US2004020434A1PendingUtilityA1
Focused ion beam deposition
Priority: Dec 30, 2000Filed: Jul 31, 2003Published: Feb 5, 2004
Est. expiryDec 30, 2020(expired)· nominal 20-yr term from priority
H10P 14/418H10P 14/43H10W 20/067H10W 20/064C23C 16/16C23C 16/486C23C 16/56C23C 16/52C23C 16/047
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Claims
Abstract
Introducing at least one metal such as cobalt, molybdenum, metal carbonyl, tungsten, platinum, or other suitable metal to a focused ion beam. Introducing the focused ion beam to a substrate within a processing chamber. Forming at least one layer over a substrate. Applying heat to the layer by, for example, a laser.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A system comprising:
a chamber configured to house a substrate for processing; an energy source coupled to the chamber; a system controller configured to control the introduction of at least one metal precursor gas to a focused ion beam and to control the introduction of the focused ion beam from the energy source; and a memory coupled to the controller comprising a computer-readable medium having a computer-readable program embodied therein for directing operation of the system, the computer-readable program comprising:
instructions for controlling the energy source and for introducing the metal precursor gas into a focused ion beam which is introduced into the chamber over the substrate in which the metal from the focused ion beam forms at least one metal layer over the substrate; and
controlling a coherent electromagnetic radiation source to heat the at least one layer.
2 . The system of claim 1 , wherein the metal precursor gas is one of cobalt, metal carbonyl, molybdenum, platinum, and tungsten.
3 . The system of claim 2 , wherein introducing one of cobalt, metal carbonyl, molybdenum, platinum, and tungsten into the focused ion beam in a controlled ratio at a chamber pressure in the range of 10 −5 to 10 −7 torr.
4 . The system of claim 1 , wherein the focused ion beam heats a discrete area on the layer.
5 . The system of claim 1 , further comprising a lens coupled to the coherent electromagnetic radiation source to focus the coherent electromagnetic radiation source to a spot size on the at least one layer.
6 . The system of claim 5 , wherein said lens comprises a 5× lens of numerical aperture approximately 0.15 to focus a spot size of the coherent electromagnetic radiation source in the range of 8 microns to 10 microns in diameter.
7 . The system of claim 5 , wherein the at least one metal layer formed over the substrate comprises tungsten and the spot size is approximately 10 micro-meters in width.
8 . The system of claim 1 , wherein the at least one metal layer over the substrate comprises at least one metal layer line having a thickness in the range of 0.1 microns to 1 micron.
9 . The system of claim 1 , wherein the chamber further comprises one of a low level vacuum, a non-reacting gas, and a reducing atmosphere.
10 . The system of claim 9 , wherein one of a carbon, gallium, and an oxygen is removed from the layer.
11 . The system of claim 1 , wherein the instructions for controlling the introduction of at least two metals comprises instructions involving introducing the cobalt, metal carbonyl, molybdenum, platinum, and tungsten in a controllable ratio.
12 . The system of claim 1 , further comprising a plurality of inlets to introduce a plurality of metal precursor gasses, wherein each of the plurality of metal precursor gasses is introduced via a separate inlet and in a controllable ratio.Join the waitlist — get patent alerts
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