US2004005418A1PendingUtilityA1
Laminate with an electrically conductive layer formed as an antenna structure
Priority: Jun 28, 2002Filed: Jun 30, 2003Published: Jan 8, 2004
Est. expiryJun 28, 2022(expired)· nominal 20-yr term from priority
Y10T156/1062B65D 2203/10Y10T428/24917G06K 19/0776Y10T29/49018H01Q 7/00G06K 19/07783Y10T29/49016B32B 15/20B65D 5/4233Y10T428/13H01Q 1/2225G06K 19/07779B32B 15/08B32B 2439/70G06K 19/07749Y10T29/4913
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Claims
Abstract
A laminate is formed from a carrier layer and an electrically conductive layer. In one section, the conductive layer is formed into an antenna structure. The antenna structure can be produced in a joint operation with the electrically conductive layer. The antenna structure is connected to a microchip, so that data can be written in or read out without contact in a wireless transponder system.
Claims
exact text as granted — not AI-modifiedWe claim:
1 . A packaging material, comprising:
a laminate formed with at least one carrier layer and a conductive layer on said carrier layer; an antenna structure forming a constituent part of said conductive layer; and a microchip conductively connected to said antenna structure, for enabling contact-free data interchange between said microchip and a transmitting and receiving station via said antenna structure.
2 . The packaging material according to claim 1 , which comprises a covering layer applied to said electrically conductive layer.
3 . The packaging material according to claim 2 , wherein said covering layer is formed of a water-repellent material.
4 . The packaging material according to claim 1 , wherein said laminate further comprises, at least in some sections thereof, a layer of oxygen-impermeable material.
5 . The packaging material according to claim 1 , wherein said electrically conductive layer contains at least one metal.
6 . The packaging material according to claim 5 , wherein said metal is aluminum.
7 . The packaging material according to claim 1 , wherein said electrically conductive layer contains at least one conductive organic compound.
8 . The packaging material according to claim 1 , wherein said carrier layer is formed of paper material.
9 . The packaging material according to claim 1 , wherein said carrier layer is formed of a polymer.
10 . The packaging material according to claim 1 , wherein said laminate is formed into a package enclosing a hollow space for receiving therein at least one foodstuff item.
11 . The packaging material according to claim 1 , which comprises an information carrier conductively connected to said antenna structure.
12 . The packaging material according to claim 11 , wherein said information carrier is a microchip capable of data storage.
13 . The packaging material according to claim 1 , which comprises an electronic capacitor conductively connected to said antenna structure.
14 . The packaging material according to claim 1 , wherein said antenna structure is formed with a plurality of turns.Join the waitlist — get patent alerts
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