Manufacturing apparatus

Abstract

A manufacturing apparatus is provided, which can improve a utilization efficiency of an evaporation material, reduce manufacturing costs of a light emitting device having an organic light emitting element, and shorten manufacturing time necessary to manufacture a light emitting device. According to the present invention, a multi-chamber manufacturing apparatus having plural film forming chambers includes a first film forming chamber for subjecting a first substrate to evaporation and a second film forming chamber for subjecting a second substrate to evaporation. In each film forming chamber, plural organic compound layers are laminated, thereby improving the throughput. Further, it is possible that the respective substrates in the plural film forming chambers are subjected to evaporation in the same manner in parallel, while another film forming chamber undergoes cleaning.

What is claimed is:  
     
         1 . A manufacturing apparatus comprising: 
 a load chamber;    a transfer chamber that is connected to the load chamber; and    plural film forming chambers that are connected to the transfer chamber,    wherein the plural film forming chambers are each connected to a vacuum-exhaust process chamber for setting an inside of the film forming chamber to vacuum,    wherein each of the plural film forming chambers includes alignment means for performing position alignment of a mask and a substrate, an evaporation source, and means for heating the evaporation source, and    wherein in at least two of the plural film forming chambers, surfaces of substrates loaded into the respective film forming chambers are subjected to evaporation in parallel.    
     
     
         2 . A manufacturing apparatus comprising: 
 a load chamber;    a transfer chamber that is connected to the load chamber;    plural film forming chambers that are connected to the transfer chamber; and    plural sealing chambers,    wherein the plural film forming chambers are each connected to a vacuum-exhaust process chamber for setting an inside of the film forming chamber to vacuum,    wherein each of the plural film forming chambers includes alignment means for performing position alignment of a mask and a substrate, an evaporation source, and means for heating the evaporation source,    wherein in at least two of the plural film forming chambers, surfaces of substrates loaded into the respective film forming chambers are subjected to evaporation in parallel, and    wherein each substrate is assigned to one of the plural sealing chambers to be sealed therein.    
     
     
         3 . A manufacturing apparatus comprising: 
 a load chamber;    a transfer chamber that is connected to the load chamber; and    plural film forming chambers that are connected to the transfer chamber,    wherein the plural film forming chambers are each connected to a vacuum-exhaust process chamber for setting an inside of the film forming chamber to vacuum,    wherein each of the plural the film forming chambers includes alignment means for performing position alignment of a mask and a substrate, an evaporation source, and means for heating the evaporation source, and    wherein in at least two of the plural film forming chambers, surfaces of substrates loaded into the respective film forming chambers are subjected to evaporation in parallel, and in at least one of the plural film forming chambers, the inside of the film forming chamber undergoes cleaning.    
     
     
         4 . A manufacturing apparatus according to any one of  claims 1  to  3 , wherein in at least two of the plural film forming chambers, evaporation processes of layers containing the same organic compound are performed in parallel.  
     
     
         5 . A manufacturing apparatus comprising: 
 a load chamber;    a transfer chamber that is connected to the load chamber; and    plural film forming chambers that are connected to the transfer chamber,    wherein the plural film forming chambers are each connected to a vacuum-exhaust process chamber for setting an inside of the film forming chamber to vacuum,    wherein each of the plural film forming chambers includes alignment means for performing position alignment of a mask and a substrate, an evaporation source, and means for heating the evaporation source, and    wherein plural substrates loaded into the load chamber are each assigned to one of the plural film forming chambers in the transfer chamber to be loaded thereinto, and each substrate undergoes processes along one of different paths whose number is the same as that of the film forming chambers.    
     
     
         6 . A method of fabricating a light emitting device by using an evaporation system including a plurality of first deposition chambers for forming a film of an organic compound layer and a plurality of second deposition chambers for forming a conductive film, said method comprising the steps of: 
 forming the organic compound layer in parallel in the plurality of first deposition chambers;    moving the organic compound layer from the first deposition chamber to the second deposition chamber by using carrying means without being exposed to an atmosphere; and    forming the conductive film in contact with the organic compound layer in the second deposition chamber.    
     
     
         7 . A method of fabricating a light emitting device by using an evaporation system including a first through a fourth deposition chamber for forming a film of an organic compound layer above a substrate, a fifth deposition chamber for forming a conductive film, a sixth deposition chamber for forming a protective film and a seventh deposition chamber for pasting together the substrate and a sealing substrate, said method comprising the step of: 
 simultaneously forming the organic compound layer above the substrate in the first through the fourth deposition chambers and moving the substrate from any one of the first through the fourth deposition chambers to the fifth forming chamber without being exposed to an atmosphere; and    forming the conductive film above the organic compound layer in the fifth deposition chamber;    moving the substrate from the fifth deposition chamber to the sixth deposition chamber without being exposed to the atmosphere;    forming the protective film above the conductive film in the sixth deposition chamber;    moving the substrate from the sixth chamber to the seventh deposition chamber without being exposed to the atmosphere; and    pasting together the substrate and the sealing substrate formed with a sealing member in the seventh deposition chamber.