US2004011509A1PendingUtilityA1

Vapor augmented heatsink with multi-wick structure

39
Priority: May 15, 2002Filed: Mar 19, 2003Published: Jan 22, 2004
Est. expiryMay 15, 2022(expired)· nominal 20-yr term from priority
Inventors:Wing Siu
F28D 15/046F28D 15/0233F28F 3/02Y10T29/49353F28F 2215/10
39
PatentIndex Score
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Cited by
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Claims

Abstract

A heat transfer device includes a base chamber, a fin chamber, and at least one fin. The chambers can be thermally coupled. The heat transfer device also includes a wick structure. The wick structure can include a multi-wick structure. The multi-wick structure can include a three-dimensional wick structure and/or a spatially varying wick structure.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A heat transfer device, comprising: 
 at least one base chamber;    at least one fin chamber; and    at least one fin,    the chambers being thermally coupled and adapted to hold condensable vapor.    
     
     
         2 . The heat transfer device of  claim 1 , wherein at least one fin is solid.  
     
     
         3 . The heat transfer device of  claim 1 , wherein the fin has at least one side and is in thermal contact with at least one of the base chamber and fin chamber.  
     
     
         4 . The heat transfer device of  claim 1 , wherein the fin comprises thermally conductive material.  
     
     
         5 . The heat transfer device of  claim 1 , wherein the heat transfer device includes at least one vapor path.  
     
     
         6 . The heat transfer device of  claim 1 , further comprising a wick structure.  
     
     
         7 . The heat transfer device of  claim 6 , wherein the wick structure can be formed integrally with a wall of the chambers.  
     
     
         8 . The heat transfer device of  claim 6 , wherein the wick structure can be formed separately from a wall of the chambers.  
     
     
         9 . The heat transfer device of  claim 6 , wherein the wick structure includes a multi-wick structure.  
     
     
         10 . The heat transfer device of  claim 9 , wherein the multi-wick structure includes a three-dimensional wick structure.  
     
     
         11 . The heat transfer device of  claim 9 , wherein the multi-wick structure includes a spatially varying wick structure.  
     
     
         12 . The heat transfer device of  claim 9 , wherein the multi-wick structure includes at least one bridging wick structure to provide multiple liquid-flow-path.  
     
     
         13 . The heat transfer device of  claim 9 , wherein the multi-wick structure includes a combination of a groove, a mesh, an aggregated powder wick, or a foam wick.  
     
     
         14 . The heat transfer device of  claim 9 , wherein the multi-wick structure includes a combination of a layered structure, a bar structure, or a bridging wick structure.  
     
     
         15 . The heat transfer device of  claim 9 , wherein the multi-wick structure includes a wick structure with varying porosity.  
     
     
         16 . The heat transfer device of  claim 9 , wherein the multi-wick structure includes a wick structure with varying pore size.  
     
     
         17 . The heat transfer device of  claim 9 , wherein the multi-wick structure includes a wick with varying cross-sectional geometry.  
     
     
         18 . The heat transfer device of  claim 9 , wherein the multi-wick structure includes a wick with varying dimensions.  
     
     
         19 . The heat transfer device of  claim 6 , wherein the wick structure includes a spatially varying wick structure.  
     
     
         20 . The heat transfer device of  claim 19 , wherein the spatially varying wick structure can be a groove structure with a spatially varying pattern.  
     
     
         21 . The heat transfer device of  claim 6 , wherein the wick structure includes an aggregated powder wick.  
     
     
         22 . The heat transfer device of  claim 6 , wherein the wick structure includes a foam wick.  
     
     
         23 . The heat transfer device of  claim 6 , wherein the wick structure includes at least one groove.  
     
     
         24 . The heat transfer device of  claim 6 , wherein the wick structure includes a mesh wick.  
     
     
         25 . The heat transfer device of  claim 6 , wherein the wick structure includes a layered structure.  
     
     
         26 . The heat transfer device of  claim 6 , further comprising a wick structure adapted to store liquid so as to accommodate a liquid flow variation.  
     
     
         27 . The heat transfer device of  claim 6 , further comprising a wick structure is disposed between opposing walls of a chamber.  
     
     
         28 . The heat transfer device of  claim 1 , further comprising at least one internal supporting structure to avoid collapsing of chambers.  
     
     
         29 . The heat transfer device of  claim 28 , wherein the internal supporting structure includes at least one solid element.  
     
     
         30 . The heat transfer device of  claim 28 , wherein the at least one internal supporting structure element includes a wicking structure.  
     
     
         31 . The heat transfer device of  claim 1 , wherein at least one fin includes at least one opening.  
     
     
         32 . The heat transfer device of  claim 31 , wherein the opening defines a plurality of geometries.  
     
     
         33 . The heat transfer device of  claim 31 , wherein the opening defines a plurality of dimensions.  
     
     
         34 . The heat transfer device of  claim 1 , wherein at least one fin includes an opening in an airflow downstream portion.  
     
     
         35 . The heat transfer device of  claim 1 , wherein at least one fin includes a cut-out on a side.  
     
     
         36 . The heat transfer device of  claim 35 , wherein the cut-out defines a plurality of geometries.  
     
     
         37 . The heat transfer device of  claim 35 , wherein the cut-out defines a plurality of dimensions.  
     
     
         38 . The heat transfer device of  claim 35 , wherein the cut-out defines a slit.  
     
     
         39 . The heat transfer device of  claim 35 , wherein the side with the cut-out thermally contacts at least one of the base chamber and the fin chamber.  
     
     
         40 . The heat transfer device of  claim 1 , wherein the at least two fins comprise two interconnected fins.  
     
     
         41 . The heat transfer device of  claim 41 , wherein the two interconnected fins are connected by a baffle.  
     
     
         42 . The heat transfer device of  claim 1 , further comprising at least one phase change element.  
     
     
         43 . The heat transfer device of  claim 1 , wherein the chambers form an inverted T-shape.  
     
     
         44 . The heat transfer device of  claim 1 , wherein the chambers form a double inverted T-shape.  
     
     
         45 . The heat transfer device of  claim 1 , wherein the chambers form a U-shape.  
     
     
         46 . The heat transfer device of  claim 1 , wherein the chamber form a W-shape.

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