Heat-dissipating device

Abstract

A heat-dissipating device includes a thermal superconducting body, a fan unit and a guide pipe. The superconducting body includes a hollow heat transfer body adapted to be disposed on a heat-generating component of an electronic device. The heat transfer body is made of a heat-conducting material and is configured to confine at least one air channel. The fan unit is disposed to draw hot air away from the heat transfer body. The guide pipe has an inlet port in fluid communication with the heat transfer body for collecting hot air from the heat transfer body, an outlet port in fluid communication with the fan unit, and an intermediate pipe portion interconnecting the inlet and outlet ports for guiding the hot air from the inlet port to the outlet port for extraction by the fan unit.

I claim:  
     
         1 . A heat-dissipating device comprising: 
 a thermal superconducting body including a hollow heat transfer body adapted to be disposed on a heat-generating component of an electronic device, said heat transfer body being made of a heat-conducting material and being configured to confine at least one air channel;    a fan unit disposed to draw hot air away from said heat transfer body; and    a guide pipe having an inlet port in fluid communication with said heat transfer body for collecting hot air from said heat transfer body, an outlet port in fluid communication with said fan unit, and an intermediate pipe portion interconnecting said inlet and outlet ports for guiding the hot air from said inlet port to said outlet port for extraction by said fan unit.    
     
     
         2 . The heat-dissipating device as claimed in  claim 1 , further comprising a heat collecting plate adapted to be disposed between said thermal superconducting body and the heat-generating component.  
     
     
         3 . The heat-dissipating device as claimed in  claim 2 , wherein said heat collecting plate has two opposite surfaces, each of which is coated with a heat conducting paste.  
     
     
         4 . The heat-dissipating device as claimed in  claim 1 , wherein said heat transfer body has an inner surface confining a sealed vacuum chamber, and a base portion adapted to be disposed in thermal contact with the heat-generating component so that heat generated by the heat-generating component is transferred to said heat transfer body.  
     
     
         5 . The heat-dissipating device as claimed in  claim 4 , wherein said heat transfer body is formed with a plurality of fins extending uprightly from said base portion opposite to the heat-generating component, said at least one air channel being defined by an adjacent pair of said fins and being in fluid communication with said inlet port.  
     
     
         6 . The heat-dissipating device as claimed in  claim 5 , wherein said inlet port of said guide pipe is connected to said base portion of said heat transfer body and has said fins disposed therein.  
     
     
         7 . The heat-dissipating device as claimed in  claim 4 , wherein said thermal superconducting body further includes a heat transfer layer formed from a superconductor material and forming a superconductor lining on said inner surface of said heat transfer body.  
     
     
         8 . The heat-dissipating device as claimed in  claim 1 , wherein said fan unit is connected to said outlet port of said guide pipe.  
     
     
         9 . The heat-dissipating device as claimed in  claim 1 , wherein said intermediate pipe portion is configured as a bellows pipe portion.