Manufacturing method for high-density type copper plate memorial

Abstract

This invention relates to a manufacturing method for a high-density copper plate memorial which comprises the following steps of: digitalizing the desired image for its storage in a computer file (S 100 ); adjusting the image level by converting the stored image into halftone image (S 102 ); printing the halftone image into a transparent film (S 104 ); coating the surface of the foreign materials-free copper plate with a glue containing a hardening agent and photosensitizer, followed by its drying (S 106 ); compressing the printed image film to the copper plate for its photosensitization (S 108 ); heating the glue for appropriate etching (S 110 ); etching the surface of copper plate using an impregnating agent to form about 1000˜1600 dots per cm 2 (S 112 ); coating the etched copper plate with a painting material to obtain the same image as the image printed on a film (S 114 ); sanding the copper plate to obtain the desired surface roughness (S 116 ); and, coating the copper plate with a protective film so as to protective the surface of the copper plate where the above mentioned image is formed (S 118 ). Through the following several steps, therefore, this invention can provide the copper plate memorial with the high-density and high-clarity image reproduction: (1) a step of digitalizing the desired image for its storage in a computer file, (2) a step of converting the stored image into halftone image using a graphic edition program, (3) a step of printing the halftone image into a transparent film as a raw data for micro-dots, and (4) the copper plate is etched to form about 1,000˜1,600 dots per cm 2 .

1 . Manufacturing method for the high density type copper plate memorial, wherein it comprises the following steps of: 
 digitalizing the desired image for its storage in a computer file (S 100 );    adjusting the image level by converting the stored image into halftone image (S 102 );    printing the halftone image into a transparent film (S 104 );    coating the surface of the foreign materials-free copper plate with a glue containing a hardening agent and photosensitizer, followed by its drying (S 106 );    compressing the printed image film to the copper plate for its photosensitization (S 108 );    heating the glue for appropriate etching (S 110 );    etching the surface of copper plate using an impregnating agent to form about 1000˜1600 dots per cm 2  (S 112 );    coating the etched copper plate with a painting material to obtain the same image as the image printed on a film (S 114 );    sanding the copper plate to obtain the desired surface roughness (S 116 ); and,    coating the copper plate with a protective film so as to protective the surface of the copper plate where the above mentioned image is formed (S 118 ).