US2003218075A1PendingUtilityA1

Thermal heating board

23
Priority: Dec 3, 1998Filed: Mar 3, 2003Published: Nov 27, 2003
Est. expiryDec 3, 2018(expired)· nominal 20-yr term from priority
Inventors:Morgan Muir
Y02B30/00F24D 3/14F24D 3/148
23
PatentIndex Score
0
Cited by
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References
0
Claims

Abstract

An improved hydronic radiant heating system comprising a nonstructural board having a recess formed in one surface of said board, a pipe located within said recess, and, if desired, a film of metal covering said surface of said board and having a thickness proportional to the thermal properties of said board to provide desired overall thermal characteristics for said heating system.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A hydronic radiant heating system comprising: 
 a nonstructural supporting board mountable on a subfloor having at least one undercut recess formed in one surface of said supporting board, and    a pipe releasably retained [located] within said recess.    
     
     
         2 . The heating system of  claim 1  wherein: 
 said supporting board is formed of thermally conductive material.  
 
     
     
         3 . The heating system of  claim 1  wherein: 
 said supporting board is formed of a wood.  
 
     
     
         4 . The heating system of  claim 1  wherein: 
 said supporting board is formed of plywood.  
 
     
     
         5 . The heating system of  claim 1  wherein: 
 said supporting board is formed of fiberboard.  
 
     
     
         6 . The heating system of  claim 1  wherein: 
 said supporting board is formed of metal.  
 
     
     
         7 . The heating system of  claim 1  wherein: 
 said supporting board is formed of recycled material.  
 
     
     
         8  The heating system of  claim 1  wherein: 
 said recess is formed in the upper surface of said supporting board.  
 
     
     
         9 . The heating system of  claim 1  further comprising: 
 a coat of thermally conductive material applied to said surface of said supporting board.  
 
     
     
         10  The heating system of  claim 8  wherein: 
 said thermally conductive coat is formed by spraying molten metal onto said surface.  
 
     
     
         11 . The heating system of  claim 1  wherein: 
 said thermally-conductive coat is formed by applying at least one ply of metal foil to said surface.  
 
     
     
         12 . The heating system of  claim 1  wherein: 
 said member is applied of a subfloor.  
 
     
     
         13 . The heating system of  claim 1  wherein: 
 said member is applied to an existing floor.  
 
     
     
         14 . The heating system of  claim 1  wherein: 
 said member is applied to a wall.  
 
     
     
         15 . The heating system of  claim 1  wherein: 
 said member is applied to a ceiling.  
 
     
     
         16 . The heating system of  claim 1  wherein: 
 the thickness of said thermally-conductive coat is varied in pro-portion to the thermal properties of said supporting board.  
 
     
     
         16 . The heating system of  claim 1  wherein: 
 a pair of supporting members are provided, an upper one formed with a recess and the other having no recess.  
 
     
     
         17 . The heating system of  claim 16  further comprising: 
 a layer of thermally conductive material interposed between said board.  
 
     
     
         18 . The heating system of  claim 1  further comprising: 
 a layer of metal applied to overlie said recess,  
 said metal layer being subsequently slit loingitudinally of said recess and having the adjacent portions of said metal layer pressed into said recess.  
 
     
     
         19 . The heating system of  claim 1  further comprising: 
 said recess extending completely through said board,  
 a second board underlying said recessed board, and  
 a layer of metal foil interposed between said boards.  
 
     
     
         20 . A hydronic radiant heating system comprising: 
 a nonstructural supporting board mountable on a subfloor having at least one recess formed in one surface of said supporting board, and    a pipe frictionally retained within said recess.    
     
     
         21 . The heating system of  claim 20  wherein: 
 said supporting board is formed of thermally conductive material.  
 
     
     
         22 . The heating system of  claim 20  wherein: 
 said supporting board is formed of a wood.  
 
     
     
         23 . The heating system of  claim 20  wherein: 
 said supporting board is formed of plywood.  
 
     
     
         24 . The heating system of  claim 20  wherein: 
 said supporting board is formed of fiberboard.  
 
     
     
         25 . The heating system of  claim 20  wherein: 
 said supporting board is formed of recycled material.  
 
     
     
         26  The heating system of  claim 20  wherein: 
 said recess is formed in the upper surface of said supporting board.  
 
     
     
         27 . The heating system of  claim 20  further comprising: 
 a coat of thermally conductive material applied to said surface of said supporting board.  
 
     
     
         28 . The heating system of  claim 27  wherein: 
 said thermally conductive coat is formed by spraying molten metal onto said surface.  
 
     
     
         29 . The heating system of  claim 20  wherein: 
 said thermally-conductive coat is formed by applying at least one ply of metal foil to said surface.  
 
     
     
         30 . The heating system of  claim 1  wherein: 
 said member is applied of a subfloor.  
 
     
     
         31 . The heating system of  claim 20  wherein: 
 said member is applied to an existing floor.  
 
     
     
         32 . The heating system of  claim 20  wherein: 
 said member is applied to a wall.  
 
     
     
         33 . The heating system of  claim 20  wherein: 
 said member is applied to a ceiling.  
 
     
     
         34 . The heating system of  claim 20  wherein: 
 the thickness of said thermally-conductive coat is varied in pro-portion to the thermal properties of said supporting board.  
 
     
     
         34 . The heating system of  claim 20  wherein: 
 a pair of supporting members are provided, an upper one formed with a recess and the other having no recess.  
 
     
     
         35 . The heating system of  claim 34  further comprising: 
 a layer of thermally conductive material interposed between said board.  
 
     
     
         36 . The heating system of  claim 20  further comprising: 
 a layer of metal applied to overlie said recess,  
 said metal layer being subsequently slit loingitudinally of said recess and having the adjacent portions of said metal layer pressed into said recess.  
 
     
     
         37 . The heating system of  claim 20  further comprising: 
 said recess extending completely through said board,  
 a second board underlying said recessed board, and  
 a layer of metal foil interposed between said boards.

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