Evaporation method, evaporation device and method of fabricating light emitting device

Abstract

The invention provides an evaporation system which is one of deposition devices promoting an efficiency of utilizing an EL material and excellent in uniformity and throughput of forming an EL layer and an evaporation method therefor. Further, the invention provides a method of efficiently vapor-depositing an EL material to a large area substrate. Further, the invention provides a system capable of avoiding an impurity from mixing to the EL material. An evaporation system of the invention is featured in moving a substrate and an evaporation source relative to each other. That is, the invention is featured in that in the evaporation system, an evaporation source holder installed with a vessel filled with an evaporation material is moved by a certain pitch relative to a substrate or the substrate is moved by a certain pitch relative to the evaporation source. Further, the invention is featured in that a vessel is filled with a refined evaporation material and carried and thereafter, the vessel is directly installed to the evaporation system which is a deposition device to carry out evaporation.

What is claimed is:  
     
         1 . An evaporation method comprising: 
 successively moving an evaporation source holder installed with a plurality of vessels filled with an evaporation material in an X axis direction of a substrate; and    successively moving the evaporation source holder in a Y axis direction of the substrate,    wherein the evaporation source holder is moved so as to overlap evaporation ranges of the evaporation material.    
     
     
         2 . The evaporation method according to  claim 1 , wherein the evaporation source holder is moved to overlap evaporation ranges of the evaporation material.  
     
     
         3 . An evaporation method comprising: 
 moving an evaporation source holder installed with a plurality of vessels filled with an evaporation material in an X axis direction by a certain pitch; and    moving the evaporation source holder in a Y axis direction by a certain pitch.    
     
     
         4 . The evaporation method according to  claim 3 , wherein the evaporation source holder is moved to overlap evaporation ranges of the evaporation material.  
     
     
         5 . An evaporation method comprising: 
 moving an evaporation source holder installed with a plurality of vessels filled with an evaporation material in an X axis direction by a certain pitch by a plurality of times; and    moving the evaporation source holder in a Y axis direction by a certain pitch by a plurality of times.    
     
     
         6 . The evaporation method according to  claim 5 , wherein the evaporation source holder is moved to overlap evaporation ranges of the evaporation material.  
     
     
         7 . An evaporation method comprising: 
 moving an evaporation source holder installed with a plurality of vessels filled with an evaporation material in an X axis direction by a certain pitch; and    after finishing an evaporation in the X axis direction, moving the evaporation source holder in a Y axis direction by a certain pitch.    
     
     
         8 . The evaporation method according to  claim 7 , wherein the evaporation source holder is moved to overlap evaporation ranges of the evaporation material.  
     
     
         9 . An evaporation method by using an evaporation device comprising a plurality of vessels having opening portions filled with an evaporation material, means for heating the vessel, a shutter on an upper side of the vessel and an evaporation source holder arranged with the vessel, the evaporation method comprising: 
 moving the evaporation source holder in the X axis direction by a certain pitch while sublimating the evaporation material by the heating means to finish evaporation of an object to be deposited in the X axis direction;    moving the evaporation source holder in the Y axis direction by a certain pitch to finish evaporation of the object to be deposited in the Y axis direction after finishing the evaporation in the X axis direction; and    returning the evaporation source holder to a position of starting the evaporation in a state of arranging the shutter on an upper side of the opening portion after finishing the evaporation in the Y axis direction.    
     
     
         10 . The evaporation method according to  claim 9 , wherein the evaporation source holder is moved to overlap evaporation ranges of the evaporation material.  
     
     
         11 . An evaporation method using an evaporation device comprising a plurality of vessels filled with an evaporation material, means for heating the vessel and a first through a fourth evaporation holder installed with the vessel, the evaporation method comprising: 
 moving the first evaporation source holder in an X axis direction by a certain pitch and thereafter moving the first evaporation source holder in a Y axis direction by a certain pitch while sublimating the evaporation material by the heating means;    moving the second evaporation source holder in the X axis direction by a certain pitch and thereafter moving the second evaporation source holder in the Y axis direction by a certain pitch;    moving the third evaporation holder in the X axis direction by a certain pitch and thereafter moving the third evaporation source holder in the Y axis direction by a certain pitch; and    moving the fourth evaporation source holder in the X axis direction by a certain pitch and thereafter moving the fourth evaporation source holder in the Y axis direction by a certain pitch.    
     
     
         12 . The evaporation method according to  claim 11 , wherein the evaporation source holder is moved to overlap evaporation ranges of the evaporation material.  
     
     
         13 . An evaporation method comprising: 
 installing a second vessel in which a first vessel filled with an evaporation material is hermetically sealed and an evaporation source holder at an installing chamber including depressurizing means and carrying means;    bringing an atmosphere of the installing chamber into a depressurized state by the depressurizing means;    taking out the first vessel by opening the second vessel by the carrying means; and    installing the first vessel to the evaporation source holder.    
     
     
         14 . An evaporation method comprising: 
 installing an evaporation source holder at an installing chamber including pressurizing means, carrying means and a base;    installing a second vessel in which a first vessel filled with an evaporation material is hermetically sealed at the base;    bringing an atmosphere of the installing chamber into a depressurized state by depressurizing means;    taking out the first vessel by opening the second vessel by the carrying means; and    installing the first vessel to the evaporation source holder to carry out evaporation.    
     
     
         15 . The evaporation method according to  claim 14 , wherein the evaporation is carried out by installing the first vessel to the evaporation source holder by rotating or moving the base.  
     
     
         16 . A method of fabricating a light emitting device comprising a first through a fourth organic compound layer by using an evaporation device comprising a plurality of vessels filled with an evaporation material, means for heating the vessel and a first through a fourth evaporation source holder installed with the vessel, the method comprising: 
 moving the first evaporation source holder in an X axis direction by a certain pitch and thereafter moving the first evaporation source holder in a Y axis direction by a certain pitch while sublimating the evaporation material by the heating means to form the first organic compound layer;    moving the second evaporation source holder in the X direction by a certain pitch and thereafter moving the second evaporation source holder in the Y axis direction by a certain pitch to form the second organic compound layer on the first organic compound layer;    moving the third evaporation source holder in the X axis direction by a certain pitch and thereafter moving the third evaporation source holder in the Y axis direction by a certain pitch to form the third organic compound layer on the second organic compound layer; and    moving the fourth evaporation source holder in the X axis direction by a certain pitch and thereafter moving the fourth evaporation source holder in the Y axis direction by a certain pitch to form the fourth organic compound layer on the third organic compound layer.    
     
     
         17 . A method of fabricating a light emitting device comprising: 
 forming a thin film transistor over a substrate;    forming an insulator over the thin film transistor;    evaporating an evaporation material over the insulator by using an evaporation device including a plurality of vessels filled with an evaporation material, means for heating the vessel and an evaporation source holder installed with the vessel;    moving the evaporation source holder in an X axis direction; and    moving the evaporation source holder in a Y axis direction by a certain pitch,    wherein the evaporation source holder is moved in a state that the evaporation material is sublimated by the heating means.    
     
     
         18 . A method of fabricating a light emitting device by using an evaporation device comprising a plurality of first deposition chambers for forming a film of an organic compound layer and a plurality of second deposition chambers for forming a conductive film, said method comprising: 
 forming the organic compound layer over a substrate in parallel in the plurality of first deposition chambers;    moving the substrate from the first deposition chamber to the second deposition chamber by using carrying means without being exposed to an atmosphere; and    forming the conductive film in contact with the organic compound layer in the second deposition chamber.    
     
     
         19 . A method of fabricating a light emitting device by using an evaporation device comprising first through fourth deposition chambers for forming a film of an organic compound layer over a substrate, a fifth deposition chamber for forming a conductive film, a sixth deposition chamber for forming a protective film and a seventh deposition chamber for pasting together the substrate and a sealing substrate, the method comprising: 
 simultaneously forming the organic compound layer over the substrate in the first through the fourth deposition chambers;    moving the substrate from any one of the first through the fourth deposition chambers to the fifth forming chamber without being exposed to an atmosphere;    forming the conductive film over the organic compound layer in the fifth deposition chamber;    moving the substrate from the fifth deposition chamber to the sixth deposition chamber without being exposed to the atmosphere;    forming the protective film over the conductive film in the sixth deposition chamber;    moving the substrate from the sixth chamber to the seventh deposition chamber without being exposed to the atmosphere; and    pasting together the substrate and the sealing substrate formed with a sealing member in the seventh deposition chamber.    
     
     
         20 . A method of forming a light emitting device by using an evaporation device comprising a first through a fourth deposition chamber for forming a film of an organic compound layer over a substrate, a plurality of fifth deposition chambers for forming a conductive film, a plurality of sixth deposition chambers for forming a protective film and a plurality of seventh deposition chambers for pasting together the substrate and a sealing substrate, the method comprising: 
 forming the organic compound layer over the substrate in the first through the fourth deposition chambers;    carrying the substrate formed with the organic compound layer to any one of the fifth deposition chambers;    forming the conductive film over the organic compound layer in the fifth deposition chamber;    carrying the substrate formed with the conductive film to any one of the sixth deposition chambers;    forming the protective film over the conductive film in the sixth deposition chamber;    carrying the substrate formed with the protective film to any one of the seventh deposition chambers; and    pasting together the substrate and the sealing substrate in the seventh deposition chamber.    
     
     
         21 . A method of fabricating a light emitting device comprising a light emitting element having first through third colors over a substrate, the method comprising: 
 forming the light emitting element having the first color over the substrate in a first deposition chamber;    moving the substrate from the first deposition chamber to the second deposition chamber without being exposed to an atmosphere;    forming the light emitting element having the second color over the substrate in a second forming chamber;    moving the light emitting element from the second deposition chamber to the third deposition chamber without being exposed to the atmosphere; and    forming the light emitting element having the third color over the substrate in a third deposition chamber.    
     
     
         22 . A method of fabricating a light emitting device comprising an organic compound layer of a single color formed over a substrate and first through third color conversion layers formed at a sealing substrate opposed to the substrate, said method comprising: 
 forming the organic compound layer over the substrate in a first deposition chambers;    moving the substrate from the first deposition chamber to a second deposition chamber by using carrying means without being exposed to an atmosphere;    forming a conductive film in contact with the organic compound layer in a second deposition chamber; and    pasting together the substrate and the sealing substrate without being exposed to the atmosphere.    
     
     
         23 . The method of fabricating a light emitting device according to  claim 22 , wherein a sealing agent is formed at the sealing substrate.  
     
     
         24 . The method of fabricating a light emitting device according to  claim 22 , wherein a sealing agent is formed at the substrate.  
     
     
         25 . A method of fabricating a light emitting device comprising an organic compound layer of a single color formed over a substrate and first through third color filters formed at a sealing substrate opposed to the substrate, the method comprising: 
 forming the organic compound layer over the substrate in a first deposition chamber;    moving the substrate from the first deposition chamber to a second deposition chamber by using carrying means without being exposed to an atmosphere;    forming a conductive film in contact with the organic compound layer in the second deposition chamber; and    pasting together the substrate and the sealing substrate without being exposed to the atmosphere.    
     
     
         26 . The method of fabricating a light emitting device according to  claim 25 , wherein a sealing agent is formed at the sealing substrate.  
     
     
         27 . The method of fabricating a light emitting device according to  claim 25 , wherein a sealing agent is formed at the substrate.  
     
     
         28 . An evaporation holder comprising: 
 a vessel filled with an evaporation material;    a filter provided at the vessel;    means for heating the vessel and    a shutter provided over the vessel.    
     
     
         29 . A evaporation source holder according to  claim 28 , wherein the evaporation source holder is incorporated into an evaporation device, and the evaporation device comprises means for moving the evaporation source holder.  
     
     
         30 . A evaporation source holder according to  claim 28 , wherein the evaporation source holder is incorporated into an evaporation device, and the evaporation device comprises means for moving the evaporation source holder.  
     
     
         31 . An evaporation source holder comprising: 
 a plurality of vessels filled with an evaporation material;    first heating means for heating the vessel;    a filter provided over the vessel;    second heating means for heating the filter; and    a shutter provided between the first heating means and the second heating means.    
     
     
         32 . A evaporation source holder according to  claim 31 , wherein the evaporation source holder is incorporated into an evaporation device, and the evaporation device comprises means for moving the evaporation source holder.  
     
     
         33 . An evaporation source holder comprising: 
 a plurality of vessels filled with an evaporation material;    a first heating means for heating the vessel;    a filter provided above the vessel;    a second heating means for heating the filter; and    a shutter provided between the first heating means and a second heating means,    wherein a heating temperature by the second heating means is lower than a heating temperature by the first heating means.    
     
     
         34 . A evaporation source holder according to  claim 33 , wherein the evaporation source holder is incorporated into an evaporation device, and the evaporation device comprises means for moving the evaporation source holder.  
     
     
         35 . An evaporation device comprising: 
 carrying means;    means for bringing a processing chamber into a depressurized state;    an installing chamber; and    a deposition chamber provided in contact with the installing chamber,    wherein the installing chamber includes means for moving an evaporation source holder from the processing chamber to the deposition chamber    
     
     
         36 . An evaporation device comprising: 
 means for carrying a second vessel for sealing a first vessel filled with an evaporation material;    means for bringing a processing chamber into a depressurized state;    an installing chamber including a base for arranging the first vessel;    a deposition chamber provided in contact with the installing chamber; and    means for moving an evaporation source holder from the processing chamber to the deposition chamber,    wherein the base has a rotating function.    
     
     
         37 . An evaporation device comprising: 
 substrate holding means; and    means for moving an evaporation source holder: 
 wherein the evaporation source holder comprises a vessel filled with an evaporation material, means for heating the vessel, and a shutter provided over the vessel, and  
 wherein the means for moving the evaporation source holder has a function of moving the evaporation source holder in an X axis direction by a certain pitch and moving the evaporation source holder in a Y axis direction by a certain pitch.  
   
     
     
         38 . An evaporation device comprising: 
 substrate holding means; and    means for moving an evaporation source holder,    wherein the evaporation source holder comprises a vessel filled with an evaporation material, means for heating the vessel, and a shutter provided over the vessel, and    wherein the means for moving the evaporation source holder has a function of moving the evaporation source holder so as to overlap evaporation ranges of the evaporation material.    
     
     
         39 . An evaporation device comprising: 
 a deposition chamber;    substrate holding means provided at the deposition chamber;    mask holding means;    an evaporation source holder;    means for applying a voltage to a mask; and    means for moving the evaporation source holder;    wherein the evaporation source holder comprises a plurality of evaporation sources, means for heating the evaporation source, and a shutter provided over the evaporation source.    
     
     
         40 . A vessel for carrying a vessel filled with a material comprising: 
 an upper vessel; and    a lower vessel,    wherein the upper vessel comprises means for fixing the vessel filled with the material, and the lower vessel comprises means for maintaining inside of the vessel for carrying being depressurized.