US2004065111A1PendingUtilityA1
Field replaceable packaged refrigeration module with thermosyphon for cooling electronic components
Est. expiryOct 8, 2022(expired)· nominal 20-yr term from priority
Inventors:Ali Monfarad
F25B 1/02F25B 1/04F25B 39/022F25B 2500/01F25B 23/006F25B 25/005F25B 2400/21F25B 1/00H05K 7/20354F25B 2500/17F25B 2400/073
33
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Claims
Abstract
A field and/or customer replaceable packaged refrigeration module with thermosyphon is suitable for use in standard electronic component environments. The field replaceable packaged refrigeration module portion is self-contained and is specifically designed to have physical dimensions similar to those of a standard air-based cooling system, such as a fined heat sink or heat pipe. The field replaceable packaged refrigeration module is coupled to a thermosyphon and serves to lower the base temperature of the thermosyphon sub-system, thereby allowing intermittent operation of the field replaceable packaged refrigeration module with the thermosyphon sub-system.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A packaged refrigeration module with thermosyphon for cooling electronic components, said packaged refrigeration module with thermosyphon comprising:
a packaged refrigeration module, said packaged refrigeration module comprising:
a packaged refrigeration module housing;
refrigerant;
a compressor;
a condenser; and
an expansion device; wherein,
said compressor, said condenser, and said expansion device are coupled together in a refrigeration loop within said packaged refrigeration module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration module is a self-contained module; and a thermosyphon, said thermosyphon being operatively coupled to said packaged refrigeration module refrigeration loop.
2 . The packaged refrigeration module with thermosyphon of claim 1; wherein,
said packaged refrigeration module has a width of approximately 4 inches, a length of approximately 5 inches and a height of approximately 1.75 inches.
3 . The packaged refrigeration module with thermosyphon of claim 1; wherein,
said compressor is a single piston linear compressor.
4 . The packaged refrigeration module with thermosyphon of claim 1; wherein,
said compressor is a dual-piston linear compressor.
5 . The packaged refrigeration module with thermosyphon of claim 1; wherein,
said compressor is a multi-piston linear compressor.
6 . The packaged refrigeration module with thermosyphon of claim 1; wherein,
said compressor is a rotary compressor.
7 . The packaged refrigeration module with thermosyphon of claim 1; wherein,
said compressor is a reciprocating compressor.
8 . The packaged refrigeration module with thermosyphon of claim 1; wherein,
said compressor is a rolling piston compressor.
9 . The packaged refrigeration module with thermosyphon of claim 1; wherein,
said compressor is a rotary vane compressor.
10 . The packaged refrigeration module with thermosyphon of claim 1; wherein,
said compressor is a screw compressor.
11 . The packaged refrigeration module with thermosyphon of claim 1; wherein,
said compressor is a swash-plate compressor.
12 . The packaged refrigeration module with thermosyphon of claim 1; wherein,
said compressor is a scroll compressor.
13 . A circuit board, said circuit board comprising:
at least one electronic component; a packaged refrigeration module for cooling said electronic component, said packaged refrigeration module comprising:
a packaged refrigeration module housing;
refrigerant;
a compressor;
a condenser;
an expansion device; wherein,
said compressor, said condenser and said expansion device are coupled together in a refrigeration loop within said packaged refrigeration module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration module is a self-contained module; and a thermosyphon, said thermosyphon being operatively coupled to said packaged refrigeration module refrigeration loop; wherein, said thermosyphon includes a thermosyphon evaporator cold-plate, said thermosyphon evaporator cold-plate being mounted directly over a first surface of said electronic component.
14 . The circuit board of claim 13; wherein,
said packaged refrigeration module has a width of approximately 4 inches, a length of approximately 5 inches and a height of approximately 1.75 inches
15 . The circuit board of claim 13; wherein,
said compressor is a single piston linear compressor.
16 . The circuit board of claim 13; wherein,
said compressor is a dual-piston linear compressor.
17 . The circuit board of claim 13; wherein,
said compressor is a multi-piston linear compressor.
18 . The circuit board of claim 13; wherein,
said compressor is a rotary compressor.
19 . The circuit board of claim 13; wherein,
said compressor is a reciprocating compressor.
20 . The circuit board of claim 13; wherein,
said compressor is a rolling piston compressor.
21 . The circuit board of claim 13; wherein,
said compressor is a rotary vane compressor.
22 . The circuit board of claim 13; wherein,
said compressor is a screw compressor.
23 . The circuit board of claim 13; wherein,
said compressor is a swash-plate compressor.
24 . The circuit board of claim 13; wherein,
said compressor is a scroll compressor.
25 . The circuit board of claim 13; wherein,
said electronic component is an integrated circuit.
26 . The circuit board of claim 13; wherein,
said electronic component is a microprocessor.
27 . An electronic system, said electronic system comprising:
a rack unit, said rack unit comprising:
at least one electronic component;
a packaged refrigeration module, said packaged refrigeration module comprising:
a packaged refrigeration module housing;
refrigerant;
a compressor;
a condenser;
an expansion device; wherein,
said compressor, said condenser, and said expansion device are coupled together in a refrigeration loop within said packaged refrigeration module housing and said refrigerant is contained within said refrigeration loop such that said packaged refrigeration module is a self-contained module; and a thermosyphon, said thermosyphon being operatively coupled to said packaged refrigeration module refrigeration loop; wherein, said thermosyphon includes a thermosyphon evaporator cold-plate, said thermosyphon evaporator cold-plate mounted directly over a first surface of said electronic component.
28 . The electronic system of claim 27; wherein,
said packaged refrigeration module has a width of approximately 4 inches, a length of approximately 5 inches and a height of approximately 1.75 inches.
29 . The electronic system of claim 27; wherein,
said compressor is a single piston linear compressor.
30 . The electronic system of claim 27; wherein,
said compressor is a dual-piston linear compressor.
31 . The electronic system of claim 27; wherein,
said compressor is a multi-piston linear compressor.
32 . The electronic system of claim 27; wherein,
said compressor is a rotary compressor.
33 . The electronic system of claim 27; wherein,
said compressor is a reciprocating compressor.
34 . The electronic system of claim 27; wherein,
said compressor is a rolling piston compressor.
35 . The electronic system of claim 27; wherein,
said compressor is a rotary vane compressor.
36 . The electronic system of claim 27; wherein,
said compressor is a screw compressor.
37 . The electronic system of claim 27; wherein,
said compressor is a swash-plate compressor.
38 . The electronic system of claim 27; wherein,
said compressor is a scroll compressor.
39 . The electronic system of claim 27; wherein,
said electronic component is an integrated circuit.
40 . The electronic system of claim 27; wherein,
said electronic component is a microprocessor.Join the waitlist — get patent alerts
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