Device for assembling components on a substrate

Abstract

A device for assembly of components, in particular semiconductor chips, on a substrate having a first traversing unit for picking up the component together with a component holder at a first location and setting down the component at a second location on the substrate is described, a position measuring unit for optically determining an actual position of the component as a function of an actual position of the substrate being situated on an optical traversing unit for traversing the position measuring unit from a working position in the area of the substrate to a resting position; this permits fully automatic assembly of a wide variety of components on substrates and at the same time has a high throughput in interlinked production and a very high positioning precision. This is achieved by the fact that the substrate is situated on a conveyance device for largely continuous supply and removal of numerous substrates to and from the device.

What is claimed is:  
     
         1 . A device for assembly of components ( 10 ), in particular semiconductor chips ( 10 ), on a substrate ( 4 ) having a first traversing unit for picking up the component ( 10 ) together with a component holder ( 3 ) at a first location and setting down the component ( 10 ) at a second location on the substrate ( 4 ), a position measuring unit ( 2 ,  11 ) for optically determining an actual position of the component ( 10 ) as a function of an actual position of the substrate ( 4 ) being situated on an optical traversing unit ( 2 ) for traversing the position measuring unit ( 2 ,  11 ) from a working position in the area of the substrate ( 4 ) to a resting position,  
       wherein the substrate ( 4 ) is situated on a conveyance device ( 1 ,  6 ,  7 ) for largely continuous supply and removal of numerous substrates ( 4 ) to and from the device.  
     
     
         2 . The device as recited in  claim 1 , 
 wherein the position measuring unit ( 2 ,  11 ) includes at least one optical device ( 11 ) having two opposite directions of measurement for determining the two actual positions.    
     
     
         3 . The device as recited in one of the preceding claims, 
 wherein the conveyance device ( 1 ,  6 ,  7 ) includes at least one substrate traversing unit ( 1 ,  8 ,  13 ) having at least one positioning axis (X, Y) situated almost parallel to the plane formed by the substrate ( 4 ) for traversing the substrate ( 4 ) in the direction of the positioning axis (X, Y).    
     
     
         4 . The device as recited in one of the preceding claims, 
 wherein the substrate traversing unit ( 1 ,  8 ,  13 ) has two positioning axes (X, Y) situated almost perpendicular to one another and largely parallel to the plane formed by the substrate ( 4 ).    
     
     
         5 . The device as recited in one of the preceding claims, 
 wherein the optical traversing unit ( 2 ) has at least two positioning axes (X, Y) situated almost perpendicular to one another and largely parallel to the plane formed by the substrate ( 4 ).    
     
     
         6 . The device as recited in one of the preceding claims, 
 wherein the optical traversing unit ( 2 ) has a focusing axis (Z), situated almost perpendicular to the plane formed by the substrate ( 4 ), for focusing the first and/or second location.    
     
     
         7 . The device as recited in one of the preceding claims, 
 wherein at least one precision positioning unit ( 8 ) having two positioning axes (X, Y) almost perpendicular to one another and largely parallel to the plane formed by the substrate ( 4 ) is provided for precision positioning of one or both actual positions.    
     
     
         8 . The device as recited in one of the preceding claims, 
 wherein a maximum traversing range of the precision positioning unit ( 8 ) is multiple times smaller than a maximum traversing range of the first traversing unit.    
     
     
         9 . The device as recited in one of the preceding claims, 
 wherein the substrate traversing unit ( 1 ,  8 ,  13 ) is designed as a precision positioning unit ( 8 ).    
     
     
         10 . The device as recited in one of the preceding claims, 
 wherein the first traversing unit, the optical traversing unit ( 2 ) and the substrate traversing unit ( 1 ,  8 ,  13 ) are each situated on a stationary base unit of the device for mutually independent traversing of the traversing units ( 1 ,  2 ,  8 ,  13 ).    
     
     
         11 . The device as recited in one of the preceding claims, 
 wherein the conveyance device ( 1 ,  6 ,  7 ) has a lifting unit, which is adjustable almost perpendicular to the plane formed by the substrate ( 4 ), for lifting and securing a substrate carrier ( 5 ).    
     
     
         12 . The device as recited in one of the preceding claims, 
 wherein at least the lifting unit includes the precision positioning unit ( 8 ).    
     
     
         13 . A method of assembly of components ( 10 ), in particular semiconductor chips ( 10 ), on a substrate ( 4 ) having a first traversing unit for picking up the component ( 10 ) together with a component holder ( 3 ) at a first location and setting down the component ( 10 ) at a second location on the substrate ( 4 ), an optical position measuring unit ( 2 ,  11 ) for determining an actual position of the component ( 10 ) as a function of an actual position of the substrate ( 4 ) being situated on an optical traversing unit ( 2 ) for traversing the position measuring unit ( 2 ,  11 ) from a resting position to a working position in the area of the substrate ( 4 ), 
 wherein a device as recited in one of the preceding claims is used.