Method and apparatus for protecting tooling in a lead-free bath

Abstract

The disclosed embodiments represent a method and apparatus for improving a lead-free electroplating process in the manufacture of semiconductor devices. To prevent the buildup of undesirable copper or bismuth on a conveyor belt and the associated tooling used to transport integrated circuit devices through an electroplating bath, a metal more noble than copper or bismuth, depending on which is used as a plating metal, is plated onto the surface of the conveyor belt and associated tooling.

What is claimed is:  
     
         1 . A plating machine clip for securing a device for processing in an electrolytic bath, comprising: 
 a plating machine clip having a metal more noble than copper plated thereon.    
     
     
         2 . The plating machine clip of  claim 1  wherein the metal comprises gold.  
     
     
         3 . The plating machine clip of  claim 1  wherein the metal comprises silver.  
     
     
         4 . The plating machine clip of  claim 1  wherein the metal comprises palladium.  
     
     
         5 . The plating machine clip of  claim 1  wherein the metal comprises platinum.  
     
     
         6 . A plating machine clip for securing a device for processing in an electrolytic bath, comprising: 
 a plating machine clip having a metal more noble than bismuth plated thereon.    
     
     
         7 . The plating machine clip of  claim 6  wherein the metal comprises gold.  
     
     
         8 . The plating machine clip of  claim 6  wherein the metal comprises silver.  
     
     
         9 . The plating machine clip of  claim 6  wherein the metal comprises palladium.  
     
     
         10 . The plating machine clip of  claim 6  wherein the metal comprises platinum.  
     
     
         11 . A plating machine hook for securing a device in an electrolytic bath, comprising: 
 a plating machine hook having a metal more noble than copper plated thereon.    
     
     
         12 . The plating machine hook of  claim 11  wherein the metal comprises gold.  
     
     
         13 . The plating machine hook of  claim 11  wherein the metal comprises silver.  
     
     
         14 . The plating machine hook of  claim 11  wherein the metal comprises palladium.  
     
     
         15 . The plating machine hook of  claim 11  wherein the metal comprises platinum.  
     
     
         16 . A plating machine hook for securing a device in an electrolytic bath, comprising: 
 a plating machine hook having a metal more noble than bismuth plated thereon.    
     
     
         17 . The plating machine hook of  claim 16  wherein the metal comprises gold.  
     
     
         18 . The plating machine hook of  claim 16  wherein the metal comprises silver.  
     
     
         19 . The plating machine hook of  claim 16  wherein the metal comprises palladium.  
     
     
         20 . The plating machine hook of  claim 16  wherein the metal comprises platinum.  
     
     
         21 . A plating machine conveyor belt for conveying a device through an electrolytic bath, comprising: 
 a plating machine conveyor belt having a metal more noble than copper plated thereon.    
     
     
         22 . The plating machine conveyor belt of  claim 21  wherein the metal comprises gold.  
     
     
         23 . The plating machine conveyor belt of  claim 21  wherein the metal comprises silver.  
     
     
         24 . The plating machine conveyor belt of  claim 21  wherein the metal comprises palladium.  
     
     
         25 . The plating machine conveyor belt of  claim 21  wherein the metal comprises platinum.  
     
     
         26 . A plating machine conveyor belt for conveying a device through an electrolytic bath, comprising: 
 a plating machine conveyor having a metal more noble than bismuth plated thereon.    
     
     
         27 . The plating machine conveyor belt of  claim 26  wherein the metal comprises gold.  
     
     
         28 . The plating machine conveyor belt of  claim 26  wherein the metal comprises silver.  
     
     
         29 . The plating machine conveyor belt of  claim 26  wherein the metal comprises palladium.  
     
     
         30 . The plating machine conveyor belt of  claim 26  wherein the metal comprises platinum.  
     
     
         31 . A plating machine for disposing a first metal comprising copper on a device, comprising: 
 an electrolytic bath containing an electrolytic solution comprising the first metal;    a conveyor belt adapted to transport the device through the electrolytic bath, the conveyor belt having a second metal more noble than copper plated thereon to prevent the first metal from depositing on the conveyor belt via immersion plating; and    a motor adapted to drive the conveyor belt.    
     
     
         32 . The plating machine of  claim 31  wherein the device is an integrated circuit device.  
     
     
         33 . The plating machine of  claim 31  wherein the second metal comprises gold.  
     
     
         34 . The plating machine of  claim 31  wherein the second metal comprises silver.  
     
     
         35 . The plating machine of  claim 31  wherein the second metal comprises palladium.  
     
     
         36 . The plating machine of  claim 31  wherein the second metal comprises platinum.  
     
     
         37 . The plating machine of  claim 31 , comprising a clip adapted to secure the device to the conveyor belt, the clip having a third metal more noble than copper plated thereon.  
     
     
         38 . The plating machine of  claim 37 , wherein the third metal comprises gold.  
     
     
         39 . The plating machine of  claim 37 , wherein the third metal comprises silver.  
     
     
         40 . The plating machine of  claim 37 , wherein the third metal comprises palladium.  
     
     
         41 . The plating machine of  claim 37 , wherein the third metal comprises platinum.  
     
     
         42 . A plating machine for disposing a first metal comprising bismuth on a device, comprising: 
 an electrolytic bath containing an electrolytic solution comprising the first metal;    a conveyor belt adapted to transport the device through the electrolytic bath, the conveyor belt having a second metal more noble than bismuth plated thereon to prevent the first metal from depositing on the conveyor belt via immersion plating; and    a motor adapted to drive the conveyor belt.    
     
     
         43 . The plating machine of  claim 42  wherein the device is an integrated circuit device.  
     
     
         44 . The plating machine of  claim 42  wherein the second metal comprises gold.  
     
     
         45 . The plating machine of  claim 42  wherein the second metal comprises silver.  
     
     
         46 . The plating machine of  claim 42  wherein the second metal comprises palladium.  
     
     
         47 . The plating machine of  claim 42  wherein the second metal comprises platinum.  
     
     
         48 . The plating machine of  claim 42 , comprising a clip adapted to secure the device to the conveyor belt, the clip having a third metal more noble than bismuth plated thereon.  
     
     
         49 . The plating machine of  claim 48 , wherein the third metal comprises gold.  
     
     
         50 . The plating machine of  claim 48 , wherein the third metal comprises silver.  
     
     
         51 . The plating machine of  claim 48 , wherein the third metal comprises palladium.  
     
     
         52 . The plating machine of  claim 48 , wherein the third metal comprises platinum.  
     
     
         53 . A method of electroplating at least a portion of an integrated circuit package, the method comprising the acts of: 
 securing the integrated circuit device to a device that is plated with a metal more noble than copper; and    electroplating the at least a portion of the integrated circuit device in a plating bath;    
     
     
         54 . The method of  claim 53 , further comprising the act of pre-cleaning the at least a portion of the integrated circuit device.  
     
     
         55 . The method of  claim 53 , further comprising the act of rinsing the at least a portion of the integrated circuit device.  
     
     
         56 . The method of  claim 53 , further comprising the act of pre-dipping the at least a portion of the integrated circuit device in plating acid.  
     
     
         57 . The method of  claim 53 , further comprising the act of cleaning the at least a portion of the integrated circuit device.  
     
     
         58 . The method of  claim 53 , further comprising the act of drying the at least a portion of the integrated circuit device.  
     
     
         59 . The method of  claim 53 , further comprising the act of disposing a metal comprising an Sn/Cu alloy in the plating bath.  
     
     
         60 . The method of  claim 53 , further comprising the act of transporting the integrated circuit device through the plating bath.  
     
     
         61 . A method of electroplating at least a portion of an integrated circuit device, the method comprising the acts of: 
 securing the integrated circuit device to a device that is plated with a metal more noble than bismuth; and    electroplating the at least a portion of the integrated circuit device in a plating bath.    
     
     
         62 . The method of  claim 61 , further comprising the act of pre-cleaning the at least a portion of the integrated circuit device.  
     
     
         63 . The method of  claim 61 , further comprising the act of rinsing the at least a portion of the integrated circuit device.  
     
     
         64 . The method of  claim 61 , further comprising the act of pre-dipping the at least a portion of the integrated circuit device in plating acid.  
     
     
         65 . The method of  claim 61 , further comprising the act of cleaning the at least a portion of the integrated circuit device.  
     
     
         66 . The method of  claim 61 , further comprising the act of drying the at least a portion of the integrated circuit device.  
     
     
         67 . The method of  claim 61 , further comprising the act of disposing a metal comprising an Sn/Bi alloy in the plating bath.  
     
     
         68 . The method of  claim 61 , further comprising the act of transporting the integrated circuit device through the plating bath.  
     
     
         69 . A plating machine, comprising: 
 a reservoir adapted to contain an electrolytic solution comprising copper;    a conveyor adapted to transport a device through the reservoir, the conveyor having a metal more noble than copper disposed there on; and    a motor adapted to drive the conveyor.    
     
     
         70 . The plating machine of  claim 69  wherein the metal comprises gold.  
     
     
         71 . The plating machine of  claim 69  wherein the metal comprises silver.  
     
     
         72 . The plating machine  claim 69  wherein the metal comprises palladium.  
     
     
         73 . The plating machine of  claim 69  wherein the metal comprises platinum.  
     
     
         74 . The plating machine of  claim 69 , comprising a clip adapted to secure the device to the conveyor, the clip having a second metal more noble than copper plated thereon.  
     
     
         75 . The plating machine of  claim 74 , wherein the second metal comprises gold.  
     
     
         76 . The plating machine of  claim 74 , wherein the second metal comprises silver.  
     
     
         77 . The plating machine of  claim 74 , wherein the second metal comprises palladium.  
     
     
         78 . The plating machine of  claim 74 , wherein the second metal comprises platinum.  
     
     
         79 . A plating machine, comprising: 
 a reservoir adapted to contain an electrolytic solution comprising bismuth;    a conveyor adapted to transport a device through the reservoir, the conveyor having a metal more noble than bismuth disposed there on; and    a motor adapted to drive the conveyor.    
     
     
         80 . The plating machine of  claim 79  wherein the metal comprises gold.  
     
     
         81 . The plating machine of  claim 79  wherein the metal comprises silver.  
     
     
         82 . The plating machine  claim 79  wherein the metal comprises palladium.  
     
     
         83 . The plating machine of  claim 79  wherein the metal comprises platinum.  
     
     
         84 . The plating machine of  claim 79 , comprising a clip adapted to secure the device to the conveyor, the clip having a second metal more noble than bismuth plated thereon.  
     
     
         85 . The plating machine of  claim 84 , wherein the second metal comprises gold.  
     
     
         86 . The plating machine of  claim 84 , wherein the second metal comprises silver.  
     
     
         87 . The plating machine of  claim 84 , wherein the second metal comprises palladium.  
     
     
         88 . The plating machine of  claim 84 , wherein the second metal comprises platinum.  
     
     
         89 . A method of using a plating machine, the plating machine having a conveyor, the method comprising the acts of: 
 securing a device to be plated to the conveyor, the conveyor having a metal plated thereon, the metal being more noble than copper;    moving the conveyor to immerse the device in an electrolytic bath; and    plating a second metal onto at least a portion of the device to be plated.    
     
     
         90 . The method set forth in  claim 89 , further comprising the act of plating the metal more noble than copper onto the conveyor.  
     
     
         91 . The method set forth in  claim 89  wherein the metal more noble than copper comprises gold.  
     
     
         92 . The method set forth in  claim 89  wherein the metal more noble than copper comprises silver.  
     
     
         93 . The method set forth in  claim 89  wherein the metal more noble than copper comprises palladium.  
     
     
         94 . The method set forth in  claim 89  wherein the metal more noble than copper comprises platinum.  
     
     
         95 . A method of using a plating machine, the plating machine having a conveyor, the method comprising the acts of: 
 securing a device to be plated to the conveyor, the conveyor having a metal plated thereon, the metal being more noble than bismuth;    moving the conveyor to immerse the device in an electrolytic bath; and    plating a second metal onto at least a portion of the device to be plated.    
     
     
         96 . The method set forth in  claim 95 , further comprising the act of plating the metal more noble than bismuth onto the conveyor.  
     
     
         97 . The method set forth in  claim 95  wherein the metal more noble than bismuth comprises gold.  
     
     
         98 . The method set forth in  claim 95  wherein the metal more noble than bismuth comprises silver.  
     
     
         99 . The method set forth in  claim 95  wherein the metal more noble than bismuth comprises palladium.  
     
     
         100 . The method set forth in  claim 95  wherein the metal more noble than bismuth comprises platinum.  
     
     
         101 . A method of plating a conveyor belt for use in a plating machine, the method comprising the acts of: 
 providing a conveyor belt; and    plating a metal more noble than copper onto the conveyor belt so that the conveyor belt is adapted for use in the plating machine without accumulating deposits of a plating metal thereon.    
     
     
         102 . The method of  claim 101  wherein the metal more noble than copper comprises gold.  
     
     
         103 . The method of  claim 101  wherein the metal more noble than copper comprises silver.  
     
     
         104 . The method of  claim 102  wherein the act of plating comprises employing a plating solution comprising Engelhard-Clal Supermex 230 Immersion Au solution.  
     
     
         105 . The method of  claim 101  wherein the metal more noble than copper comprises palladium.  
     
     
         106 . The method of  claim 105  wherein the act of plating comprises employing a plating solution comprising Pd/Cl dissolved in HCl.  
     
     
         107 . The method of  claim 101  wherein the metal more noble than copper comprises platinum.  
     
     
         108 . A method of plating a conveyor belt for use in a plating machine, the method comprising the acts of: 
 providing a conveyor belt; and    plating a metal more noble than bismuth onto the conveyor belt so that the conveyor belt is adapted for use in the plating machine without accumulating deposits of a plating metal thereon.    
     
     
         109 . The method of  claim 108  wherein the metal more noble than bismuth comprises gold.  
     
     
         110 . The method of  claim 108  wherein the metal more noble than bismuth comprises silver.  
     
     
         111 . The method of  claim 109  wherein the act of plating comprises employing a plating solution comprising Engelhard-Clal Supermex 230 Immersion Au solution.  
     
     
         112 . The method of  claim 108  wherein the metal more noble than bismuth comprises palladium.  
     
     
         113 . The method of  claim 112  wherein the act of plating comprises employing a plating solution comprising Paladium Chloride HCL.  
     
     
         114 . The method of  claim 108  wherein the metal more noble than bismuth comprises platinum.