Floor covering for covering removable floor panels, floor construction with floor covering, and method for production of the floor covering

Abstract

There is described a floor covering ( 6 ) for covering removable floor panels ( 1 ), especially of raised floors. To minimize laying costs, there is uniformly applied on the underside of the floor covering ( 6 ) a conductive fixing adhesive ( 2 ) that has been air-cured to ready-to-lay condition and that is protected externally against drying out by a backing film ( 7 ).

1 . A floor covering ( 6 ) for covering removable floor panels ( 1 ), especially of raised floors, characterized in that there is uniformly applied on the underside of the floor covering ( 6 ) a conductive fixing adhesive ( 2 ) that has been air-cured to ready-to-lay condition and that is protected externally against drying out by a backing film ( 7 ).  
     
     
         2 . A floor covering ( 6 ) according to  claim 2 , characterized in that an acrylate dispersion containing an electrically conductive additive is used as the fixing adhesive ( 7 ).  
     
     
         3 . A floor covering ( 6 ) according to  claim 1  or  2 , in the form of a floor-covering roll ( 6   a ).  
     
     
         4 . A floor covering ( 6 ) according to one of  claims 1  to  3 , in the form of floor-covering tiles ( 6   b ).  
     
     
         5 . A floor construction, especially a raised floor, in which a floor covering ( 6 ) according to one of  claims 1  to  4  is laid on a layer of floor panels ( 1 ) disposed flush with one another.  
     
     
         6 . A floor construction according to  claim 5 , characterized in that the floor covering ( 6 ) overlaps the butt joints ( 3 ) between the floor panels ( 1 ) laid flush with one another.  
     
     
         7 . A floor construction according to  claim 5  or  6  with floor-covering tiles ( 6   b ) according to  claim 3 , characterized in that the floor covering ( 6   b ) has a size different from that of the floor panels ( 1 ).  
     
     
         8 . A floor construction according to one of  claims 5  to  7 , characterized in that the adhesion of the fixing adhesive ( 2 ) to the floor covering ( 6 ) is stronger than to the floor panels ( 1 ).  
     
     
         9 . A floor construction according to one of  claims 5  to  8 , characterized in that the floor panels ( 1 ) are finished with a smooth surface on the upper side.  
     
     
         10 . A floor construction according to one of  claims 5  to  9 , characterized in that the floor panels ( 1 ) are finished with a smooth coating on the upper side.  
     
     
         11 . A floor construction according to one of  claims 5  to  10 , characterized in that the floor panels (l) are finished with an impregnation on the upper side.  
     
     
         12 . A method for production of a floor covering ( 6 ) according to one of  claims 1  to  3 , characterized in that it comprises the following process steps: 
 application of a conductive fixing adhesive ( 2 ) onto the floor covering ( 6 ),  
 air-curing of the floor covering ( 6 ) provided with the conductive fixing adhesive ( 2 ), the air-curing time (TL) being chosen such that the adhesive ( 2 ) sets sufficiently that the natural cohesion is stronger than the force of adhesion to a backing film ( 7 ) to be subsequently applied,  
 protection of the conductive fixing adhesive ( 2 ) with the backing film ( 7 ), which can be peeled off without residues.  
 
     
     
         13 . A method according to  claim 12  for production of a floor covering ( 6 ) according to  claim 3 , characterized in that the floor covering ( 6 ) is then rolled up and packaged as commercial floor-covering rolls ( 6   a ).  
     
     
         14 . A method according to  claim 12  for production of a floor covering ( 6 ) according to  claim 4 , characterized in that the floor-covering tiles ( 6   b ) are subsequently punched out of the floor covering ( 6 ).