Polishing pad showing intrinsic abrasion and fabrication method thereof

Abstract

A polishing pad showing intrinsic abrasion automatically during processing. In the pad of the present invention, a polishing substrate has a first surface, a first index a first predetermined distance from the first surface, a second index a second predetermined distance from the first surface, and a third index a third predetermined distance from the first surface, wherein the third predetermined distance exceeds the second predetermined distance, and the second predetermined distance exceeds the first predetermined distance. The polishing pad shows the first pattern when abrasion from the first surface exceeds the first predetermined distance, and shows the first and second patterns when abrasion from the first surface exceeds the second predetermined distance. The first, second and third patterns appear when abrasion from the first surface exceeds the third predetermined distance.

What is claimed is:  
     
         1 . A method of fabricating a polishing pad showing intrinsic abrasion during processing, comprising: 
 providing a polishing substrate with a first and second surface;    forming a plurality of first sign apertures with a first predetermined depth on the second surface of the polishing substrate;    forming a plurality of second sign apertures with a second predetermined depth on the second surface of the polishing substrate; and    forming a plurality of third sign apertures with a third predetermined depth on the second surface of the polishing substrate, wherein the first predetermined depth exceeds the second predetermined depth, and the second predetermined depth exceeds the third predetermined depth.    
     
     
         2 . The method as claimed in  claim 1 , wherein the first sign apertures, the second sign apertures and the third sign apertures on the polishing substrate are formed by a laser device.  
     
     
         3 . The method as claimed in  claim 1 , wherein the first sign apertures, the second sign apertures and the third sign apertures on the polishing substrate are formed by machining.  
     
     
         4 . The method as claimed in  claim 1 , wherein the first sign apertures, the second sign apertures and the third sign apertures on the polishing substrate are arranged in a first predetermined pattern, a second predetermined pattern and a third predetermined pattern, respectively.  
     
     
         5 . The method as claimed in  claim 4 , wherein the first predetermined pattern, the second predetermined pattern and the third predetermined pattern are concentric circles with different diameters.  
     
     
         6 . The method as claimed in  claim 1 , wherein the first predetermined depth of the first sign apertures is between 0.6 mm to 0.7 mm.  
     
     
         7 . The method as claimed in  claim 1 , wherein the second predetermined depth of the second sign apertures is between 0.4 mm to 0.5 mm.  
     
     
         8 . The method as claimed in  claim 1 , wherein the third predetermined depth of the third sign apertures is between 0.2 mm to 0.3 mm.  
     
     
         9 . A polishing device, comprising: 
 a polishing platen;    a polishing substrate deposited on the polishing platen, having a first surface, a second surface, a first index at a first predetermined distance from the first surface, a second index a second predetermined distance from the first surface, and a third index a third predetermined distance from the first surface, wherein the third predetermined distance exceeds the second predetermined distance, and the second predetermined distance exceeds the first predetermined distance.    
     
     
         10 . The polishing device as claimed in  claim 9 , wherein the first, second and third indices are composed of apertures, and the first predetermined distance is 0.2 mm to 0.3 mm.  
     
     
         11 . The polishing device as claimed in  claim 9 , wherein the second predetermined distance is 0.4 mm to 0.5 mm.  
     
     
         12 . The polishing device as claimed in  claim 9 , wherein the third predetermined distance is 0.6 mm to 0.7 mm.  
     
     
         13 . The polishing device as claimed in  claim 9 , wherein the first, second and third indices are concentric circles arranged by apertures.  
     
     
         14 . A polishing pad showing intrinsic abrasion automatically during processing, comprising: 
 a polishing substrate having a first and second surface;    a plurality of first apertures a first predetermined distance from the first surface;    a plurality of second apertures a second predetermined distance from the first surface; and    a plurality of third apertures a third predetermined distance from the first surface, wherein the apertures extend along a direction from the second surface to the first surface, the third predetermined distance exceeds the second predetermined distance, and the second predetermined distance exceeds the first predetermined distance.    
     
     
         15 . The polishing pad as claimed in  claim 14 , wherein the first apertures, the second apertures and the third apertures on the polishing substrate are arranged in a first predetermined pattern, a second predetermined pattern and a third predetermined pattern, respectively.  
     
     
         16 . The polishing pad as claimed in  claim 14 , wherein the polishing pad shows the first pattern when abrasion from the first surface exceeds the first predetermined distance, and shows the first and second patterns when abrasion from the first surface exceeds the second predetermined distance, and shows the first, second and third patterns when abrasion from the first surface exceeds the third predetermined distance.  
     
     
         17 . The polishing pad as claimed in  claim 14 , wherein the third predetermined distance is 0.6 mm to 0.7 mm.  
     
     
         18 . The polishing pad as claimed in  claim 14 , wherein the second predetermined distance is 0.4 mm to 0.5 mm.  
     
     
         19 . The polishing pad as claimed in  claim 14 , wherein the first predetermined distance is 0.2 mm to 0.3 mm.  
     
     
         20 . The polishing pad as claimed in  claim 15 , wherein the first predetermined pattern, the second predetermined pattern and the third predetermined pattern are concentric circles with different diameters.