Heatsink with multiple fin types

Abstract

A heat sink includes a base having first and second regions, a first fin of a first type disposed on the first region of the base, and a second fin of a second type disposed on the second region of the base. The first and second regions of the base may be integral with or attached to one another. Such a heat sink can dissipate heat from multiple electronic components with the respective fin type that is most cost effective for each respective component. Using such a heat sink often reduces manufacturing time and costs as compared to using a separate heat sink for each component. In addition, such a heat sink can dissipate heat from multiple regions of a single electronic component with the respective fin type that is most cost effective for each region.

What is claimed is:  
     
         1 . A heat sink, comprising: 
 a base having first and second regions;    a first fin of a first type disposed on the first region of the base; and    a second fin of a second type disposed on the second region of the base.    
     
     
         2 . The heat sink of  claim 1  wherein: 
 the first region of the base comprises a first base piece; and  
 the second region of the base comprises a second base piece that is attached to the first base piece.  
 
     
     
         3 . The heat sink of  claim 1  wherein the first region of the base is integral with the second region of the base.  
     
     
         4 . The heat sink of  claim 1  wherein one of the first and second fins comprises a folded fin.  
     
     
         5 . The heat sink of  claim 1  wherein one of the first and second fins comprises an extruded fin.  
     
     
         6 . The heat sink of  claim 1  wherein one of the first and second fins comprises a skived fin.  
     
     
         7 . A heat sink, comprising: 
 a first region having a configuration designed to provide a predetermined first rate of heat dissipation; and    a second region having a configuration designed to provide a predetermined second rate of heat dissipation.    
     
     
         8 . The heat sink of  claim 7 , further comprising: 
 a common base;    wherein the first region is attached to or integral with the common base; and    wherein the second region is attached to or integral with the common base.    
     
     
         9 . The heat sink of  claim 7 , further comprising: 
 a first base;    a second base attached to the first base;    wherein the first region is attached to or integral with the first base; and    wherein the second region is attached to or integral with the second base.    
     
     
         10 . A circuit-board assembly, comprising: 
 a circuit board;    first and second electronic components mounted to the circuit board; and    a heat sink disposed on the electronic components and comprising: 
 a base having a first region disposed on the first component and having a second region disposed on the second component;  
 a first fin of a first type disposed on the first region of the base; and  
 a second fin of a second type disposed on the second region of the base.  
   
     
     
         11 . The circuit-board assembly of  claim 10  wherein: 
 the first electronic component is in thermal contact with the first region of the base; and the second electronic component is in thermal contact with the second region of the base.  
 
     
     
         12 . An electronic system, comprising: 
 an enclosure; and    a circuit-board assembly disposed in the enclosure, the assembly comprising, 
 a circuit board,  
 first and second electronic components mounted to the circuit board, and  
 a heat sink disposed on the electronic components and comprising, 
 a base having a first region disposed on the first component and having a second region disposed on the second component,  
 a first fin of a first type disposed on the first region of the base, and  
 a second fin of a second type disposed on the second region of the base.  
 
   
     
     
         13  A system for dissipating heat from first and second electronic components comprising: 
 a means for dissipating heat and having a first region configured for a predetermined first rate of heat dissipation and a having second region configured for a second predetermined rate of heat dissipation, the first and second regions dispose on a common base; and  
 means for attaching the base to the first and second electronic components.  
 
     
     
         14 . A method, comprising: 
 dissipating heat through a first region of a heat sink having a common base, the first region including a first fin of a first type disposed on the common base; and    dissipating heat through a second region of the heat sink, the second region including a second fin of second type disposed on the common base.    
     
     
         15 . The method of  claim 14  wherein dissipating heat through the first and second regions of the heat sink comprise dissipating the heat generated by a single electronic component on which the heat sink is disposed.  
     
     
         16 . The method of  claim 14  wherein: 
 dissipating heat through the first region of the heat sink comprises dissipating the heat generated by a first electronic component on which the first region is disposed; and  
 dissipating heat through the second region of the heat sink comprises dissipating the heat generated by a second electronic component on which the second region is disposed.  
 
     
     
         17 . A method of manufacturing a heat sink, the method comprising: 
 forming a first region of the heat sink having a first fin configuration; and    forming a second region of the heat sink having a second fin configuration.    
     
     
         18 . The method of  claim 17 , further comprising forming the first region integral with the second region.  
     
     
         19 . The method of  claim 17 , further comprising attaching the first region to the second region.