Method for manufacturing electrical contact element for testing electro device and electrical contact element thereby

Abstract

Disclosed is a method for manufacturing an electrical contact element used to test an electronic device, and an electrical contact element manufactured thereby. The electrical contact element is manufactured by defining, on a sacrificial substrate, a trench in which a tip portion is to be formed, forming a protective film pattern such that the protective film pattern delimits an opened region in which a beam portion is to be formed and which is communicated with the trench, filling a conductive material into the opened region, and removing the sacrificial substrate and the protective film pattern to form the electrical contact element having the tip portion and the beam portion. The method comprises the step of conducting one or more times, after defining the trench, anisotropic etching in the trench in such a way as to increase a depth of the trench and round an inner surface of the trench. The electrical contact element comprises a beam portion having a multi-stepped configuration which comprises a first bar-shaped part, a second bar-shaped part connected with the first part and having a width greater than the first part, and a third bar-shaped part connected at one thereof with the second part and having a width greater than the second part, the third part being connected at the other end thereof with an electronic component, through a bump; and a tip portion formed integrally with a free end of the first part of the beam portion.

What is claimed is:  
     
         1 . A method for manufacturing an electrical contact element used to test an electronic device, by defining, on a sacrificial substrate, a trench in which a tip portion is to be formed, forming a protective film pattern in a manner such that the protective film pattern delimits an opened region in which a beam portion is to be formed and which is communicated with the trench, filling a conductive material into the opened region, and removing the sacrificial substrate and the protective film pattern to form the electrical contact element having the tip portion and the beam portion, the method comprising the step of: 
 conducting one or more times, after defining the trench, anisotropic etching in the trench in such a way as to increase a depth of the trench and round an inner surface of the trench.    
     
     
         2 . The method as set forth in  claim 1 , wherein the step of conducting one or more times anisotropic etching in the trench in such a way as to increase a depth of the trench and round an inner surface of the trench is implemented by a reactive ion etching process.  
     
     
         3 . The method as set forth in  claim 1 , wherein the beam portion has a multi-stepped configuration which comprises a first bar-shaped part connected with the tip portion, a second bar-shaped part connected with the first part and having a width greater than the first part, and a third bar-shaped part connected with the second part and having a width greater than the second part.  
     
     
         4 . The method as set forth in  claim 1 , wherein the beam portion has a zigzagged configuration which comprises a first bar-shaped part connected with the tip portion, a second zigzagged part connected with the first part and zigzagged one or more times, and a third bar-shaped part connected with the second part.  
     
     
         5 . The method as set forth in  claim 1 , wherein a distal end of the tip portion has a truncated polygonal pyramid-shaped or a truncated cone-shaped configuration with a rounded distal end surface.  
     
     
         6 . The method as set forth in  claim 1 , wherein a distal end of the tip portion has a column-shaped configuration with a rounded distal end surface, and a projection is formed around a proximal end of the tip portion.  
     
     
         7 . The method as set forth in  claim 1 , further comprising the steps of: 
 forming again, after defining on the sacrificial substrate the trench in which the tip portion is to be formed, another specified protective film pattern which is other than the protective film pattern for opening only a center part of the trench, on the sacrificial substrate, and then conducting an etching process one or more times so as to increase the depth of the trench; and    removing the specified protective film pattern which is other than the protective film pattern for opening only the center part of the trench.    
     
     
         8 . The method as set forth in  claim 7 , wherein a distal end of the tip portion has a truncated polygonal pyramid-shaped or a truncated cone-shaped configuration with a rounded distal end surface, and a projection is formed around a proximal end of the tip portion.  
     
     
         9 . The method as set forth in  claim 7 , wherein a distal end of the tip portion has a column-shaped configuration with a rounded distal end surface, and a plurality of projections are formed around a proximal end of the tip portion.  
     
     
         10 . A method for manufacturing an electrical contact element used to test an electronic device, by defining, on a sacrificial substrate, a trench in which a tip portion is to be formed, forming a first protective film pattern in a manner such that the first protective film pattern delimits a first opened region in which a beam portion is to be formed and which is communicated with the trench, filling a conductive material into the first opened region, and removing the sacrificial substrate and the first protective film pattern to form the electrical contact element having the tip portion and the beam portion, the method comprising the steps of: 
 conducting one or more times, after defining the trench, anisotropic etching in the trench in such a way as to increase a depth of the trench and round an inner surface of the trench;  
 filling the conductive material into the first opened region of a predetermined thickness delimited on the sacrificial substrate by the first protective layer, to form the tip portion and the beam portion, and then flattening an upper surface of a first resultant product;  
 forming a second protective film pattern on the first resultant product having undergone the flattening step, in a manner such that the second protective film pattern delimits a second opened region in which an armrest is to be formed, adjacent to the trench in which the tip portion is to be formed;  
 filling the conductive material into the second opened region of a predetermined thickness delimited on the first resultant product by the second protective layer, to form the armrest, and then flattening an upper surface of a second resultant product; and  
 removing the second protective film pattern, first protective film pattern and sacrificial substrate to complete the electrical contact element having the tip portion, beam portion and armrest.  
 
     
     
         11 . The method as set forth in  claim 10 , wherein a distal end of the tip portion has a truncated polygonal pyramid-shaped or a truncated cone-shaped configuration with a rounded distal end surface, and a projection is formed around a proximal end of the tip portion.  
     
     
         12 . The method as set forth in  claim 10 , wherein a distal end of the tip portion has a column-shaped configuration with a rounded distal end surface, and a plurality of projections are formed around a proximal end of the tip portion.  
     
     
         13 . An electrical contact element used to test an electronic device, comprising: 
 a beam portion having a multi-stepped configuration which comprises a first bar-shaped part, a second bar-shaped part connected with the first part and having a width greater than the first part, and a third bar-shaped part connected at one thereof with the second part and having a width greater than the second part, the third part being connected at the other end thereof with an electronic component, through a bump;    a trench defined on a sacrificial substrate at a position corresponding to a free end of the first part of the beam portion, by conducting one or more times a first isotropic etching process using a first protective film pattern as an etching mask, in a manner such that a bottom surface of the trench is rounded; and    a tip portion formed by applying, after removing the first protective film pattern, a second protective film pattern on the sacrificial substrate, filling a conductive material into the trench, flattening an upper surface of a resultant product, removing the sacrificial substrate and the second protective film pattern by wet etching.    
     
     
         14 . The electrical contact element as set forth in  claim 13 , wherein, by conducting anisotropic etching one or more times, the trench has a truncated polygonal pyramid-shaped or a truncated cone-shaped section, with a side surface of the trench sloped.  
     
     
         15 . The electrical contact element as set forth in  claim 13 , wherein a distal end of the tip portion has a column-shaped configuration with a rounded distal end surface, and a projection is formed around a proximal end of the tip portion.  
     
     
         16 . The electrical contact element as set forth in  claim 15 , wherein the tip portion is formed by defining a depression on the sacrificial substrate through implementing a first isotropic etching process and a second anisotropic etching process, defining the trench which has a column-shaped section with the bottom surface rounded, filling the conductive material into the trench, and removing the sacrificial substrate.  
     
     
         17 . The electrical contact element as set forth in  claim 13 , wherein a distal end of the tip portion has a truncated polygonal pyramid-shaped or a truncated coned-shaped configuration with a rounded distal end surface, and a projection is formed around a proximal end of the tip portion.  
     
     
         18 . The electrical contact element as set forth in  claim 17 , wherein the tip portion is formed by defining a depression on the sacrificial substrate through implementing first, second and third etching processes, defining the trench which has a truncated polygonal pyramid-shaped or a truncated cone-shaped section with the bottom surface rounded, filling the conductive material into the trench, and removing the sacrificial substrate.  
     
     
         19 . The electrical contact element as set forth in  claim 13 , wherein a distal end of the tip portion has a column-shaped configuration with a rounded distal end surface, and first and second projections are formed around a proximal end of the tip portion.  
     
     
         20 . The electrical contact element as set forth in  claim 19 , wherein the tip portion is formed by defining first and second depression parts on the sacrificial substrate through implementing first, second and third etching processes, defining the trench which has a column-shaped section with the bottom surface rounded, filling the conductive material into the trench, and removing the sacrificial substrate.  
     
     
         21 . The electrical contact element as set forth in  claim 13 , wherein a distal end of the tip portion has a truncated pyramid-shaped or a truncated cone-shaped configuration with a rounded distal end surface.  
     
     
         22 . The electrical contact element as set forth in  claim 13 , wherein a distal end of the tip portion has a column-shaped configuration with a rounded distal end surface, and a projection is formed around a proximal end of the tip portion.  
     
     
         23 . The electrical contact element as set forth in  claim 13 , wherein a distal end of the tip portion has a truncated pyramid-shaped or a truncated cone-shaped configuration with a rounded distal end surface, and a projection is formed around a proximal end of the tip portion.  
     
     
         24 . The electrical contact element as set forth in  claim 13 , wherein a first projection is formed around a proximal end of the tip portion, a second projection is formed around a middle part of the tip portion in a manner such that the second projection is connected with the first projection and has a sectional area smaller than the first projection, and a distal end of the tip portion has a column-shaped configuration with a rounded distal end surface, in a manner such that the distal end is connected with the second projection and has a sectional area smaller than the second projection.  
     
     
         25 . An electrical contact element used to test an electronic device, comprising: 
 a beam portion having a zigzagged configuration which comprises a first bar-shaped part connected with an electronic component through a bump, a second zigzagged part connected with the first part and zigzagged one or more times, and a third bar-shaped part connected with the second part;    a trench defined on a sacrificial substrate at a position corresponding to a free end of the third part of the beam portion, by conducting one or more times a first isotropic etching process using a first protective film pattern as an etching mask, in a manner such that a bottom surface of the trench is rounded; and    a tip portion formed by applying, after removing the first protective film pattern, a second protective film pattern on the sacrificial substrate, filling a conductive material into the trench, flattening an upper surface of a resultant product, removing the sacrificial substrate and the second protective film pattern by wet etching.    
     
     
         26 . The electrical contact element as set forth in  claim 25 , wherein, by conducting anisotropic etching one or more times, the trench has a truncated polygonal pyramid-shaped or a truncated cone-shaped section, with a side surface of the trench sloped.  
     
     
         27 . The electrical contact element as set forth in  claim 25 , wherein a distal end of the tip portion has a column-shaped configuration with a rounded distal end surface, and a projection is formed around a proximal end of the tip portion.  
     
     
         28 . The electrical contact element as set forth in  claim 27 , wherein the tip portion is formed by defining a depression on the sacrificial substrate through implementing a first isotropic etching process and a second anisotropic etching process, defining the trench which has a column-shaped section with the bottom surface rounded, filling the conductive material into the trench, and removing the sacrificial substrate.  
     
     
         29 . The electrical contact element as set forth in  claim 25 , wherein a distal end of the tip portion has a truncated polygonal pyramid-shaped or a truncated coned-shaped configuration with a rounded distal end surface, and a projection is formed around a proximal end of the tip portion.  
     
     
         30 . The electrical contact element as set forth in  claim 29 , wherein the tip portion is formed by defining a depression on the sacrificial substrate through implementing first, second and third etching processes, defining the trench which has a truncated polygonal pyramid-shaped or a truncated cone-shaped section with the bottom surface rounded, filling the conductive material into the trench, and removing the sacrificial substrate.  
     
     
         31 . The electrical contact element as set forth in  claim 25 , wherein a distal end of the tip portion has a column-shaped configuration with a rounded distal end surface, and first and second projections are formed around a proximal end of the tip portion.  
     
     
         32 . The electrical contact element as set forth in  claim 31 , wherein the tip portion is formed by defining first and second depression parts on the sacrificial substrate through implementing first, second and third etching processes, defining the trench which has a column-shaped section with the bottom surface rounded, filling the conductive material into the trench, and removing the sacrificial substrate.  
     
     
         33 . The electrical contact element as set forth in  claim 25 , wherein the second zigzagged part of the beam portion has a bent angle of 30°˜170°.  
     
     
         34 . The electrical contact element as set forth in  claim 25 , wherein the beam portion is decreased in its width from the first part toward the third part.  
     
     
         35 . The electrical contact element as set forth in  claim 25 , wherein a distal end of the tip portion has a truncated pyramid-shaped or a truncated cone-shaped configuration with a rounded distal end surface.  
     
     
         36 . The electrical contact element as set forth in  claim 25 , wherein a distal end of the tip portion has a column-shaped configuration with a rounded distal end surface, and a projection is formed around a proximal end of the tip portion.  
     
     
         37 . The electrical contact element as set forth in  claim 25 , wherein a distal end of the tip portion has a truncated pyramid-shaped or a truncated cone-shaped configuration with a rounded distal end surface, and a projection is formed around a proximal end of the tip portion.  
     
     
         38 . The electrical contact element as set forth in  claim 25 , wherein a first projection is formed around a proximal end of the tip portion, a second projection is formed around a middle part of the tip portion in a manner such that the second projection is connected with the first projection and has a sectional area smaller than the first projection, and a distal end of the tip portion has a column-shaped configuration with a rounded distal end surface, in a manner such that the distal end is connected with the second projection and has a sectional area smaller than the second projection.  
     
     
         39 . An electrical contact element used to test an electronic device, comprising: 
 a sacrificial substrate formed, on a surface thereof, with a first photoresist of a predetermined thickness;    a first opened region defined by patterning the first photoresist, for allowing a tip portion to be formed therein;    a trench for allowing the tip portion to be formed therein by using a first photoresist pattern as an etching mask, the trench undergoing an anisotropic etching process to round the tip portion, the first photoresist pattern formed on the sacrificial substrate being removed by ashing;    a zigzagged beam portion zigzagged one or more times and an armrest formed by filling, to a predetermined thickness and through implementing a chemical vapor deposition, physical vapor deposition or plating process, a conductive material for the formation of the tip and beam portions into a second opened region delimited by a second photoresist pattern on the sacrificial substrate, flattening an upper surface of a resultant product, and removing the second photoresist pattern and a third photoresist pattern;    a post portion formed on a terminal of an electronic component to have a bump of a predetermined size; and    connection means for connecting the post portion with one end of the beam portion opposite to the other end of the beam portion on which the armrest is formed;    wherein the armrest is formed on an upper surface of a zigzagged part of the beam portion when the sacrificial substrate is removed by wet etching.    
     
     
         40 . The electrical contact element as set forth in  claim 39 , wherein a coating film of an insulating material is formed on an outer surface of the armrest.  
     
     
         41 . The electrical contact element as set forth in  claim 40 , wherein the insulating material comprises polyimide or parylene.  
     
     
         42 . The electrical contact element as set forth in  claim 39 , wherein the connection means comprises soldering, brazing, plating, or a conductive adhesive.  
     
     
         43 . The electrical contact element as set forth in  claim 39 , wherein, in the case that the beam portion is formed with a zigzagged part zigzagged one or more times, the armrest is formed between a desired position on the zigzagged part and a corresponding position on a surface of the electronic component.  
     
     
         44 . The electrical contact element as set forth in  claim 39 , wherein the armrest is formed on the beam portion in opposition to the tip portion.  
     
     
         45 . The electrical contact element as set forth in  claim 39 , wherein a pair of armrests are formed on the beam portion and the electronic component, respectively, in a manner such that they face each other.  
     
     
         46 . The electrical contact element as set forth in  claim 39 , wherein the armrest is formed between a point on the zigzagged part of the beam portion which point is most adjacent to the tip portion and the corresponding position on the surface of the electronic component.  
     
     
         47 . An electrical contact element used to test an electronic device, comprising: 
 a sacrificial substrate formed, on a surface thereof, with a first photoresist of a predetermined thickness;    a first opened region defined by patterning the first photoresist, for allowing a tip portion to be formed therein;    a trench for allowing the tip portion to be formed therein by using a first photoresist pattern as an etching mask, the trench undergoing an anisotropic etching process to round the tip portion, the first photoresist pattern formed on the sacrificial substrate being removed by ashing;    a zigzagged beam portion zigzagged one or more times and an armrest formed by filling, to a predetermined thickness and through implementing a chemical vapor deposition, physical vapor deposition or plating process, a conductive material for the formation of the tip and beam portions into a second opened region delimited by a second photoresist pattern on the sacrificial substrate, flattening an upper surface of a resultant product, and removing the second photoresist pattern and a third photoresist pattern;    a post portion formed on a terminal of an electronic component to have a bump of a predetermined size;    connection means for connecting the post portion with one end of the beam portion opposite to the other end of the beam portion on which the armrest is formed; and    the tip portion being formed on the beam portion when the sacrificial substrate is removed by wet etching;    wherein the armrest is selectively formed on a zigzagged part of the zigzagged beam portion or a surface of the electronic component facing the zigzagged beam portion.    
     
     
         48 . The electrical contact element as set forth in  claim 47 , wherein a coating film of an insulating material is formed on an outer surface of the armrest.  
     
     
         49 . The electrical contact element as set forth in  claim 48 , wherein the insulating material comprises polyimide or parylene.  
     
     
         50 . The electrical contact element as set forth in  claim 47 , wherein the connection means comprises soldering, brazing, plating, or a conductive adhesive.  
     
     
         51 . The electrical contact element as set forth in  claim 47 , wherein, in the case that the beam portion is formed with a zigzagged part zigzagged one or more times, the armrest is formed between a desired position on the zigzagged part and a corresponding position on a surface of the electronic component.  
     
     
         52 . The electrical contact element as set forth in  claim 47 , wherein the armrest is formed on the beam portion in opposition to the tip portion.  
     
     
         53 . The electrical contact element as set forth in  claim 47 , wherein a pair of armrests are formed on the beam portion and the electronic component, respectively, in a manner such that they face each other.  
     
     
         54 . The electrical contact element as set forth in  claim 47 , wherein the armrest is formed between a point on the zigzagged part of the beam portion which point is most adjacent to the tip portion and the a corresponding position on the surface of the electronic component.  
     
     
         55 . An electrical contact element used to test an electronic device, comprising: 
 a sacrificial substrate formed, on a surface thereof, with a first photoresist of a predetermined thickness;    a first opened region defined by patterning the first photoresist, for allowing a tip portion to be formed therein;    a trench for allowing the tip portion to be formed therein by using a first photoresist pattern as an etching mask, the trench undergoing an anisotropic etching process to round the tip portion, the first photoresist pattern formed on the sacrificial substrate being removed by ashing;    a zigzagged beam portion zigzagged one or more times and an armrest formed by filling, to a predetermined thickness and through implementing a chemical vapor deposition, physical vapor deposition or plating process, a conductive material for the formation of the tip and beam portions into a second opened region delimited by a second photoresist pattern on the sacrificial substrate, flattening an upper surface of a resultant product, and removing the second photoresist pattern and a third photoresist pattern;    a post portion formed on a terminal of an electronic component to have a bump of a predetermined size; and    connection means for connecting the post portion with one end of the beam portion opposite to the other end of the beam portion on which the armrest is formed;    wherein, when the sacrificial substrate is removed by wet etching, armrests are respectively formed on a zigzagged part of the zigzagged beam portion and a surface of the electronic component in a manner such that the armrests are spaced apart from each other by a predetermined distance.    
     
     
         56 . The electrical contact element as set forth in  claim 55 , wherein a coating film of an insulating material is formed on an outer surface of the armrest.  
     
     
         57 . The electrical contact element as set forth in  claim 56 , wherein the insulating material comprises polyimide or parylene.  
     
     
         58 . The electrical contact element as set forth in  claim 55 , wherein the connection means comprises soldering, brazing, plating, or a conductive adhesive.  
     
     
         59 . The electrical contact element as set forth in  claim 55 , wherein, in the case that the beam portion is formed with a zigzagged part zigzagged one or more times, the armrest is formed between a desired position on the zigzagged part and a corresponding position on a surface of the electronic component.  
     
     
         60 . The electrical contact element as set forth in  claim 55 , wherein the armrest is formed on the beam portion in opposition to the tip portion.  
     
     
         61 . The electrical contact element as set forth in  claim 60 , wherein a pair of armrests are formed on the beam portion and the electronic component, respectively, in a manner such that they face each other.  
     
     
         62 . The electrical contact element as set forth in  claim 55 , wherein the armrest is formed between a point on the zigzagged part of the beam portion which point is most adjacent to the tip portion and the a corresponding position on the surface of the electronic component.