Method for making a heat sink device and product made thereby

Abstract

A method for making a heat sink device includes the steps of: (a) providing a first heat conducting plate and a second heat conducting plate, the first heat conducting plate being folded to form a plurality of first connecting parts and a plurality of fin parts, the second heat conducting plate including second connecting parts corresponding to the first connecting parts of the first heat conducting plate; (b) cold pressing the first connecting parts respectively against the second connecting parts so as to connect respectively the first connecting parts to the second connecting parts; and (c) heating and press forging the first connecting parts and the second connecting parts so as to form porosity-free joint parts between the first and second connecting parts.

I claim:  
     
         1 . A method for making a heat sink device, comprising the steps of: 
 (a) providing a first heat conducting plate and a second heat conducting plate, said first heat conducting plate being folded to form a plurality of first connecting parts and a plurality of fin parts, each of which is formed between two adjacent ones of said first connecting parts, said second heat conducting plate including second connecting parts corresponding to said first connecting parts of said first heat conducting plate;    (b) cold pressing said first connecting parts of said first heat conducting plate respectively against said second connecting parts of said second heat conducting plate so as to connect respectively said first connecting parts of said first heat conducting plate to said second connecting parts of said second heat conducting plate; and    (c) heating and press forging said first connecting parts of said first heat conducting plate and said second connecting parts of said second heat conducting plate so as to form porosity-free joint parts between said first and second connecting parts of said first and second heat conducting plates.    
     
     
         2 . The method as claimed in  claim 1 , further comprising a step of roughening said first connecting parts of said first heat conducting plate and said second connecting parts of said second heat conducting plate so as to pre-position said first connecting parts on said second connecting parts before step (b).  
     
     
         3 . The method as claimed in  claim 1 , further comprising a step of forming recess-and-protrusion interengagement elements on said first connecting parts of said first heat conducting plate and said second connecting parts of said second heat conducting plate so as to pre-position said first connecting parts on said second connecting parts before step (b).  
     
     
         4 . The method as claimed in  claim 1 , further comprising a step of folding a marginal end of said second heat conducting plate over a marginal end of said first heat conducting plate to embrace said marginal end of said first heat conducting plate so as to pre-position said first connecting parts on said second connecting parts before step (b).  
     
     
         5 . The method as claimed in  claim 1 , wherein said second heat conducting plate includes a base layer and a highly heat conducting layer overlying said base layer, said second connecting parts being disposed on said highly heat conducting layer.  
     
     
         6 . The method as claimed in  claim 1 , wherein said first and second heat conducting plates are independently selected from a group consisting of a copper substrate and an aluminum substrate.  
     
     
         7 . The method as claimed in  claim 5 , wherein said first heat conducting plate and said base layer of said second heat conducting plate are independently selected from a group consisting of a copper substrate and an aluminum substrate, said highly heat conducting layer of said second heat conducting plate being selected from a group consisting of a silver substrate and a carbon substrate.  
     
     
         8 . A heat sink device, comprising: 
 a first heat conducting plate including a plurality of first connecting parts and a plurality of fin parts, each of which is formed between two adjacent ones of said first connecting parts;    a second heat conducting plate including second connecting parts corresponding to said first connecting parts of said first heat conducting plate; and    porosity-free joint parts each formed between one of said first connecting parts and a corresponding one of said second connecting parts by cold pressing said one of said first connecting parts against said corresponding one of said second connecting parts followed by heating and press forging said one of said first connecting parts and said corresponding one of said second connecting parts.    
     
     
         9 . The heat sink device as claimed in  claim 8 , wherein said second heat conducting plate includes a base layer and a highly heat conducting layer overlying said base layer, said second connecting parts being disposed on said highly heat conducting layer.  
     
     
         10 . The heat sink device as claimed in  claim 8 , wherein said first and second heat conducting plates are independently selected from a group consisting of a copper substrate and an aluminum substrate.  
     
     
         11 . The heat sink device as claimed in  claim 9 , wherein said first heat conducting plate and said base layer of said second heat conducting plate are independently selected from a group consisting of a copper substrate and an aluminum substrate, said highly heat conducting layer of said second heat conducting plate being selected from a group consisting of a silver substrate and a carbon substrate.