Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

Abstract

A semiconductor multi-package module having stacked second and first packages, each package including a die attached to a substrate, in which the first and second package substrates are interconnected by wire bonding, and in which the first package is a flip chip ball grid array package in a die-up configuration. Also, a method for making a semiconductor multi-package module, by providing a first package including a first package substrate and having a die-up flip chip configuration, affixing a second package including a second package substrate an upper surface of the first package, and forming z-interconnects between the first and second package substrates.

I claim:  
     
         1 . A multi-package module comprising stacked first and second packages, each said package including a die attached to a substrate, wherein the first and second substrates are interconnected by wire bonding, and wherein the first package comprises a flip-chip ball grid array package having a flip-chip in a die-up configuration.  
     
     
         2 . The multi-package module of  claim 1  wherein the second package is a wire bonded land grid array package.  
     
     
         3 . The multi-package module of  claim 2  wherein the die and wire binds in the second package are fully encapsulated with a molding material.  
     
     
         4 . The multi-package module of  claim 2  wherein the second package is peripherally encapsulated to an extent sufficient to cover the wire bonds between the die and the substrate.  
     
     
         5 . The multi-package module of  claim 2  wherein the second package substrate is a single-metal layer substrate.  
     
     
         6 . The multi-package module of  claim 1  wherein the flip chip package is provided with an electrical shield.  
     
     
         7 . The multi-package module of  claim 6  wherein the electrical shield is configured to serve as a heat spreader.  
     
     
         8 . The multi-package module of  claim 1  wherein the flip chip package includes an RF die.  
     
     
         9 . The multi-package module of  claim 6  wherein the flip chip package includes an RF die, and the shield serves to limit electromagnetic interference between the RF die and other die in the multi-package module.  
     
     
         10 . The multi-package module of  claim 1  wherein the first package is provided with an electrical shield.  
     
     
         11 . The multi-package module of  claim 1  wherein the second package is a stacked die package.  
     
     
         12 . The multi-package module of  claim 11  wherein adjacent stacked die in the stacked die package are separated by spacers.  
     
     
         13 . The multi-package module of  claim 1  wherein the second package is stacked over the first package, and wherein the flip-chip die on the first package is, provided with an electrical shield.  
     
     
         14 . The multi-package module of  claim 1  wherein the first package substrate includes an embedded ground plane.  
     
     
         15 . The multi-package module of  claim 14 , the ground plane, being configured to serve for heat dissipation.  
     
     
         16 . The multi-package module of  claim 14 , the ground plane being configured to serve as an electrical shield.  
     
     
         17 . The multi-package module of  claim 1  wherein at least one of the first and the second package is a stacked-die package.  
     
     
         18 . The multi-package module of  claim 1  wherein the second package is a stacked-die package.  
     
     
         19 . The multi-package module of  claim 1 , further comprising a heat shield.  
     
     
         20 . A method for making a multi-package module, comprising 
 providing a die-up flip chip first package including a first package substrate,    providing a second package including a die and a second package substrate,    stacking the second package over the first package, and    electrically interconnecting the first and second packages by wire bonds connecting the first package substrate and the second package substrate.    
     
     
         21 . The method of  claim 20  wherein providing a die-up flip chip first package comprises providing an unsingulated strip of die-up flip chip first packages.  
     
     
         22 . The method of  claim 20  wherein providing a die-up flip chip first package comprises testing die-up flip chip packages for a performance and reliability requirement, and selecting a package meeting the said requirement as a said first package.  
     
     
         23 . The method of  claim 20  wherein providing a second package comprises testing packages for a performance and reliability requirement, and selecting a package meeting the said requirement as a said second package.  
     
     
         24 . The method of  claim 20  wherein providing a second package comprises providing a land grid array package.  
     
     
         25 . The method of  claim 20  wherein stacking the second package over the first package comprises affixing the second package onto a surface of the first package substrate.  
     
     
         26 . The method of  claim 25  wherein affixing the second package onto a surface of the first package substrate comprises applying an adhesive onto a die attach area of the first package surface substrate and contacting the second package with the adhesive.  
     
     
         27 . The method of  claim 26  wherein applying the adhesive comprises applying a curable adhesive, and further comprising curing the adhesive.  
     
     
         28 . The method of  claim 20 , further comprising attaching second-level interconnect balls onto the first substrate.  
     
     
         29 . The method of  claim 20 , further comprising encapsulating features over the first substrate with a molding compound.  
     
     
         30 . The method of  claim 21 , further comprising singulating the completed module from the strip.  
     
     
         31 . The method of  claim 20 , further comprising providing the first package with an electromagnetic shield.  
     
     
         32 . The method of  claim 20 , further comprising providing the module with a heat spreader.  
     
     
         33 . The method of  claim 32  wherein providing the module with a heat spreader comprises performing a drop-in molding operation.  
     
     
         34 . The method of  claim 32  wherein providing the module with a heat spreader comprises affixing a generally planar heat spreader onto an upper surface of the second package.  
     
     
         35 . A mobile communications device comprising a multi-package module according to  claim 1 .  
     
     
         36 . A computer comprising a multi-package module according to  claim 1.