Thin type camera module

Abstract

A thin type camera module includes a fixing board, an imaging-sensing semiconductor assembly, and a lens holder. The image-sensing semiconductor assembly is manufacture by a chip-on-film (COF) packaging method. The image-sensing semiconductor assembly comprises an image sensing chip and a COF wiring film, wherein the image sensing chip is flip-chip mounted on the COF wiring film. A photosensitive surface of the image sensing chip is corresponding to a window of the COF wiring film and disposed toward a light-pervious channel of the lens holder. The lens holder is connected with the fixing board to form an airtight space for sealing the image sensing chip. The COF wiring film has a module circuit for mounting an electrical device.

What is claimed is:  
     
         1 . A thin type camera module comprising: 
 a fixing board;    an imaging-sensing semiconductor assembly comprising a COF (chip-on film) wiring film and an image sensing chip, wherein the COF wiring film has a surface, a window and a plurality of connecting ends disposed on the surface of the COF wiring film around the window, the image sensing chip has a photosensitive surface corresponding to the window, and a plurality of bumps are formed on peripherals of the photosensitive surface, the image sensing chip is flip-chip mounted on the COF wiring film to electrically connect the bumps with the connecting ends; and    a lens holder for connecting a camera lens, wherein the lens holder has a light-pervious channel and is connected with the fixing board to form a airtight space for sealing the image sensing chip, and the photosensitive surface of the image sensing chip is corresponding to the light-pervious channel for capturing image.    
     
     
         2 . The thin type camera module in accordance with  claim 1 , further comprising at least an electric device electrically connected with the COF wiring film.  
     
     
         3 . The thin type camera module in accordance with  claim 2 , wherein the electric device is a passive component.  
     
     
         4 . The thin type camera module in accordance with  claim 2 , wherein the COF wiring film formed a module circuit electrically connecting the electric device.  
     
     
         5 . The thin type camera module in accordance with  claim 4 , wherein the module circuit is formed on an extending surface of the COF wiring film without being covered by the lens holder.  
     
     
         6 . The thin type camera module in accordance with  claim 1 , further comporising a sealant layer is formed around the window of the COF wiring film for enclosing the bumps of the image sensing chip.  
     
     
         7 . The thin type camera module in accordance with  claim 6 , wherein the sealant layer is an anisotropic conductive film (ACF).  
     
     
         8 . The thin type camera module in accordance with  claim 6 , wherein the sealant layer is a non-conductive film (NCF).  
     
     
         9 . The thin type camera module in accordance with  claim 6 , wherein the sealant layer is transparent thermosetting compound.  
     
     
         10 . The thin type camera module in accordance with  claim 1 , wherein the COF wiring film has at least a conductive via electrically connecting the connecting ends.  
     
     
         11 . The thin type camera module in accordance with  claim 1 , wherein the lens holder comprises a filter aligning with the light-pervious channel.  
     
     
         12 . The thin type camera module in accordance with  claim 1 , further comprising a camera lens connected with the lens holder.  
     
     
         13 . The thin type camera module in accordance with  claim 1 , wherein the fixing board has a recession for locating the image sensing chip.  
     
     
         14 . The thin type camera module in accordance with  claim 1 , wherein the airtight space is in vacuum state.  
     
     
         15 . The thin type camera module in accordance with  claim 1 , wherein the airtight space filled with inert gas.