Lens and microscope

Abstract

The invention relates to a lens ( 4, 13 ) and a laser processing device comprising a microscope ( 15 ) having a lens, and a laser ( 5 ) which emits a laser beam ( 8, 11 ) for processing a workpiece ( 9 ). The lens ( 4, 13 ) has an outer optic ( 12 ) comprising a central opening in which an inner optic ( 10 ) is arranged.

What is claimed is:  
     
         1 . A lens ( 4 ,  13 ), 
 wherein the lens ( 4 ,  13 ) features an outer optic ( 12 ) having a central opening in which is positioned an inner optic ( 10 ).    
     
     
         2 . The lens ( 4 ,  13 ) as recited in  claim 1 , 
 wherein the inner optic ( 10 ) is a UV optic.    
     
     
         3 . The lens ( 4 ,  13 ) as recited in  claim 1 , 
 wherein the outer optic ( 12 ) is optimized for visible light.    
     
     
         4 . The lens ( 4 ,  13 ) as recited in  claim 1 , 
 wherein the lens ( 4 ,  13 ) is insertable into a microscope ( 15 ).    
     
     
         5 . The lens ( 4 ,  13 ) as recited in  claim 1 , 
 wherein the inner optic ( 10 ) has a different focal length than the outer optic ( 12 ).    
     
     
         6 . A laser processing system comprising a microscope ( 15 ) having a lens ( 4 ,  13 ), and a laser ( 5 ) which emits a laser beam ( 8 ,  11 ) for machining a workpiece ( 9 ), 
 wherein the lens ( 4 ,  13 ) features an outer optic ( 12 ) having a central opening in which is positioned an inner optic ( 10 ).    
     
     
         7 . The laser processing system as recited in  claim 6 , 
 wherein the microscope ( 15 ) is a stereomicroscope.    
     
     
         8 . The laser processing system as recited in  claim 6 , 
 wherein the inner optic ( 10 ) is a UV optic.    
     
     
         9 . The laser processing system as recited in  claim 6 , 
 wherein the outer optic ( 12 ) is optimized for visible light.    
     
     
         10 . The laser processing system as recited in  claim 6 , 
 wherein the inner optic ( 10 ) has a different focal length than the outer optic ( 12 ).    
     
     
         11 . The laser processing system as recited in  claim 6 , 
 wherein the laser beam ( 8 ,  11 ) defines a laser beam path in which the inner optic ( 10 ) is positioned.    
     
     
         12 . The laser processing system as recited in  claim 6 , 
 wherein monitoring light originating from the workpiece defines a monitoring beam path in which the outer optic ( 12 ) is positioned.    
     
     
         13 . The laser processing system as recited in  claim 11 , 
 wherein at least parts of the outer optic ( 12 ) are positioned in the laser beam path.    
     
     
         14 . The laser processing system as recited in  claim 12 , 
 wherein at least parts of the inner optic ( 10 ) are positioned in the monitoring beam path.    
     
     
         21 . (new) The lens as recited in claim  15  wherein the inner optic is disposed outside a plane of the outer optic.  
     
     
         22 . (new) A laser processing system comprising: 
 a laser configured to emit a laser beam for machining a workpiece; and    a microscope including a lens, the lens including an outer optic defining a central opening and an inner optic disposed in the central opening.    
     
     
         23 . (new) The laser processing system as recited in  claim 22  wherein the microscope includes a stereomicroscope.  
     
     
         24 . (new) The laser processing system as recited in  claim 22  wherein the inner optic includes a UV optic.  
     
     
         25 . (new) The laser processing system as recited in  claim 22  wherein the outer optic is optimized for visible light.  
     
     
         26 . (new) The laser processing system as recited in  claim 22  wherein the inner optic has a different focal length than the outer optic.  
     
     
         27 . (new) The laser processing system as recited in  claim 22  wherein the laser beam defines a laser beam path, the inner optic being disposed in the laser beam path.  
     
     
         28 . (new) The laser processing system as recited in  claim 27  wherein at least a part of the outer optic is disposed in the laser beam path.  
     
     
         29 . (new) The laser processing system as recited in  claim 22  wherein the outer optic is disposed in a monitoring beam path of monitoring light originating from the workpiece.