US2004025444A1PendingUtilityA1

Fenton's reagent composition for chemical-mechanical polishing, method of using same, and substrate treated with same

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Assignee: EKC TECHNOLOGY INCPriority: Feb 11, 2002Filed: Mar 19, 2003Published: Feb 12, 2004
Est. expiryFeb 11, 2022(expired)· nominal 20-yr term from priority
Inventors:Robert J. SmallXiaowei Shang
H10P 52/403Y02P20/582C09K 3/1463C09K 3/1436C09G 1/02C23F 3/00B24D 3/00C09K 3/1445G11B 5/3163C01B 33/023B24B 37/044C23F 3/04C03C 19/00G11B 5/3169H10P 52/402H10P 52/00
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Claims

Abstract

The present invention provides a composition for chemical-mechanical polishing which comprises an oxidizing agent, an abrasive, and a Fenton's reagent. The oxidizing agent comprises a per compound, such as periodic acid, a peroxide, or a persulfate. The abrasive comprises a metal oxide, such as colloidal silica, alumina, or spinel. The Fenton's reagent comprises a metal selected from a group consisting of metals in Group 1(b) and Group 8, such as iron, copper and silver. The composition is believed to be effective by virtue of the interaction between the oxidizing agent and the Fenton's reagent that is at least partially linked to the surface of the abrasive. The invention further provides a method that employs the composition in the polishing of a feature or layer, such as a metal film, on a substrate surface. The invention additionally provides a substrate produced this method.

Claims

exact text as granted — not AI-modified
1 . A composition for chemical-mechanical polishing, comprising: 
 at least one oxidizing agent;    at least one abrasive; and    at least one Fenton's reagent capable of reacting with the oxidizing agent to activate free radicals.    
     
     
         2 . The composition of  claim 1 , wherein the oxidizing agent comprises a per compound.  
     
     
         3 . The composition of  claim 1 , wherein the oxidizing agent is selected from a group consisting of periodic acid, a peroxide, and any combination thereof.  
     
     
         4 . The composition of  claim 1 , wherein the oxidizing agent is selected from a group consisting of a hydroperoxide, a hydrogen peroxide, and any combination thereof.  
     
     
         5 . The composition of  claim 1 , wherein the oxidizing agent is in an amount of from about 0.01 to about 30 weight percent relative to the composition.  
     
     
         6 . The composition of  claim 1 , wherein the oxidizing agent is in an amount of from about 0.01 to about 10 weight percent relative to the composition.  
     
     
         7 . The composition of  claim 1 , wherein the oxidizing agent is in an amount of from about 0.01 to about 6 weight percent relative to the composition.  
     
     
         8 . The composition of  claim 1 , wherein the at least one abrasive comprises a metal oxide.  
     
     
         9 . The composition of  claim 1 , wherein the at least one abrasive comprises a material selected from a group consisting of alumina, ceria, germania, silica, spinel, titania, an oxide of tungsten, zirconia, and any combination thereof.  
     
     
         10 . The composition of  claim 1 , wherein the at least one abrasive comprises a metal oxide produced by a process selected from a group consisting of a sol-gel process, a hydrothermal process, a hydrolytic process, a plasma process, a fuming process, a precipitation process, and any combination thereof.  
     
     
         11 . The composition of  claim 1 , wherein the at least one abrasive comprises a resinous abrasive.  
     
     
         12 . The composition of  claim 1 , wherein the at least one abrasive comprises a material selected from a group consisting of a polyacrylic acid, a polymethylacrylic acid, a polymelamine, a particle of an ion exchange resin, and any combination thereof.  
     
     
         13 . The composition of  claim 1 , wherein the at least one abrasive comprises a plastic abrasive.  
     
     
         14 . The composition of  claim 1 , wherein the at least one abrasive comprises a material selected from a group consisting of a polyacrylic acid, a polymethylacrylic acid, a polyvinyl alcohol, and any combination thereof.  
     
     
         15 . The composition of  claim 1 , wherein the Fenton's reagent comprises a metal selected from a group consisting of metals in Group 1 (b) and Group 8.  
     
     
         16 . The composition of  claim 1 , wherein the Fenton's reagent comprises a metal selected from a group consisting of iron, copper, silver, and any combination thereof.  
     
     
         17 . The composition of  claim 1 , wherein the Fenton's reagent comprises a metal selected from a group consisting of iron, copper, and any combination thereof.  
     
     
         18 . The composition of  claim 1 , wherein the Fenton's reagent comprises a material selected from a group consisting of a metal oxide, a metal acetate, a source of ionic metal, and any combination thereof.  
     
     
         19 . The composition of  claim 1 , wherein the Fenton's reagent is substantially insoluble in the composition.  
     
     
         20 . The composition of  claim 1 , wherein the Fenton's reagent is at least partially linked to the abrasive.  
     
     
         21 . The composition of  claim 1 , wherein the at least one abrasive and the Fenton's reagent together are in an amount of from about 0.01 to about 25 weight percent relative to the composition.  
     
     
         22 . The composition of  claim 1 , wherein the at least one abrasive and the Fenton's reagent together are in an amount of from about 0.01 to about 10 weight percent relative to the composition.  
     
     
         23 . The composition of  claim 1 , wherein the at least one abrasive and the Fenton's reagent together are in an amount of from about 0.01 to about 5 weight percent relative to the composition.  
     
     
         24 . The composition of  claim 20 , further comprising at least one other abrasive that is free of a Fenton's reagent.  
     
     
         25 . The composition of  claim 24 , wherein the other abrasive is in an amount of from about 0.01 to about 30 weight percent relative to the composition.  
     
     
         26 . The composition of  claim 24 , wherein the other abrasive is in an amount of from about 0.01 to about 20 weight percent relative to the composition.  
     
     
         27 . The composition of  claim 24 , wherein the other abrasive is in an amount of from about 0.01 to about 10 weight percent relative to the composition.  
     
     
         28 . The composition of  claim 1 , further comprising an additive selected from a group consisting of a polish-enhancement agent, a complexing agent, a stabilization agent, a surfactant, a dispersion agent, a pH-adjusting agent, and any combination thereof.  
     
     
         29 . The composition of  claim 28 , wherein the additive is present in an amount of from about 0.001 to about 2 weight percent relative to the composition.  
     
     
         30 . The composition of  claim 1 , wherein a pH level of the composition is from about 2 to about 7.  
     
     
         31 . The composition of  claim 1 , wherein a pH level of the composition is from about 2.5 to about 4.5.  
     
     
         32 . The composition of  claim 1 , wherein the oxidizing agent is present in a prepared composition that lacks a Fenton's reagent.  
     
     
         33 . The composition of  claim 1 , the composition sufficient for chemical-mechanical polishing of a substrate surface having a feature thereon comprising a first material selected from a group consisting of aluminum, copper, titanium, tungsten, any alloy thereof, and any combination thereof.  
     
     
         34 . The composition of  claim 33 , the composition sufficient for chemical-mechanical polishing of the substrate surface comprising a second material adjacent the feature, the second material selected from a group consisting of tantalum, tantalum nitride, titanium, titanium nitride, titanium tungsten, tungsten, and any combination thereof.  
     
     
         35 . A composition for chemical-mechanical polishing, comprising: 
 at least one oxidizing agent comprising periodic acid;    at least one abrasive; and    at least one Fenton's reagent capable of reacting with the oxidizing agent to activate free radicals.    
     
     
         36 . The composition of  claim 35 , wherein the oxidizing agent is in an amount of from about 0.01 to about 30 weight percent relative to the composition.  
     
     
         37 . The composition of  claim 35 , wherein the at least one abrasive comprises a material selected from a group consisting of alumina, ceria, germania, silica, spinel, titania, an oxide of tungsten, zirconia, and any combination thereof.  
     
     
         38 . The composition of  claim 35 , wherein the at least one abrasive comprises silica selected from a group consisting of colloidal silica or a combination of colloidal silica and fumed silica.  
     
     
         39 . The composition of  claim 35 , wherein the Fenton's reagent comprises a metal selected from a group consisting of metals in Group 1 (b) and Group 8.  
     
     
         40 . The composition of  claim 35 , wherein the Fenton's reagent comprises a metal selected from a group consisting of iron, copper, silver, and any combination thereof.  
     
     
         41 . The composition of  claim 35 , wherein the Fenton's reagent comprises a metal selected from a group consisting of iron, copper, and any combination thereof.  
     
     
         42 . The composition of  claim 35 , wherein the Fenton's reagent comprises a material selected from a group consisting of a metal oxide, a metal acetate, a source of ionic metal, and any combination thereof.  
     
     
         43 . The composition of  claim 35 , wherein the Fenton's reagent is at least partially linked to the abrasive.  
     
     
         44 . The composition of  claim 35 , wherein the at least one abrasive and the Fenton's reagent together are in an amount of from about 0.01 to about 25 weight percent relative to the composition.  
     
     
         45 . The composition of  claim 35 , wherein a pH level of the composition is from about 2 to about 7.  
     
     
         46 . A method of polishing a substrate surface having at least one feature thereon comprising a metal, comprising: 
 providing the composition of any one of claims  1  and  35 ; and    chemical-mechanical polishing the feature with the composition.    
     
     
         47 . The method of  claim 46 , wherein said providing comprises combining the at least one abrasive and the at least one Fenton's reagent, with a prepared composition comprising the oxidizing agent.  
     
     
         48 . The method of  claim 46 , wherein the metal is selected from a group consisting of aluminum, copper, titanium, tungsten, any alloy thereof, ruthenium, an oxide of ruthenium, platinum, and any combination thereof.  
     
     
         49 . The method of  claim 46 , wherein the feature is adjacent a material selected from a group consisting of tantalum, tantalum nitride, titanium, titanium nitride, titanium tungsten, tungsten, and any combination thereof.  
     
     
         50 . The method of  claim 46 , wherein the chemical-mechanical polishing comprises applying a pressure of from about 1 to about 6 pounds per square inch to the feature.  
     
     
         51 . The method of  claim 46 , said method sufficient to remove the metal at a rate of from about 100 to about 15,000 Å per minute.  
     
     
         52 . The method of  claim 46 , said method sufficient to remove the metal at a rate of from about 100 to about 10,000 Å per minute.  
     
     
         53 . The method of  claim 46 , said method sufficient to provide the substrate surface at from about zero to about 40 percent within wafer non-uniformity.  
     
     
         54 . The method of  claim 46 , said method sufficient to provide the substrate surface at from about zero to about 12 percent within wafer non-uniformity.  
     
     
         55 . The method of  claim 46 , said method sufficient to provide the substrate surface at from about zero to about 7 percent within wafer non-uniformity.  
     
     
         56 . The method of  claim 46 , said method sufficient to provide the substrate surface wherein any micro-scratch thereon produced during the chemical-mechanical polishing is less than about 20 Å.  
     
     
         57 . A substrate having a surface comprising at least one feature thereon comprising a metal, said substrate produced by the method of  claim 46 .  
     
     
         58 . The substrate of  claim 46 , wherein the metal is selected from a group consisting of aluminum, copper, titanium, tungsten, any alloy thereof, ruthenium, an oxide of ruthenium, platinum, and any combination thereof.  
     
     
         59 . The substrate of  claim 46 , wherein the feature is adjacent a material selected from a group consisting of tantalum, tantalum nitride, titanium, titanium nitride, titanium tungsten, tungsten, and any combination thereof.  
     
     
         60 . The substrate of  claim 46 , the substrate surface having from about zero to about 40 percent within wafer non-uniformity.  
     
     
         61 . The substrate of  claim 46 , the substrate surface having from about zero to about 12 percent within wafer non-uniformity.  
     
     
         62 . The substrate of  claim 46 , the substrate surface having from about zero to about 7 percent within wafer non-uniformity.  
     
     
         63 . The substrate of  claim 46 , wherein any micro-scratch on the substrate surface produced during the chemical-mechanical polishing is less than about 20 Å.

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