaction plates ( 10 ) using diode laser welding. An apparatus for handling such reaction plates ( 10 ) including performing polymerase chain reactions (PCRs) or primer extensions therewith. The welding is preferably laser or transmission welding.

1 . A method of forming a seal around a reaction plate or wells of reaction plates comprising the step of attaching a plastics film to the plate over the plate or the wells using transmission laser welding to form the seal.  
     
     
         2 . The method of  claim 1  wherein the reaction plate thereby comprises a welded plastics planar laminate consisting of an apertured plate and a film, the apertured plate having at least one planar surface and a plurality of apertures in the planar surface of the apertured plate, the film having been attached to the planar surface of the apertured plate around the or each aperture by the laser welding.  
     
     
         3 . The method of clam  2 , wherein the film covers one or all the apertures, extending over the entire planar surface of the apertured plate.  
     
     
         4 . The method of  claim 2  or  3 , wherein the or each aperture extends from a first planar surface of the apertured plate to a second, opposed planar surface.  
     
     
         5 . The method of  claim 4 , wherein a second is welded to the second surface.  
     
     
         6 . The method of  claim 5 , wherein both films are transmission laser welded to the apertured plate.  
     
     
         7 . The method of any one of the preceding claims, wherein channels or grooves, in particular surface grooves or micro lanes, are provided in the plate.  
     
     
         8 . The method of any one of the preceding claims, wherein the welding is near-infrared diode laser welding.  
     
     
         9 . The method of any one of the preceding claims, wherein the film is optically clear with minimal cross talk.  
     
     
         10 . The method of any of the preceding claims, wherein the film has a thickness of between 1 and 500 micrometers.  
     
     
         11 . The method of any one of the preceding claims, wherein the plate is substantially rigid and opaque, and made of a plastics material.  
     
     
         12 . The method of any one of the preceding claims, wherein the plate is near-infrared absorbent.  
     
     
         13 . The method of  claim 12 , wherein the plate is black.  
     
     
         14 . The method of any one  claims 1  to  11 , wherein the plate is non near-infrared absorbent.  
     
     
         15 . The method of any one of the preceding claims, wherein the film is near-infrared absorbent.  
     
     
         16 . The method of any one of the preceding claims, wherein one or more reagent and sample is retained within an aperture in the plate by the film or films.  
     
     
         17 . The method of any one of the preceding claims, wherein the film is readily pierceable.  
     
     
         18 . The method of any one of the preceding claims, wherein the film is coated with an affinity reagent.  
     
     
         19 . The method of  claim 18 , wherein the affinity reagent is streptavidin.  
     
     
         20 . The method of any one of the preceding claims, wherein the film is coated with a chemical used in a reaction for which the reaction plate is to be used.  
     
     
         21 . An automated reaction plate processing apparatus for automated processing of a reaction plate, the apparatus incorporating means to carry out the method of any one of the preceding claims.  
     
     
         22 . The apparatus of  claim 21 , the plate already having a first film applied thereto and reagents and/or samples in apertures in the plates.  
     
     
         23 . The apparatus of  claim 21 , further comprising means for filing wells or apertures in the plates at least partially with a reagent and/or a sample.  
     
     
         24 . The apparatus of  claim 21 ,  22  or  23 , comprising one or more diode laser welding units for welding the films to the plates.  
     
     
         25 . The apparatus of any one of the  claims 21  to  24 , comprising an injection moulding unit for forming aperture plates.