US2004065436A1PendingUtilityA1
System and method for monitoring a packer in a well
Priority: Oct 3, 2002Filed: Oct 3, 2002Published: Apr 8, 2004
Est. expiryOct 3, 2022(expired)· nominal 20-yr term from priority
E21B 47/00E21B 33/1208
32
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Claims
Abstract
A system and method for monitoring the compression or deformation of a packer element in a well, according to which at least one member is associated with the packer element and changes its physical state in response to the compression, and the change in the physical state of the member is quantified.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A packer system comprising:
a packer element adapted to be deformed into sealing engagement with a wellbore; a member associated with the packer element wherein the member is capable of changing its physical state in response to the deformation; and a circuit associated with the member for quantifying the change in physical state.
2 . The packer system of claim 1 wherein the member is embedded in the packer element.
3 . The packer system of claim 1 wherein the member is an optical fiber that transmits light wherein the light intensity changes in response to strain on the optical fiber caused by the deformation.
4 . The packer system of claim 3 wherein changes in the light intensity causes changes in current flow in the circuit to enable the strain on the optical fiber to be quantified.
5 . The packer system of claim 1 further comprising two tubular members between which the packer element extends so that relative movement of the tubular members causes the deformation of the packer element.
6 . The packer system of claim 5 wherein a portion of the circuit is embedded in the packer element and a portion of the circuit is disposed in one of the tubular members.
7 . The packer system of claim 1 wherein the member is a conductive polymer that changes in electrical resistance in response to strain on the conductive polymer caused by the deformation.
8 . The packer system of claim 7 wherein the conductive polymer is in the form of graphite or powdered metal doped silicon.
9 . The packer system of claim 7 wherein changes in the electrical resistance causes changes in current flow in the circuit to enable the strain on the conductive polymer to be quantified.
10 . The packer system of claim 7 wherein the conductive polymer is embedded in the packer element.
11 . The packer system of claim 7 further comprising two tubular members between which the packer element extends so that relative movement of the tubular members causes the deformation of the packer element.
12 . The packer system of claim 11 wherein a portion of the circuit is embedded in the packer element and a portion of the circuit is disposed in one of the tubular members.
13 . The packer system of claim 1 wherein the packer element is deformed by compression.
14 . The packer system of claim 1 wherein the circuit is an electrical circuit.
15 . The packer system of claim 14 wherein a portion of the circuit is embedded in the packer element.
16 . A method for monitoring a packer element in a wellbore, the method comprising the steps of:
deforming the packer element; providing a member associated with the packer element wherein the member changes its physical state in response to the deformation; and quantifying the change in the physical state of the member.
17 . The method of claim 16 further comprising the step of transmitting light through the member wherein the light intensity changes in response to strain on the member caused by the deformation.
18 . The method of claim 17 wherein the step of quantifying comprises the step of changing current flow in a circuit in response to changes in the light intensity.
19 . The method of claim 18 further comprising the steps of:
disposing the packer element between two tubular members; and
moving the tubular members relative to each other to cause the deformation of the packer element.
20 . The method of claim 19 further comprising the steps of:
embedding a portion of the circuit in the packer element; and
disposing a portion of the circuit in one of the tubular members.
21 . The method of claim 16 further comprising the step of embedding the member in the packer element.
22 . The method of claim 16 wherein the member changes in electrical resistance in response to changes in the strain on the member caused by the deformation.
23 . The method of claim 22 wherein the member is in the form of a conductive polymer in the form of graphite or powdered metal doped silicon.
24 . The method of claim 22 further comprising the step of passing current through the member wherein the current flow varies in response to strain on the member caused by the deformation.
25 . The method of claim 24 wherein the step of quantifying comprises monitoring the current flow.
26 . The method of claim 16 further comprising the step of embedding the member in the packer element.
27 . The method of claim 16 further comprising the steps of:
disposing the packer element between two tubular members; and
moving the tubular members relative to each other to cause deformation of the packer element.
28 . The method of claim 27 further comprising the steps of:
embedding a portion of the circuit in the packer element; and
disposing a portion of the circuit in one of the tubular members.
29 . The method of claim 16 wherein the packer element is deformed by compression.
30 . The method of claim 16 wherein the step of quantifying includes providing an electrical circuit having current flow that changes in response to changes in the physical state of the member.Join the waitlist — get patent alerts
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