Semiconductor manufacturing device, semiconductor manufacturing system and substrate treating method

Abstract

A semiconductor manufacturing device having a buffer unit which receives a substrate treating substance from an external source, stores it therein, and delivers it to an external unit.

What is claimed is:  
     
         1 . A semiconductor manufacturing device comprising a buffer unit which receives a substrate treating substance from an external source, stores it therein, and delivers it to an external unit.  
     
     
         2 . A semiconductor manufacturing device comprising: 
 a substrate treating chamber; and    a buffer unit provided in said substrate treating chamber or in said semiconductor manufacturing device, receiving a substrate treating substance from an external source, storing it therein, and delivering it to said substrate treating chamber or said semiconductor manufacturing device for the purpose of treating substrates.    
     
     
         3 . The semiconductor manufacturing device of  claim 1  or  2  further comprising a control unit controlling states of said substrate treating substance in said buffer unit.  
     
     
         4 . The semiconductor manufacturing device of  claim 1  or  2  further comprising a measuring unit measuring the states of said substrate treating substance in said buffer unit.  
     
     
         5 . The semiconductor manufacturing device of  claim 1  or  2 , wherein said buffer unit stores a predetermined amount of said substrate treating substance necessary for at least one substrate treating process in said substrate treating chamber or said semiconductor manufacturing device, and is capable of delivering said substrate treating substance to either said substrate treating chamber or said semiconductor manufacturing device.  
     
     
         6 . The semiconductor manufacturing device of  claim 1  or  2 , wherein said buffer unit stores simultaneously at least two kinds of substrate treating substances used by said substrate treating chamber, and is capable of delivering them to said substrate treating chamber.  
     
     
         7 . The semiconductor manufacturing device of  claim 1  or  2 , wherein said buffer unit reacts said substrate treating substance, and stores said reacted substrate treating substance therein.  
     
     
         8 . The semiconductor manufacturing device of  claim 3 , wherein said control unit controls at least a temperature, a pressure or a concentration of said substrate treating substance stored in said buffer unit.  
     
     
         9 . The semiconductor manufacturing device of  claim 4 , wherein said measuring unit measures at least a temperature, a pressure or a concentration of said substrate treating substance stored in said buffer unit.  
     
     
         10 . The semiconductor manufacturing device of  claim 1  or  2 , wherein said substrate treating substance in said substrate treating chamber or said manufacturing device is a gas, a liquid or a solid necessary for the substrate treatment.  
     
     
         11 . The semiconductor manufacturing device of  claim 1  or  2 , wherein said substrate treating substance is a cleaning gas for said substrate treating chamber.  
     
     
         12 . The semiconductor manufacturing device of  claim 1  or  2  further comprising a second buffer unit which recycles said substrate treating substance discharged from said substrate treating chamber or said semiconductor manufacturing device, and returns the recycled substrate treating substance to said substrate treating chamber or said semiconductor manufacturing device.  
     
     
         13 . A semiconductor manufacturing system comprising: 
 an external source supplying a substrate treating substance;    a semiconductor manufacturing device including at least a substrate treating chamber;    a buffer unit receiving said a substrate treating substance from said external source, storing it therein, and delivering it to said substrate treating chamber or said semiconductor manufacturing device; and    a control unit controlling the delivery of said substrate treating substance from said external source to said buffer unit and the delivery of said substrate treating substance from said buffer unit to said substrate treating chamber or said semiconductor manufacturing device.    
     
     
         14 . The semiconductor manufacturing system of  claim 13  further comprising a computer-integrated manufacturing system which thoroughly manages the delivery of said substrate treating substance from said external unit, the receipt and storage of said substrate treating substance in and from said buffer unit, and controls the operations of said semiconductor manufacturing device and said control unit.  
     
     
         15 . The semiconductor manufacturing system of  claim 14 , wherein said computer-integrated manufacturing system includes a record-keeping database which records and manages an in-service schedule of the substance treatment and a manufacture schedule, and controls at least a delivery speed or a delivery order of said substrate treating substance from said external source to said semiconductor manufacturing device via said buffer unit.  
     
     
         16 . A substrate treating method comprising: 
 receiving a substrate treating substance from an external source, storing in a buffer unit said substrate treating substance necessary for at least one substrate treating process, and delivering a predetermined amount of said substrate treating substance to a substrate treating chamber or a semiconductor manufacturing device provided with a substrate treating chamber.    
     
     
         17 . A substrate treating method comprising: 
 delivering substrates into a substrate treating chamber;    receiving a substrate treating substance from an external source, storing in a buffer unit said substrate treating substance necessary for at least one substrate treating process; and    delivering a predetermined amount of said substrate treating substance to a substrate treating chamber or a semiconductor manufacturing device provided with a substrate treating chamber.    
     
     
         18 . The substrate treating method of  claim 16  or  17 , wherein at least two kinds of substrate treating substances are simultaneously stored in said buffer unit.  
     
     
         19 . The substrate treating method of  claim 16  or  17 , wherein said substrate treating substance is reacted and is stored in said buffer unit.  
     
     
         20 . The substrate treating method of  claim 16  or  17 , wherein at least a temperature, a pressure or a concentration of said substrate treating substance stored in said buffer unit is controlled or measured.  
     
     
         21 . The substrate treating method of  claim 16  or  17 , wherein said substrate treating substances stored in said buffer unit are gases, liquids or solids.  
     
     
         22 . The substrate treating method of  claim 16  or  17 , wherein said substrate treating substances stored in said buffer unit are cleaning gases for said substrate treating chamber.  
     
     
         23 . The substrate treating method of  claim 16  or  17  further comprising: 
 recycling said substrate treating substance discharged from said substrate treating chamber or said semiconductor manufacturing device;  
 storing said recycled substrate treating substance in a second buffer unit; and  
 returning said recycled substrate treating substance to said substrate treating chamber or said semiconductor manufacturing device from said second buffer unit.