Heat transfer device

Abstract

A heat transfer device includes a thermal superconducting body, which has a hollow heat transfer body and a heat transfer layer. The hollow heat transfer body is made of a heat conductive material and has a flat top portion and a flat bottom portion connected to the flat top portion and cooperating with the flat top portion to form a sealed vacuum receiving space therebetween. The heat transfer layer is made of a thermal superconductor material, is disposed in the vacuum receiving space, and forms a superconductor lining on an inner wall surface of the heat transfer body.

I claim:  
     
         1 . A heat transfer device comprising: 
 a thermal superconducting body including 
 a hollow heat transfer body made of a heat conductive material and having a flat top portion and a flat bottom portion connected to said flat top portion and cooperating with said flat top portion to form a sealed vacuum receiving space therebetween; and  
 a heat transfer layer made of a thermal superconductor material, disposed in said vacuum receiving space, and forming a superconductor lining on an inner wall surface of said heat transfer body.  
   
     
     
         2 . The heat transfer device as claimed in  claim 1 , wherein said flat top portion is formed with a plurality of recesses, each of which has a bottom that extends to and that is in contact with said flat bottom portion.  
     
     
         3 . The heat transfer device as claimed in  claim 1 , further comprising a heat collecting plate mounted on said flat bottom portion externally of said vacuum receiving space.  
     
     
         4 . The heat transfer device as claimed in  claim 3 , wherein said heat collecting plate has opposite surfaces, each of which is coated with heat conducting paste.  
     
     
         5 . The heat transfer device as claimed in  claim 4 , wherein said heat collecting plate is made of thermal conductive metal selected from a group consisting of copper and aluminum.  
     
     
         6 . The heat transfer device as claimed in  claim 1 , wherein said thermal superconductor material includes at least one compound selected from the group consisting of sodium peroxide, sodium oxide, beryllium oxide, manganese sesquioxide, aluminum dichromate, calcium dichromate, boron oxide, dichromate radical, and combinations thereof; at least one compound selected from the group consisting of cobaltous oxide, manganese sesquioxide, beryllium oxide, strontium chromate, strontium carbonate, rhodium oxide, cupric oxide, β-titanium, potassium dichromate, boron oxide, calcium dichromate, manganese dichromate, aluminum dichromate, dichromate radical, and combinations thereof; and at least one compound selected from the group consisting of denatured rhodium oxide, potassium dichromate, denatured radium oxide, sodium dichromate, silver dichromate, monocrystalline silicon, beryllium oxide, strontium chromate, boron oxide, sodium peroxide, β-titanium, a metal dichromate, and combinations thereof.  
     
     
         7 . The heat transfer device as claimed in  claim 1 , wherein said heat conductive material for said hollow heat transfer body is selected from a group consisting of aluminum, copper, metal alloy, ceramics, glass, graphite, and thermal conductive plastic.