US2003228475A1PendingUtilityA1

Barrier film and laminated material, container for wrapping and image display medium using the same, and manufacturing method for barrier film

Priority: Apr 18, 2002Filed: Apr 17, 2003Published: Dec 11, 2003
Est. expiryApr 18, 2022(expired)· nominal 20-yr term from priority
Inventors:Minoru Komada
Y10T428/31663Y10T428/31667C23C 14/10B32B 27/08
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Claims

Abstract

An object of the present invention is to provide a barrier film having the extremely high barrier property and the better transparency, a method for manufacturing the same, and a laminated material, a container for wrapping and an image displaying medium using the barrier film. According to the present invention, there is provided a barrier film provided with a barrier layer on at least one surface of a substrate film, wherein the barrier layer is a silicon oxide film having an atomic ratio in a range of Si:O:C=100:160 to 190:30 to 50, a peak position of infrared-ray absorption due to Si—O—Si stretching vibration between 1030 to 1060 cm −1 , a film density in a range of 2.5 to 2.7 g/cm 3 , and a distance between grains of 30 nm or shorter. Still more, there is provided a barrier film provided with a barrier layer on at least one surface of a substrate film, wherein the barrier layer is a silicon oxi-nitride film having an atomic ratio in a range of Si:O:N:C=100:80 to 110:40 to 70:30 to 50, a maximum peak of infrared-ray absorption due to Si—O stretching vibration and Si-N stretching vibration in a range of 900 to 1000 cm −1 , a film density in a range of 2.7 to 3.0 g/cm 3 , and a distance between grains of 30 nm or shorter.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A barrier film provided with a barrier layer on at least one surface of a substrate film, wherein 
 the barrier layer is a silicon oxide film, and the silicon oxide film has an atomic ratio in a range of Si:O:C=100:160 to 190:30 to 50, a peak position of infrared-ray absorption due to Si—O—Si stretching vibration between 1030 to 1060 cm −1 , a film density in a range of 2.5 to 2.7 g/cm 3 , and a distance between grains of 30 nm or shorter.    
     
     
         2 . The barrier film according to  claim 1 , wherein the barrier layer is provided on the substrate film via a resin layer.  
     
     
         3 . The barrier film according to  claim 1 , wherein a resin layer is provided on the barrier layer.  
     
     
         4 . The barrier film according to  claim 1 , wherein an oxygen transmission rate thereof is 0.1 cc/m 2 /day·atm or lower, and a water vapor transmission rate thereof is 0.1 g/m 2 /day or lower.  
     
     
         5 . A laminated material, wherein a heat sealable resin layer is provided on at least one surface of the barrier film according to  claim 1 .  
     
     
         6 . A container for wrapping, wherein the container is obtained by making a bag or a can by heat anastomosing the heat sealable resin layer using the laminated material according to  claim 5 .  
     
     
         7 . A laminated material, wherein a conductive layer is provided on at least one surface of the barrier film according to  claim 1 .  
     
     
         8 . An image displaying medium, wherein an image displaying layer is provided on the conductive layer using the laminated material according to  claim 7  as the substrate.  
     
     
         9 . A method for manufacturing a barrier film, comprising forming, as a barrier layer, a silicon oxide film having an atomic ratio in a range of Si:O:C=100:160 to 190:30 to 50, a peak position of infrared-ray absorption due to Si—O—Si stretching vibration between 1030 to 1060 cm −1 , a film density in a range of 2.5 to 2.7 g/cm 3  and a distance between grains of 30 nm or shorter, on a substrate film, using either of silicon having a sintered density of 80% or higher or SiO x  (‘x’ is 1 to 2) having a sintered density of 80% or higher as a film forming material, in the presence of an oxygen gas by an ion plating method.  
     
     
         10 . The method for manufacturing a barrier film according to  claim 9 , wherein the ion plating method is a hollow cathode type ion plating method.  
     
     
         11 . The method for manufacturing a barrier film according to  claim 9 , wherein a resin layer is provided on the substrate film in advance, and the barrier layer is formed on the resin layer.  
     
     
         12 . A barrier film provided with a barrier layer on at least one surface of a substrate film, wherein 
 the barrier layer is a silicon oxi-nitride film, and the silicon oxi-nitride film has an atomic ratio in a range of Si:O:N:C=100:80 to 110:40 to 70:30 to 50, a maximum peak of infrared-ray absorption due to Si—O stretching vibration and Si—N stretching vibration in a range of 900 to 1000 cm −1 , a film density in a range of 2.7 to 3.0 g/cm 3 , and a distance between grains of 30 nm or shorter.    
     
     
         13 . The barrier film according to  claim 12 , wherein the barrier layer is provided on the substrate film via a resin layer.  
     
     
         14 . The barrier film according to  claim 12 , wherein a resin layer is provided on the barrier layer.  
     
     
         15 . The barrier film according to  claim 12 , wherein an oxygen transmission rate thereof is 0.1 cc/m 2 /day·atm or lower, and a water vapor transmission rate thereof is 0.1 g/m 2 /day or lower.  
     
     
         16 . A laminated material, wherein a heat sealable resin layer is provided on at least one surface of the barrier film according to  claim 12 .  
     
     
         17 . A container for wrapping, wherein the container is obtained by making a bag or a can by heat anastomosing the heat sealable resin layer using the laminated material according to  claim 16 .  
     
     
         18 . A laminated material, wherein a conductive layer is provided on at least one surface of the barrier film according to  claim 12 .  
     
     
         19 . An image displaying medium, wherein an image displaying layer is provided on the conductive layer using the laminated material according to  claim 18  as the substrate.  
     
     
         20 . A method for manufacturing a barrier film, comprising forming, as a barrier layer, a silicon oxi-nitride film having an atomic ratio in a range of Si:O:N:C=100:80 to 110:40 to 70:30 to 50, a maximum peak of infrared-ray absorption due to Si—O stretching vibration and Si—N stretching vibration in a range of 900 to 1000 cm −1 , a film density in a range of 2.7 to 3.0 g/cm 3  and a distance between grains of 30 nm or shorter, on a substrate film, using either of silicon having a sintered density of 80% or higher or silicon oxide having a sintered density of 80% or higher as a film forming material, in the presence of a nitrogen gas, or in the presence of a nitrogen gas and an oxygen gas by an ion plating method.  
     
     
         21 . The method for manufacturing a barrier film according to  claim 20 , wherein the ion plating method is a hollow cathode type ion plating method.  
     
     
         22 . The method for manufacturing a barrier film according to  claim 20 , wherein a resin layer is provided on the substrate film in advance, and the barrier layer is formed on the resin layer.

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