Semiconductor device and method for manufacturing the same

Abstract

In a stacked package in which semiconductor chips are stacked in layers, in order to mount the semiconductor chips without damaging the semiconductor chips even when an upper semiconductor chip has a greater size, a first chip 12 is mounted on an interposer substrate 11 . A second chip 13 having a larger size than that of the first chip 12 is mounted on the rear surface of the first chip 12 . The second chip 13 is wire-bonded with respect to the interposer substrate 11 by wires 15 . A base member 17 is disposed outside the first chip 12 . The first chip 12 , the second chip 13 and the base member 17 are molded by a sealing resin 16 . Solder balls 18 are provided on the opposite side of the chip-mounting side of the interposer substrate 11.

Scope of claimed invention:  
     
         1 . A method for manufacturing a semiconductor device, the method comprising the steps of: 
 mounting a first semiconductor chip on a substrate;    mounting a base member outside the first semiconductor chip on the substrate; and    mounting a second semiconductor chip that is larger than the first semiconductor chip on the first semiconductor chip, in a manner that the second semiconductor chip is supported by the base member.    
     
     
         2 . A method for manufacturing a semiconductor device, the method comprising the steps of: 
 mounting a first semiconductor chip on a substrate,    mounting a second semiconductor chip that is larger than the first semiconductor chip on the first semiconductor chip; and    providing a filler layer in a manner to support the second semiconductor chip.    
     
     
         3 . A method of manufacturing a semiconductor device comprising: 
 disposing a first semiconductor chip on a substrate;    disposing a base member on said substrate;    disposing a second semiconductor chip on said first semiconductor chip; and    wire-bonding said second semiconductor chip to said interposer substrate,    wherein said second semiconductor chip is larger than said first semiconductor chip such that edges of said second semiconductor chip extending beyond said first semiconductor chip are supported by said base member.    
     
     
         4 . A method of manufacturing a semiconductor chip according to  claim 3 , wherein said base member is disposed in a frame shape surrounding said first semiconductor chip.  
     
     
         5 . A method of manufacturing a semiconductor chip according to  claim 3 , wherein said base member is disposed as a column-like member.