Thermoplastic resin composition, molded product using the same and transport member for electric and electronic parts using the same

Abstract

The present invention relates to a thermoplastic resin composition comprising a thermoplastic resin and hollow carbon fibrils dispersed in the thermoplastic resin, the hollow carbon fibrils being present in an amount of 0.1 to 20% by weight based on the total weight of the composition, comprising independent fibrils and agglomerated fibrils, and having such a dispersing condition, when represented by indices based on the measurement of transmission electron microphotograph, that the ratio of the independent fibrils to the agglomerated fibrils lies within the range of 8/92 to 40/60 and the independent fibrils have an average length of 20 to 200 nm.

What is claimed is:  
     
         1 . A thermoplastic resin composition comprising a thermoplastic resin and hollow carbon fibrils dispersed in the thermoplastic resin, 
 the hollow carbon fibrils being present in an amount of 0.1 to 20% by weight based on the total weight of the composition, comprising independent fibrils and agglomerated fibrils, and having such a dispersing condition, when represented by indices based on the measurement of transmission electron microphotograph, that the ratio of the independent fibrils to the agglomerated fibrils lies within the range of 8/92 to 40/60 and the independent fibrils have an average length of 20 to 200 nm.    
     
     
         2 . A thermoplastic resin composition according to  claim 1 , wherein the thermoplastic resin comprises at least one resin selected from the group consisting of polycarbonates, polyphenylene ethers, polyamides, polyesters and aromatic vinyl compound polymers.  
     
     
         3 . A thermoplastic resin composition according to  claim 1 , wherein the hollow carbon fibrils have an outer diameter of 3.5 to 70 nm.  
     
     
         4 . A molded product formed from the thermoplastic resin composition as defined in  claim 1 .  
     
     
         5 . A molded product according to  claim 4 , wherein the hollow carbon fibrils have an outer diameter of 3.5 to 70 nm.  
     
     
         6 . A molded product according to  claim 4 , wherein the molded product has a surface resistance of 10 2  to 10 12  Ω.  
     
     
         7 . A transporting and packaging material for electric and electronic parts formed from the molded product according to  claim 4 .  
     
     
         8 . An automobile part produced by subjecting the molded product according to  claim 4 , to electrostatic painting.  
     
     
         9 . A molded product according to any one of  claims 4  to  6 , wherein the thermoplastic resin comprises at least one resin selected from the group consisting of polycarbonates, polyphenylene ethers, polyamides, polyesters and aromatic vinyl compound polymers.  
     
     
         10 . A transporting and packaging material for electric and electronic parts according to  claim 7 , wherein the thermoplastic resin is polycarbonate.  
     
     
         11 . A molded product according to  claim 8 , wherein the thermoplastic resin is a blended mixture of polycarbonate and polyester.  
     
     
         12 . A transporting and packaging material for electric and electronic parts according to  claim 7 , wherein the thermoplastic resin is a blended mixture of polyphenylene ether and an aromatic vinyl compound polymer.  
     
     
         13 . A molded product according to  claim 8 , wherein the thermoplastic resin is a blended mixture of polyphenylene ether and polyamide.  
     
     
         14 . A polycarbonate resin composition which comprises a polycarbonate resin and a conductive material, and has a weight ratio of the polycarbonate resin to the conductive material of 70/30 to 99.9/0.1 and a volatile matter content of not more than 20 ppm calculated as heptane when measured at 100° C. for 30 minutes using a head-space gas chromatograph.  
     
     
         15 . A polycarbonate resin composition according to  claim 14 , wherein the polycarbonate resin has a viscosity-average molecular weight of 14,000 to 30,000 calculated on the basis of a solution viscosity thereof measured at 25° C. in a methylene chloride solvent.  
     
     
         16 . A polycarbonate resin composition according to  claim 14 , wherein the conductive material is a conductive inorganic material.  
     
     
         17 . A polycarbonate resin composition according to  claim 14 , wherein the conductive material is hollow carbon fibrils or carbon fibers.  
     
     
         18 . A polycarbonate resin composition according to  claim 17 , wherein the conductive material is hollow carbon fibrils.  
     
     
         19 . A polycarbonate resin composition according to  claim 14 , wherein the hollow carbon fibrils have a number-average outer diameter of 3 to 70 nm.  
     
     
         20 . A polycarbonate resin composition according to  claim 17 , wherein the hollow carbon fibrils have a number-average aspect ratio of not less than 5.  
     
     
         21 . A transport member for electric and electronic parts formed by molding the polycarbonate resin composition as defined in  claim 14 .  
     
     
         22 . A transport member for electric and electronic parts according to  claim 21 , wherein the surface resistance of the member is 10 3  to 10 12  Ω.