US2004003892A1PendingUtilityA1
One part woodworking adhesive composition
Priority: Jul 8, 2002Filed: Jul 8, 2002Published: Jan 8, 2004
Est. expiryJul 8, 2022(expired)· nominal 20-yr term from priority
Y10T428/31895C08L 2666/02Y10T428/31855Y10T428/31906C09J 151/003Y10T428/31909Y10T428/3188B32B 21/00Y10S525/902C08F 263/04C08F 265/04C08L 2666/14
35
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Claims
Abstract
An adhesive composition that includes a) an emulsion that includes a multi-stage polymer that includes a first stage polymer having a Tg from −20° C. to 90° C. and including from about 0.5% by weight to about 3% by weight latent crosslinking monomer based on the first stage monomer weight, and a second stage polymer having a Tg from 40° C. to 140° C., the second stage polymer being different from the first stage polymer, b) formaldehyde-based crosslinking agent, and c) catalyst, the composition being capable of passing the DIN EN 204 Test Method.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An adhesive composition comprising:
a) an emulsion comprising a multi-stage polymer comprising
a first stage polymer having a Tg from −20° C. to 90° C. and comprising from about 0.5% by weight to about 3% by weight latent crosslinking monomer based on the first stage monomer weight, and
a second stage polymer having a Tg from 40° C. to 140° C., said second stage polymer being different from said first stage polymer;
b) formaldehyde-based crosslinking agent; and c) catalyst, said adhesive composition being capable of passing the DIN EN 204 Test Method.
2 . The adhesive composition of claim 1 , wherein said adhesive composition passes the WATT-91 Test Method.
3 . The adhesive composition of claim 1 , wherein said adhesive composition passes the WATT-91 Test Method aging in a sealed container for at least 30 days at 23° C.
4 . The adhesive composition of claim 1 , wherein said adhesive composition passes the WATT-91 Test Method after aging in a sealed container for at least 2 months at 23° C.
5 . The composition of claim 1 , wherein said adhesive composition passes the DIN EN 204 Test Method after aging in a sealed container for at least 2 months at 23° C.
6 . The composition of claim 1 , wherein said adhesive composition passes the WATT-91 Test Method after aging in a sealed container for at least 3 months at 23° C.
7 . The composition of claim 1 , wherein said adhesive composition passes the WATT-91 Test Method after aging in a sealed container for at least 6 months at 23° C.
8 . The adhesive composition of claim 1 , wherein said second stage polymer comprises from about 0.1% by weight to about 10% by weight latent crosslinking monomer based on the second stage monomer weight.
9 . The composition of claim 1 , wherein said catalyst comprises an acid catalyst.
10 . The composition of claim 1 , wherein said catalyst is selected from the group consisting of hydrochloric acid, sulfuric acid, phosphoric acid, p-toluene sulfonic acid, and combinations thereof.
11 . The composition of claim 1 , wherein said catalyst comprises Lewis acid.
12 . The composition of claim 1 , wherein said catalyst is selected from the group consisting of aluminum chloride, iron chloride, zirconium oxychloride, chromic nitrate, chromic perchlorate, aluminum nitrate, iron nitrate and zinc nitrate.
13 . The composition of claim 1 , wherein said first stage polymer has a Tg from 0° C. to 70° C.
14 . The composition of claim 1 , wherein said first stage polymer has a Tg from 20° C. to 50° C.
15 . The composition of claim 1 , wherein said first stage polymer comprises vinyl ester.
16 . The composition of claim 1 , wherein said first stage polymer comprises vinyl acetate.
17 . The composition of claim 16 , wherein said first stage polymer further comprises vinyl ester other than vinyl acetate.
18 . The composition of claim 16 , wherein said first stage polymer further comprises vinyl ester of versatic acid.
19 . The composition of claim 1 , wherein said second stage polymer has a Tg from 60° C. to 120° C.
20 . The composition of claim 1 , wherein said second stage polymer has a Tg from 80° C. to 120° C.
21 . The composition of claim 1 , wherein said second stage polymer comprises methyl methacrylate.
22 . The composition of claim 1 , wherein said second stage polymer comprises styrene, acrylonitrile, vinyl pivalate, or a combination thereof.
23 . The composition of claim 18 , wherein said second stage polymer comprises methyl methacrylate.
24 . The adhesive composition of claim 1 , wherein said multi-stage polymer comprises from 0.5% by weight to 60% by weight second stage polymer based on the weight of said first stage polymer.
25 . The adhesive composition of claim 1 , wherein said multi-stage polymer comprises from 1% by weight to about 30% by weight second stage polymer based on the weight of said first-stage polymer.
26 . The adhesive composition of claim 1 , wherein said multi-stage polymer comprises from 1% by weight to 10% by weight second stage polymer based on the weight of said first-stage polymer.
27 . The composition of claim 1 , further comprising coalescing agent, urea, alcohol, plasticizer, antifoam, filler, biocide, tackifier, fire retardant, thickener, preservative, or a combination thereof.
28 . The composition of claim 1 , wherein said first stage polymer comprises from about 1% by weight to about 2.5% by weight latent crosslinking monomer based on the first stage monomer weight.
29 . The composition of claim 1 , wherein said multi-stage polymer comprises from about 1% by weight to about 2% by weight latent crosslinking monomer based on the first stage monomer weight.
30 . The composition of claim 1 , wherein said formaldehyde-based crosslinking agent is selected from the group consisting of resorcinol formaldehyde, urea-formaldehyde, melamine-formaldehyde, phenol-formaldehyde, trimethylol phenol, acrylamide-formaldehyde adducts, and combinations thereof.
31 . The composition of claim 1 , comprising from about 1% by weight to about 10% by weight formaldehyde-based crosslinking agent.
32 . The composition of claim 1 , further comprising alcohol.
33 . An adhesive composition comprising:
a) an emulsion comprising a multi-stage polymer comprising
a first stage polymer having a Tg from −20° C. to 90° C.,
a second stage polymer having a Tg from 40° C. to 140° C., said second stage polymer being different from said first stage polymer, and
latent crosslinking monomer;
b) formaldehyde-based crosslinking agent; and c) catalyst, said adhesive composition being capable of passing the DIN EN 204 Test Method after having been stored in a sealed container at 23° C. for at least 30 days.
34 . The adhesive composition of claim 33 , wherein said adhesive composition passes the WATT-91 Test Method.
35 . The adhesive composition of claim 33 , wherein said adhesive composition passes the WATT-91 Test Method after aging in a sealed container for at least 30 days at 23° C.
36 . The adhesive composition of claim 33 , wherein said adhesive composition passes the WATT-91 Test Method after aging in a sealed container for at least 2 months at 23° C.
37 . The composition of claim 33 , wherein said adhesive composition passes the DIN EN 204 Test Method after aging in a sealed container for at least 2 months at 23° C.
38 . The composition of claim 33 , wherein said adhesive composition passes the WATT-91 Test Method after aging for at least 3 months at 23° C.
39 . The composition of claim 33 , wherein said adhesive composition passes the DIN EN 204 Test Method after aging in a sealed container for at least 3 months at 23° C.
40 . The composition of claim 33 , wherein said adhesive composition passes the WATT-91 Test Method after aging for at least 6 months at 23° C.
41 . The composition of claim 33 , wherein said adhesive composition passes the DIN EN 204 Test Method after aging in a sealed container for at least 6 months at 23° C.
42 . The composition of claim 33 , wherein said adhesive composition, after aging in a sealed container for at least 2 months at 23° C., passes the DIN EN 204 Test Method and the WATT-91 Test Method.
43 . The composition of claim 33 , wherein said adhesive composition, after aging in a sealed container for at least 3 months at 23° C., passes the DIN EN 204 Test Method and the WATT-91 Test Method.
44 . The composition of claim 33 , wherein said adhesive composition, after aging in a sealed container for at least 6 months at 23° C., passes the DIN EN 204 Test Method and the WATT-91 Test Method.
45 . An article comprising:
a substrate; and an adhesive composition comprising the reaction product of
a) an emulsion comprising a multi-stage polymer comprising
a first stage polymer having a Tg from −20° C. to 90° C. and comprising from about 0.5% by weight to about 3% by weight latent crosslinking monomer based on the first stage monomer weight, and
a second stage polymer having a Tg from 40° C. to 140° C., said second stage polymer being different from said first stage polymer;
b) formaldehyde-based crosslinking agent; and
c) catalyst,
said adhesive composition being capable of passing the DIN EN 204 Test Method.
46 . The article of claim 45 , wherein said substrate comprises wood.
47 . The article of claim 45 , comprising a second substrate, said first substrate being bonded to said second substrate through said adhesive composition.
48 . An article comprising:
a substrate; and an adhesive composition comprising the reaction product of
a) an emulsion comprising a multi-stage polymer comprising
a first stage polymer having a Tg from −20° C. to 90° C.,
a second stage polymer having a Tg from 40° C. to 140° C., said second stage polymer being different from said first stage polymer, and
latent crosslinking monomer,
b) formaldehyde-based crosslinking agent, and
c) catalyst,
said adhesive composition being capable of passing the DIN EN 204 Test Method after aging in a sealed container at 23° C. for 30 days.
49 . A method of bonding substrates, said method comprising:
a) contacting a first substrate with the adhesive composition of claim 1; and b) contacting said adhesive composition with a second substrate.
50 . The method of claim 49 , further comprising applying pressure to said substrate construction to bond said first substrate to said second substrate through said adhesive composition.
51 . The method of claim 49 , further comprising applying heat to said substrate construction to bond said first substrate to said second substrate through said adhesive composition.
52 . The method of claim 49 , further comprising applying radio frequency to said substrate construction.
53 . A method of bonding substrates, said method comprising:
a) contacting a first substrate with the adhesive composition of claim 33; and b) contacting said adhesive composition with a second substrate.Join the waitlist — get patent alerts
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