US2004052471A1PendingUtilityA1

Connector systems for dynamically updating information related to a network and methods for developing the connector systems

Assignee: FITEL USA CORPPriority: Sep 13, 2002Filed: Sep 13, 2002Published: Mar 18, 2004
Est. expirySep 13, 2022(expired)· nominal 20-yr term from priority
G02B 6/3825G02B 6/3895
41
PatentIndex Score
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Cited by
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Claims

Abstract

Connector systems for dynamically updating information related to a network and methods for developing the connector systems, are provided. A connector system for dynamically updating information related to the network, comprises: a connector; and an integrated circuit integrated in a surface of the connector. A method for developing the connector system comprises: obtaining a connector; and integrating an integrated circuit in a surface of the connector.

Claims

exact text as granted — not AI-modified
Therefore, having thus described the invention, at least the following is claimed:  
     
         1 . A connector system for dynamically updating information related to a network comprising: 
 a connector; and    an integrated circuit integrated in a surface of the connector.    
     
     
         2 . The connector system of  claim 1 , wherein the connector is a push-pull connector.  
     
     
         3 . The connector system of  claim 2 , wherein the push-pull connector is one of an SC™, LC™, MU™ and MT™ connector.  
     
     
         4 . The connector system of  claim 1 , wherein the integrated circuit is integrated in a first cavity of the surface of the connector.  
     
     
         5 . The connector system of  claim 4 , further comprising: 
 a tape placed in a second cavity of the surface, wherein the tape holds the integrated circuit in the first cavity.    
     
     
         6 . The connector system of  claim 5 , wherein the tape is made of one of polyimide and polyester material.  
     
     
         7 . The connector system of  claim 5 , wherein the tape is a label.  
     
     
         8 . The connector system of  claim 5 , wherein the tape is one of a colored tape and a transparent tape.  
     
     
         9 . The connector system of  claim 5 , further comprising a fastener that holds the integrated circuit in the first cavity.  
     
     
         10 . The connector system of  claim 9 , wherein the fastener is screws.  
     
     
         11 . The connector system of  claim 1 , wherein the integrated circuit is integrated in the surface by using one of insert-molding and potting.  
     
     
         12 . The connector system of  claim 1 , wherein the integrated circuit is integrated in the surface by insert-molding the integrated circuit in a plastic carrier and ultrasonically welding the plastic carrier to the surface of the connector.  
     
     
         13 . A connector system comprising: 
 a strain relief; and    an integrated circuit integrated in a surface of the strain relief.    
     
     
         14 . The connector system of  claim 13 , wherein the strain relief is coupled to a connector, and wherein the connector is a push-pull connector.  
     
     
         15 . The connector system of  claim 14 , wherein the push-pull connector is one of an SC™, LC™, MU™ and MT™ connectors.  
     
     
         16 . The connector system of  claim 13 , wherein the integrated circuit is integrated in a first cavity of the surface of the strain relief.  
     
     
         17 . The connector system of  claim 16 , further comprising: 
 a tape placed in a second cavity of the surface, wherein the tape holds the integrated circuit in the first cavity.    
     
     
         18 . The connector system of  claim 17 , wherein the tape is made of one of polyimide and polyester material.  
     
     
         19 . The connector system of  claim 17 , wherein the tape is a label.  
     
     
         20 . The connector system of  claim 17 , wherein the tape is one of a colored tape and a transparent tape.  
     
     
         21 . The connector system of  claim 17 , further comprising a fastener that holds the integrated circuit in the first cavity.  
     
     
         22 . The connector system of  claim 21 , wherein the fastener is screws.  
     
     
         23 . The connector system of  claim 13 , wherein the integrated circuit is integrated in the surface by using one of insert-molding and potting.  
     
     
         24 . The connector system of  claim 13 , wherein the integrated circuit is integrated in the surface by insert-molding the integrated circuit in a plastic carrier and ultrasonically welding the plastic carrier to the surface of the strain relief.  
     
     
         25 . A method for developing a connector system, comprising: 
 obtaining a connector; and    integrating an integrated circuit in a surface of the connector.    
     
     
         26 . The method of  claim 25 , wherein integrating the integrated circuit in the surface of the connector comprises: 
 placing a bottom surface of the integrated circuit on an adhesive surface of a first adhesive tape;    adhering an adhesive surface of a second adhesive tape to a top surface of the integrated circuit;    removing the second adhesive tape from the top surface of the integrated circuit; and    placing the integrated circuit in a first cavity on the surface of the connector by adhering the adhesive surface of the first adhesive tape to a second cavity on the surface of the connector.    
     
     
         27 . The method of  claim 26 , further comprising: 
 forming a spring cavity in the connector; and    forming the first cavity on the surface of the connector, wherein there is no contact between the spring cavity and the first cavity.    
     
     
         28 . The method of  claim 26 , further comprising: 
 forming the second cavity on the surface of the connector, wherein the second cavity lies over the first cavity and wherein depth of the second cavity is less than sum of depths of the first and second cavities.    
     
     
         29 . The method of  claim 25 , wherein the integrating comprises insert-molding the integrated circuit in the surface of the connector.  
     
     
         30 . The method of  claim 25 , wherein the integrating comprises potting the integrated circuit in the surface of the connector.  
     
     
         31 . The method of  claim 25 , wherein the integrating comprises: 
 insert-molding the integrated circuit in a plastic carrier; and    ultrasonically welding the plastic carrier to the surface of the connector.    
     
     
         32 . A method for developing a connector system, comprising: 
 obtaining a strain relief; and    integrating an integrated circuit in a surface of the strain relief.    
     
     
         33 . The method of  claim 32 , wherein integrating the integrated circuit in the surface of the strain relief comprises: 
 placing a bottom surface of the integrated circuit on an adhesive surface of a first adhesive tape;    adhering an adhesive surface of a second adhesive tape to a top surface of the integrated circuit;    removing the second adhesive tape from the top surface of the integrated circuit; and    placing the integrated circuit in a first cavity on the surface of the strain relief by adhering the adhesive surface of the first adhesive tape to a second cavity on the surface of the strain relief.    
     
     
         34 . The method of  claim 33 , further comprising: 
 forming the first cavity on the surface of the strain relief.    
     
     
         35 . The method of  claim 34 , further comprising: 
 forming the second cavity on the surface of the strain relief, wherein the second cavity lies over the first cavity and wherein depth of the second cavity is less than sum of depths of the first and second cavities.    
     
     
         36 . The method of  claim 32 , wherein the integrating comprises insert-molding the integrated circuit in the surface of the strain relief.  
     
     
         37 . The method of  claim 32 , wherein the integrating comprises potting the integrated circuit in the surface of the strain relief.  
     
     
         38 . The method of  claim 32 , wherein the integrating comprises: 
 insert-molding the integrated circuit in a plastic carrier; and    ultrasonically welding the plastic carrier to the surface of the strain relief.    
     
     
         39 . A connector system comprising: 
 means for connecting; and 
 means for storing integrated in a surface of the means for connecting.  
   
     
     
         40 . The connector system of  claim 39 , wherein the means for connecting is a push-pull connector.  
     
     
         41 . The connector system of  claim 40 , wherein the push-pull connector is one of an SC™, LC™, MU™ and MT™ connector.  
     
     
         42 . The connector system of  claim 39 , wherein the means for storing is integrated in a first cavity of the surface of the means for connecting.  
     
     
         43 . The connector system of  claim 42 , further comprising: 
 means for holding placed in a second cavity of the surface, wherein the means for holding holds the means for storing in the first cavity.    
     
     
         44 . The connector system of  claim 43 , wherein the means for holding is a tape made of one of polyimide and polyester material.  
     
     
         45 . The connector system of  claim 43 , wherein the means for holding is a label that comprises information regarding the means for storing.  
     
     
         46 . The connector system of  claim 43 , wherein the means for holding is one of a colored tape and a transparent tape.  
     
     
         47 . The connector system of  claim 43 , further comprising a means for fastening that holds the means for storing in the first cavity.  
     
     
         48 . The connector system of  claim 47 , wherein the means for fastening is screws.  
     
     
         49 . The connector system of  claim 39 , wherein the means for storing is integrated in the surface by using one of insert-molding and potting.  
     
     
         50 . The connector system of  claim 39 , wherein the means for storing is integrated in the surface by insert-molding the means for storing in a plastic carrier and ultrasonically welding the plastic carrier to the surface of the means for connecting.  
     
     
         51 . A connector system comprising: 
 means for relieving; and 
 means for storing integrated in a surface of the means for relieving.  
   
     
     
         52 . The connector system of  claim 51 , wherein the means for relieving is coupled to a means for connecting, and wherein the means for connecting is a push-pull connector.  
     
     
         53 . The connector system of  claim 52 , wherein the push-pull connector is one of an SC™, LC™, MU™ and MT™ connector.  
     
     
         54 . The connector system of  claim 53 , wherein the means for storing is integrated in a first cavity of the surface of the means for relieving.  
     
     
         55 . The connector system of  claim 54 , further comprising: 
 means for holding placed in a second cavity of the surface, wherein the means for holding holds the means for storing in the first cavity.    
     
     
         56 . The connector system of  claim 55 , wherein the means for holding is a tape made of one of polyimide and polyester material.  
     
     
         57 . The connector system of  claim 55 , wherein the means for holding is a label that comprises information regarding the means for storing.  
     
     
         58 . The connector system of  claim 55 , wherein the means for holding is one of a colored tape and a transparent tape.  
     
     
         59 . The connector system of  claim 55 , further comprising a means for fastening that holds the means for storing in the first cavity.  
     
     
         60 . The connector system of  claim 59 , wherein the means for fastening is one of glue and screws.  
     
     
         61 . The connector system of  claim 51 , wherein the means for storing is integrated in the surface by using one of insert-molding and potting.  
     
     
         62 . The connector system of  claim 51 , wherein the means for storing is integrated in the surface by insert-molding the means for storing in a plastic carrier and ultrasonically welding the plastic carrier to the surface of the means for relieving.

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