Temporary electronic component-carrying tape with weakened areas and related methods

Abstract

A flexible temporary component-carrier tape used for storing, transporting and supplying components includes apertures for receiving and temporarily storing components, as well as at least one weakened region between at least two of the apertures. Each weakened region prevents bowing or kinking of the temporary component-carrying tape at the apertures thereof. The temporary component-carrier tape comprises a device-retaining layer including a top surface, the apertures, and, optionally, a series of advancement wheel holes adjacent to an edge thereof. Components may be enclosed in the temporary component-carrier tape aperture by attaching a cover layer to a surface of the device-retaining layer and at least partially over the apertures. Methods for making and using the temporary component-carrying tape are also disclosed.

What is claimed is:  
     
         1 . A temporary component-carrier tape comprising: 
 a device-retaining layer;    a plurality of apertures for receiving and storing components;    a top cover layer securable to a surface of the device-retaining layer and covering at least a portion of each of the plurality of apertures; and    at least one weakened region included in at least one of the device-retaining layer and the top cover layer between an adjacent pair of apertures of the plurality of apertures.    
     
     
         2 . The temporary component-carrier tape of  claim 1 , wherein the device-retaining layer has a thickness about equal to or greater than a component to be disposed within one of the plurality of apertures.  
     
     
         3 . The temporary component-carrier tape of  claim 1 , wherein the device-retaining layer comprises a flexible layer of paper, cardboard, or polymer.  
     
     
         4 . The temporary component-carrier tape of  claim 1 , wherein the device-retaining layer comprises a thermoplastic polymer foam.  
     
     
         5 . The temporary component-carrier tape of  claim 1 , wherein the device-retaining layer comprises an electrically conductive material.  
     
     
         6 . The temporary component-carrier tape of  claim 1 , further comprising an adhesive for securing the top cover layer to the surface of the device-retaining layer.  
     
     
         7 . The temporary component-carrier tape of  claim 6 , wherein the adhesive comprises a pressure-sensitive adhesive.  
     
     
         8 . The temporary component-carrier tape of claim I, wherein the plurality of apertures extends partially through the device-retaining layer.  
     
     
         9 . The temporary component-carrier tape of  claim 1 , wherein the plurality of apertures extends completely through the device-retaining layer.  
     
     
         10 . The temporary component-carrier tape of  claim 9 , further comprising a bottom cover layer securable to another surface of the device-retaining layer so as to cover at least a portion of each of the plurality of apertures.  
     
     
         11 . The temporary component-carrier tape of  claim 10 , wherein the bottom cover layer includes at least one weakened region positionable between adjacent apertures of the plurality of apertures.  
     
     
         12 . The temporary component-carrier tape of  claim 10 , further comprising an adhesive for securing the bottom cover layer to another surface of the device-retaining layer.  
     
     
         13 . The temporary component-carrier tape of  claim 12 , wherein the adhesive comprises a pressure-sensitive adhesive.  
     
     
         14 . The temporary component-carrier tape of  claim 1 , wherein at least the device-retaining layer includes a plurality of advancement wheel holes formed therethrough and arranged in at least one row located substantially along an edge of the device-retaining layer.  
     
     
         15 . The temporary component-carrier tape of  claim 1 , wherein the at least one weakened region extends at least partially across the temporary component-carrying tape in a direction substantially perpendicular to a length thereof.  
     
     
         16 . The temporary component-carrier tape of  claim 1 , wherein the at least one weakened region comprises a crease.  
     
     
         17 . The temporary component-carrier tape of  claim 1 , wherein the at least one weakened region comprises an elongated slot.  
     
     
         18 . The temporary component-carrier tape of  claim 1 , wherein the at least one weakened region comprises a plurality of perforations through at least one of the device-retaining layer and the top cover layer.  
     
     
         19 . The temporary component-carrier tape of  claim 1 , wherein the at least one weakened region comprises a thinned region of at least one of the device-retaining layer and the top cover layer.  
     
     
         20 . A method of designing a temporary component-carrying tape comprising: 
 configuring a device-retaining layer;    configuring a plurality of apertures for receiving and storing components;    configuring a top cover layer to be secured to a surface of the device-retaining layer and to cover at least a portion of each aperture of the plurality of apertures; and    configuring at least one weakened region in at least one of the device-retaining layer and the top cover layer to be positioned between an adjacent pair of apertures of the plurality of apertures.    
     
     
         21 . The method of  claim 20 , wherein configuring the device-retaining layer comprises configuring a thickness of the device retaining layer to be equal to or greater than a thickness of a component to be stored within an aperture of the plurality of apertures.  
     
     
         22 . The method of  claim 20 , wherein configuring the device-retaining layer comprises configuring the device-retaining layer to be flexible.  
     
     
         23 . The method of  claim 20 , wherein configuring the top cover layer comprises configuring at least one surface of the top cover layer to be at least partially coated with an adhesive for adhering the top cover layer to the surface of the device-retaining layer.  
     
     
         24 . The method of  claim 23 , wherein configuring the top cover layer comprises configuring the at least one surface of the top cover layer to be at least partially coated with a pressure-sensitive adhesive.  
     
     
         25 . The method of  claim 20 , wherein configuring the top cover layer comprises configuring the top cover layer to include a material that, when heated to an adhering temperature, will adhere the top cover layer to a surface of the device-retaining layer.  
     
     
         26 . The method of  claim 20 , wherein configuring the plurality of apertures comprises configuring the plurality of apertures to extend partially through the device-retaining layer.  
     
     
         27 . The method of  claim 20 , wherein configuring the plurality of apertures comprises configuring the plurality of apertures to extend substantially through the device-retaining layer.  
     
     
         28 . The method of  claim 27 , further comprising configuring a bottom cover layer to be secured to another surface of the device-retaining layer and to cover at least a portion of each of the plurality of apertures extending through the device-retaining layer.  
     
     
         29 . The method of  claim 28 , wherein configuring the bottom cover layer comprises configuring a surface of the bottom cover layer to be at least partially coated with an adhesive for adhering the bottom cover layer to the device-retaining layer.  
     
     
         30 . The method of  claim 29 , wherein configuring the bottom cover layer includes configuring the surface of the bottom cover layer to be at least partially coated with a pressure-sensitive adhesive.  
     
     
         31 . The method of  claim 28 , wherein configuring the bottom cover layer comprises configuring the bottom cover layer to include a material that, when heated to an adhering temperature, will adhere the bottom cover layer to the device-retainer layer.  
     
     
         32 . The method of  claim 20 , wherein configuring the device-retaining layer comprises configuring at least one series of advancement wheel holes arranged adjacent to an edge of the device-retaining layer.  
     
     
         33 . The method of  claim 20 , wherein configuring the at least one weakened region comprises configuring the at least one weakened region to extend at least partially across and substantially perpendicular to a length of the temporary component-carrier tape.  
     
     
         34 . The method of  claim 28 , wherein configuring the at least one weakened region comprises configuring the bottom cover layer to include at least one weakened region.  
     
     
         35 . The method of  claim 20 , wherein configuring the at least one weakened region comprises configuring a crease.  
     
     
         36 . The method of  claim 20 , wherein configuring the at least one weakened region comprises configuring a thinned area.  
     
     
         37 . The method of  claim 20 , wherein configuring the at least one weakened region comprises configuring an elongated slot.  
     
     
         38 . The method of  claim 20 , wherein configuring the at least one weakened region comprises configuring a plurality of perforations.  
     
     
         39 . A method for making a temporary component-carrying tape comprising: 
 forming a device-retaining layer;    forming a plurality of apertures in the device-retaining layer;    securing a top cover layer to a surface of the device-retaining layer so as to cover at least a portion of each of the plurality of apertures; and    forming at least one weakened region in at least one of the device-retaining layer and the top cover layer between adjacent apertures of the plurality of apertures.    
     
     
         40 . The method of  claim 39 , wherein forming the device-retaining layer comprises forming the device-retaining layer from paper, cardboard, or a thermoplastic polymer.  
     
     
         41 . The method of  claim 39 , wherein forming the device-retaining layer comprises forming the device-retaining layer from a thermoplastic polymer foam.  
     
     
         42 . The method of  claim 39 , wherein forming the device-retaining layer comprises extruding a polymeric material through a die.  
     
     
         43 . The method of  claim 39 , wherein forming the device-retaining layer comprises forming at least one series of advancement wheel holes adjacent to an edge of the device-retaining layer.  
     
     
         44 . The method of  claim 43 , wherein forming the plurality of apertures comprises punching the plurality of apertures into the device-retaining layer.  
     
     
         45 . The method of  claim 39 , wherein securing the top cover layer to the surface of the device-retaining layer comprises using a pressure-sensitive adhesive therebetween.  
     
     
         46 . The method of  claim 39 , wherein securing the top cover layer to the surface of the device-retaining layer further comprises applying heat to at least one of the top cover layer and the device-retaining layer.  
     
     
         47 . The method of  claim 39 , further comprising securing a bottom cover layer to another surface of the device-retaining layer so as to cover at least a portion of each of the plurality of apertures.  
     
     
         48 . The method of  claim 47 , wherein securing the bottom cover layer to the another surface of the device-retaining layer is effected with a pressure-sensitive adhesive.  
     
     
         49 . The method of  claim 47 , wherein securing the bottom cover layer to the another surface of the device-retaining layer comprises applying heat to at least one of the bottom cover layer and the device-retaining layer.  
     
     
         50 . The method of  claim 39 , wherein forming the at least one weakened region comprises at least one of punching, cutting, etching, and creasing.  
     
     
         51 . The method of  claim 47 , further comprising forming at least one weakened region in at least the bottom cover layer.  
     
     
         52 . The method of  claim 51 , wherein forming the at least one weakened region in at least the bottom cover layer comprises at least one of punching, cutting, etching, and creasing.  
     
     
         53 . The method of  claim 39 , wherein forming the at least one weakened region comprises forming the at least one weakened region substantially simultaneously with forming the plurality of apertures.  
     
     
         54 . The method of  claim 51 , wherein forming the at least one weakened region in the bottom cover layer is effected before securing the bottom cover layer to the another surface of the device-retaining layer.  
     
     
         55 . The method of  claim 51 , wherein forming the at least one weakened region in the bottom cover layer is effected after securing the bottom cover layer to the another surface of the device-retaining layer.  
     
     
         56 . The method of  claim 39 , wherein forming the at least one weakened region is effected prior to securing the top cover layer to the device-retaining layer.  
     
     
         57 . The method of  claim 39 , wherein forming the at least one weakened region is effected after securing the top cover layer to the device-retaining layer.  
     
     
         58 . A method for using a temporary component-carrying tape comprising: 
 subjecting the temporary component-carrying tape to a stress;    absorbing the stress at a weakened region of at least one layer of the temporary component-carrying tape to maintain a shape of an aperture of a device-retaining layer of the temporary component-carrying tape; and    removing a cover layer of the temporary component-carrying tape to provide access to at least one component temporarily stored within the aperture;    removing the at least one component from the aperture.    
     
     
         59 . The method of  claim 58 , further comprising unwinding the temporary component-carrying tape from a roll.  
     
     
         60 . The method of  claim 59 , wherein unwinding the temporary component-carrier tape comprises engaging advancement wheel holes of the temporary component-carrier tape with a sprocketed advancement wheel.  
     
     
         61 . The method of  claim 60 , wherein engaging the advancement wheel holes comprises moving the temporary component-carrier tape toward a pick-and-place head.  
     
     
         62 . The method of  claim 58 , wherein removing the cover layer is effected with a stripper assembly that peels the cover layer away from a top surface of the device-retaining layer.  
     
     
         63 . The method of  claim 58 , wherein removing the at least one component from the aperture comprises applying a vacuum from a pick-and-place head.  
     
     
         64 . An electronic device component-carrying tape, comprising: 
 a device-retaining layer;    a plurality of apertures or receptacles in the device-retaining layer;    at least one electronic device in each of the plurality of apertures or receptacles;    a cover layer securable to a surface of the device-retaining layer and covering at least a portion of each of the plurality of apertures or receptacles; and    at least one weakened region included in at least one of the device-retaining layer and the cover layer between an adjacent pair of apertures or receptacles of the plurality of apertures or receptacles.    
     
     
         65 . The electronic device component-carrying tape of  claim 64 , further comprising at least one of a hub and a reel upon which the electronic device component-carrying tape is wound.  
     
     
         66 . The electronic device component-carrying tape of  claim 64  in a rolled configuration.  
     
     
         67 . The electronic device component-carrying tape of  claim 64 , wherein the device-retaining layer has a thickness about equal to or greater than the at least one electronic device within one of the plurality of apertures or receptacles.  
     
     
         68 . The electronic device component-carrying tape of  claim 64 , wherein the device-retaining layer comprises a flexible layer of paper, cardboard, or polymer.  
     
     
         69 . The electronic device component-carrying tape of  claim 64 , wherein the device-retaining layer comprises a thermoplastic polymer foam.  
     
     
         70 . The electronic device component-carrying tape of  claim 64 , wherein the device-retaining layer comprises an electrically conductive material.  
     
     
         71 . The electronic device component-carrying tape of  claim 64 , further comprising an adhesive for securing the cover layer to the surface of the device-retaining layer.  
     
     
         72 . The electronic device component-carrying tape of  claim 71 , wherein the adhesive comprises a pressure-sensitive adhesive.  
     
     
         73 . The electronic device component-carrying tape of  claim 64 , wherein the plurality of apertures or receptacles extends partially through the device-retaining layer.  
     
     
         74 . The electronic device component-carrying tape of  claim 64 , wherein the plurality of apertures or receptacles extends completely through the device-retaining layer.  
     
     
         75 . The electronic device component-carrying tape of  claim 74 , further comprising another cover layer securable to another surface of the device-retaining layer so as to cover at least a portion of each of the plurality of apertures or receptacles.  
     
     
         76 . The electronic device component-carrying tape of  claim 75 , wherein the another cover layer includes at least one weakened region positionable between adjacent apertures or receptacles of the plurality of apertures or receptacles.  
     
     
         77 . The electronic device component-carrying tape of  claim 75 , further comprising an adhesive for securing the another cover layer to the another surface of the device-retaining layer.  
     
     
         78 . The electronic device component-carrying tape of  claim 77 , wherein the adhesive comprises a pressure-sensitive adhesive.  
     
     
         79 . The electronic device component-carrying tape of  claim 64 , wherein at least the device-retaining layer includes a plurality of advancement wheel or indexing holes formed therethrough and arranged in at least one row located substantially along an edge of the device-retaining layer.  
     
     
         80 . The electronic device component-carrying tape of  claim 64 , wherein the at least one weakened region extends at least partially across the electronic device component-carrying tape in a direction substantially perpendicular to a length thereof.  
     
     
         81 . The electronic device component-carrying tape of  claim 64 , wherein the at least one weakened region comprises a crease.  
     
     
         82 . The electronic device component-carrying tape of  claim 64 , wherein the at least one weakened region comprises an elongated slot.  
     
     
         83 . The electronic device component-carrying tape of  claim 64 , wherein the at least one weakened region comprises a plurality of perforations through at least one of the device-retaining layer and the cover layer.  
     
     
         84 . The electronic device component-carrying tape of  claim 64 , wherein the at least one weakened region comprises a thinned region of at least one of the device-retaining layer and the cover layer.