US2004020779A1PendingUtilityA1

Method and device for producing a galvanic layer on a substrate surface

Priority: Oct 9, 2001Filed: Oct 8, 2002Published: Feb 5, 2004
Est. expiryOct 9, 2021(expired)· nominal 20-yr term from priority
C25D 7/0678C25D 7/0692C25D 5/16C25D 5/022
32
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A method and a device are described for producing a galvanic layer having a defined spatial extent on an electrically conductive substrate surface having any shaped contour at all. In this context, an electrolyte jet from a nozzle is applied to the substrate, and a current flows between the nozzle and the substrate surface essentially via the electrolyte jet. The device is provided with a pump for delivering an electrolyte from an electrolyte reservoir to the nozzle and for producing an electrolyte jet directed at the substrate surface. Moreover, the device has a reactor in which are arranged the substrate to be coated, as well as the nozzle. The substrate and the nozzle are connected to a direct current source, and a configuration of the substrate and of the nozzle in the reactor is variable during the coating process.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A method for producing a galvanic layer having a defined spatial extent on an electrically conductive substrate surface ( 2 ) having any shaped contour at all, an electrolyte jet ( 7 ) being applied by a nozzle ( 6 ) to the substrate surface ( 2 ), and a current flowing between the nozzle ( 6 ) and the substrate surface ( 2 ) essentially via the electrolyte jet ( 7 ), a configuration of the nozzle and of the substrate surface being variable during the coating process.  
     
     
         2 . The method as recited in  claim 1 , 
 wherein the electrolyte jet ( 7 ) is a free jet.    
     
     
         3 . The method as recited in  claim 1 , 
 wherein the electrolyte jet ( 7 ) is an immersion jet.    
     
     
         4 . The method as recited in one of claims  1  through  3 , 
 wherein parameters of the coating process are provided in such a way that the substrate surface ( 2 ) is essentially coated in the impact region of the electrolyte jet ( 7 ) on the substrate surface ( 2 ).  
 
     
     
         5 . The method as recited in  claim 4 , 
 wherein a diameter of the coated region ( 25 ) is adjusted as a function of the diameter of the nozzle ( 6 ), and/or as a function of the flow velocity of the electrolyte ( 4 ), and/or as a function of a vertical distance between the nozzle ( 6 ) and the substrate surface ( 2 ).    
     
     
         6 . The method as recited in one of claims  1  through  5 , 
 wherein a height of the coating ( 25 ) is adjusted as a function of a time during which the current flows between the nozzle ( 6 ) and the substrate surface ( 2 ), and/or as a function of the current intensity.  
 
     
     
         7 . The method as recited in one of claims  1  through  6 , 
 wherein the nozzle ( 6 ) and/or the substrate ( 9 ) are moved during the coating process.  
 
     
     
         8 . The method as recited in  claim 7 , 
 wherein the nozzle ( 6 ) and/or the substrate ( 9 ) are moved to vary the vertical distance between them, the vertical distance being varied, in particular, in such a way that a profile layer ( 23 ) is produced on the substrate surface ( 2 ).    
     
     
         9 . The method as recited in  claim 7 , 
 wherein the nozzle ( 6 ) and/or the substrate ( 9 ) are moved to vary the impact region ( 21 ) of the electrolyte jet ( 7 ) on the substrate surface ( 2 ), the impact region ( 21 ) being varied, in particular, in such a way that a contour layer ( 24 ) is produced on the substrate surface ( 2 ).    
     
     
         10 . The method as recited in  claim 7 , 
 wherein the nozzle ( 6 ) and/or the substrate ( 9 ) are moved to vary the vertical distance between them and to vary the impact region ( 21 ) of the electrolyte jet ( 7 ) on the substrate surface ( 2 ).    
     
     
         11 . The method as recited in one of claims  1  through  10 , 
 wherein a plurality of electrolyte jets is applied simultaneously to the substrate surface.  
 
     
     
         12 . A device for producing a galvanic layer having a defined spatial extent on an electrically conductive substrate surface ( 2 ) having any shaped contour at all, comprising a pump ( 3 ) for delivering an electrolyte ( 4 ) from an electrolyte reservoir ( 5 ) to a nozzle ( 6 ) and for producing an electrolyte jet ( 7 ) directed to substrate surface ( 2 ), a reactor ( 8 ) in which are placed the substrate ( 9 ) to be coated as well as the nozzle ( 6 ), and a direct current source ( 10 ) which is connected to the substrate ( 9 ) and the nozzle ( 6 ), a configuration of the nozzle ( 6 ) and/or of the substrate ( 9 ) in the reactor ( 8 ) being variable.  
     
     
         13 . The device as recited in  claim 12 , 
 wherein the reactor ( 8 ) has a protective container ( 11 ) and a substrate holder ( 12 ) configured in the protective container ( 11 ).    
     
     
         14 . The device as recited in  claim 12  or  13 , 
 wherein a valve ( 13 ) for controlling a delivery quantity of the electrolyte ( 4 ) is provided between the nozzle ( 6 ) and the pump ( 3 ).  
 
     
     
         15 . The device as recited in  claim 13  or  14 , 
 wherein the protective container ( 11 ) is connected to the electrolyte reservoir ( 5 ), and this connection is blockable via a shutoff valve ( 18 ).  
 
     
     
         16 . The device as recited in  claim 15 , 
 wherein in a free-jet operation, the shutoff valve ( 18 ) is opened, and, in an immersion-jet operation, the shutoff valve ( 18 ) is closed, during the immersion jet operation, the electrolyte ( 4 ) is accumulated in the protective container ( 11 ), and is fed back via an output ( 22 ) to the electrolyte reservoir ( 5 ).    
     
     
         17 . The device as recited in one of claims  12  through  16 , 
 wherein the electrolyte reservoir ( 5 ) is equipped with a device ( 19 ) for tempering the electrolyte ( 4 ).  
 
     
     
         18 . The device as recited in one of claims  13  through  17 , 
 wherein the nozzle ( 6 ) and/or the substrate holder ( 12 ) are provided with a controlled positioning device for guiding the nozzle ( 6 ) and/or the substrate holder ( 12 ) during the coating process.

Join the waitlist — get patent alerts

Track US2004020779A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.