US2004052471A1PendingUtilityA1
Connector systems for dynamically updating information related to a network and methods for developing the connector systems
Est. expirySep 13, 2022(expired)· nominal 20-yr term from priority
Inventors:Bruce A. ColomboClay A. FeustelMark R. JenningsSean JonesNorman R. LampertFrank Salvatore LeoneFrancis G. MccormackGregory A. SandelsNaif T. SubhIan A. White
G02B 6/3825G02B 6/3895
41
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Claims
Abstract
Connector systems for dynamically updating information related to a network and methods for developing the connector systems, are provided. A connector system for dynamically updating information related to the network, comprises: a connector; and an integrated circuit integrated in a surface of the connector. A method for developing the connector system comprises: obtaining a connector; and integrating an integrated circuit in a surface of the connector.
Claims
exact text as granted — not AI-modifiedTherefore, having thus described the invention, at least the following is claimed:
1 . A connector system for dynamically updating information related to a network comprising:
a connector; and an integrated circuit integrated in a surface of the connector.
2 . The connector system of claim 1 , wherein the connector is a push-pull connector.
3 . The connector system of claim 2 , wherein the push-pull connector is one of an SC™, LC™, MU™ and MT™ connector.
4 . The connector system of claim 1 , wherein the integrated circuit is integrated in a first cavity of the surface of the connector.
5 . The connector system of claim 4 , further comprising:
a tape placed in a second cavity of the surface, wherein the tape holds the integrated circuit in the first cavity.
6 . The connector system of claim 5 , wherein the tape is made of one of polyimide and polyester material.
7 . The connector system of claim 5 , wherein the tape is a label.
8 . The connector system of claim 5 , wherein the tape is one of a colored tape and a transparent tape.
9 . The connector system of claim 5 , further comprising a fastener that holds the integrated circuit in the first cavity.
10 . The connector system of claim 9 , wherein the fastener is screws.
11 . The connector system of claim 1 , wherein the integrated circuit is integrated in the surface by using one of insert-molding and potting.
12 . The connector system of claim 1 , wherein the integrated circuit is integrated in the surface by insert-molding the integrated circuit in a plastic carrier and ultrasonically welding the plastic carrier to the surface of the connector.
13 . A connector system comprising:
a strain relief; and an integrated circuit integrated in a surface of the strain relief.
14 . The connector system of claim 13 , wherein the strain relief is coupled to a connector, and wherein the connector is a push-pull connector.
15 . The connector system of claim 14 , wherein the push-pull connector is one of an SC™, LC™, MU™ and MT™ connectors.
16 . The connector system of claim 13 , wherein the integrated circuit is integrated in a first cavity of the surface of the strain relief.
17 . The connector system of claim 16 , further comprising:
a tape placed in a second cavity of the surface, wherein the tape holds the integrated circuit in the first cavity.
18 . The connector system of claim 17 , wherein the tape is made of one of polyimide and polyester material.
19 . The connector system of claim 17 , wherein the tape is a label.
20 . The connector system of claim 17 , wherein the tape is one of a colored tape and a transparent tape.
21 . The connector system of claim 17 , further comprising a fastener that holds the integrated circuit in the first cavity.
22 . The connector system of claim 21 , wherein the fastener is screws.
23 . The connector system of claim 13 , wherein the integrated circuit is integrated in the surface by using one of insert-molding and potting.
24 . The connector system of claim 13 , wherein the integrated circuit is integrated in the surface by insert-molding the integrated circuit in a plastic carrier and ultrasonically welding the plastic carrier to the surface of the strain relief.
25 . A method for developing a connector system, comprising:
obtaining a connector; and integrating an integrated circuit in a surface of the connector.
26 . The method of claim 25 , wherein integrating the integrated circuit in the surface of the connector comprises:
placing a bottom surface of the integrated circuit on an adhesive surface of a first adhesive tape; adhering an adhesive surface of a second adhesive tape to a top surface of the integrated circuit; removing the second adhesive tape from the top surface of the integrated circuit; and placing the integrated circuit in a first cavity on the surface of the connector by adhering the adhesive surface of the first adhesive tape to a second cavity on the surface of the connector.
27 . The method of claim 26 , further comprising:
forming a spring cavity in the connector; and forming the first cavity on the surface of the connector, wherein there is no contact between the spring cavity and the first cavity.
28 . The method of claim 26 , further comprising:
forming the second cavity on the surface of the connector, wherein the second cavity lies over the first cavity and wherein depth of the second cavity is less than sum of depths of the first and second cavities.
29 . The method of claim 25 , wherein the integrating comprises insert-molding the integrated circuit in the surface of the connector.
30 . The method of claim 25 , wherein the integrating comprises potting the integrated circuit in the surface of the connector.
31 . The method of claim 25 , wherein the integrating comprises:
insert-molding the integrated circuit in a plastic carrier; and ultrasonically welding the plastic carrier to the surface of the connector.
32 . A method for developing a connector system, comprising:
obtaining a strain relief; and integrating an integrated circuit in a surface of the strain relief.
33 . The method of claim 32 , wherein integrating the integrated circuit in the surface of the strain relief comprises:
placing a bottom surface of the integrated circuit on an adhesive surface of a first adhesive tape; adhering an adhesive surface of a second adhesive tape to a top surface of the integrated circuit; removing the second adhesive tape from the top surface of the integrated circuit; and placing the integrated circuit in a first cavity on the surface of the strain relief by adhering the adhesive surface of the first adhesive tape to a second cavity on the surface of the strain relief.
34 . The method of claim 33 , further comprising:
forming the first cavity on the surface of the strain relief.
35 . The method of claim 34 , further comprising:
forming the second cavity on the surface of the strain relief, wherein the second cavity lies over the first cavity and wherein depth of the second cavity is less than sum of depths of the first and second cavities.
36 . The method of claim 32 , wherein the integrating comprises insert-molding the integrated circuit in the surface of the strain relief.
37 . The method of claim 32 , wherein the integrating comprises potting the integrated circuit in the surface of the strain relief.
38 . The method of claim 32 , wherein the integrating comprises:
insert-molding the integrated circuit in a plastic carrier; and ultrasonically welding the plastic carrier to the surface of the strain relief.
39 . A connector system comprising:
means for connecting; and
means for storing integrated in a surface of the means for connecting.
40 . The connector system of claim 39 , wherein the means for connecting is a push-pull connector.
41 . The connector system of claim 40 , wherein the push-pull connector is one of an SC™, LC™, MU™ and MT™ connector.
42 . The connector system of claim 39 , wherein the means for storing is integrated in a first cavity of the surface of the means for connecting.
43 . The connector system of claim 42 , further comprising:
means for holding placed in a second cavity of the surface, wherein the means for holding holds the means for storing in the first cavity.
44 . The connector system of claim 43 , wherein the means for holding is a tape made of one of polyimide and polyester material.
45 . The connector system of claim 43 , wherein the means for holding is a label that comprises information regarding the means for storing.
46 . The connector system of claim 43 , wherein the means for holding is one of a colored tape and a transparent tape.
47 . The connector system of claim 43 , further comprising a means for fastening that holds the means for storing in the first cavity.
48 . The connector system of claim 47 , wherein the means for fastening is screws.
49 . The connector system of claim 39 , wherein the means for storing is integrated in the surface by using one of insert-molding and potting.
50 . The connector system of claim 39 , wherein the means for storing is integrated in the surface by insert-molding the means for storing in a plastic carrier and ultrasonically welding the plastic carrier to the surface of the means for connecting.
51 . A connector system comprising:
means for relieving; and
means for storing integrated in a surface of the means for relieving.
52 . The connector system of claim 51 , wherein the means for relieving is coupled to a means for connecting, and wherein the means for connecting is a push-pull connector.
53 . The connector system of claim 52 , wherein the push-pull connector is one of an SC™, LC™, MU™ and MT™ connector.
54 . The connector system of claim 53 , wherein the means for storing is integrated in a first cavity of the surface of the means for relieving.
55 . The connector system of claim 54 , further comprising:
means for holding placed in a second cavity of the surface, wherein the means for holding holds the means for storing in the first cavity.
56 . The connector system of claim 55 , wherein the means for holding is a tape made of one of polyimide and polyester material.
57 . The connector system of claim 55 , wherein the means for holding is a label that comprises information regarding the means for storing.
58 . The connector system of claim 55 , wherein the means for holding is one of a colored tape and a transparent tape.
59 . The connector system of claim 55 , further comprising a means for fastening that holds the means for storing in the first cavity.
60 . The connector system of claim 59 , wherein the means for fastening is one of glue and screws.
61 . The connector system of claim 51 , wherein the means for storing is integrated in the surface by using one of insert-molding and potting.
62 . The connector system of claim 51 , wherein the means for storing is integrated in the surface by insert-molding the means for storing in a plastic carrier and ultrasonically welding the plastic carrier to the surface of the means for relieving.Join the waitlist — get patent alerts
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