Process and composition for removing residues from the microstructure of an object

Abstract

A process for removing residues from the microstructure of an object is provided, which comprises steps of preparing a remover including carbon dioxide, an additive for removing the residues and a co-solvent dissolving the additive in said carbon dioxide at a pressurized fluid condition; and bringing the object into contact with the remover so as to remove the residues from the object. A composition for removing residues from the microstructure of an object is also provided.

What is claimed is:  
     
         1 . A process for removing residues from the microstructure of an object comprising steps of: 
 preparing a remover including carbon dioxide, an additive for removing the residues, an inhibitor for suppressing residues and a co-solvent for dissolving said additive and said inhibitor in said carbon dioxide at a pressurized fluid condition; and    bringing the object into contact with said remover so as to remove the residues from the object.    
     
     
         2 . The process according to  claim 1 , wherein said additive includes quaternaryammoniumfluoride.  
     
     
         3 . The process according to  claim 1 , wherein said additive includes tetramethylammoniumfluoride.  
     
     
         4 . The process according to  claim 1 , wherein the concentration of said additive is between 0.001 to 0.1 weight percent.  
     
     
         5 . The process according to  claim 1 , wherein said inhibitor includes polyhydric alcohol.  
     
     
         6 . The process according to  claim 5 , wherein said polyhydric alcohol is a dihydric alcohol.  
     
     
         7 . The process according to  claim 5 , wherein said dihydric alcohol is a propylene glycol.  
     
     
         8 . A process for removing residues from the microstructure of an object comprising steps of: 
 preparing a remover including carbon dioxide, an additive for removing the residues and a co-solvent for dissolving said additive in said carbon dioxide at a pressurized fluid condition; and    bringing the object into contact with said remover so as to remove the residues from the object followed by a rinse step including rinse agent of which dielectric constant at a temperature and pressure of 25° C. and 1 at m is 78 or larger.    
     
     
         9 . The process according to  claim 8 , wherein said rinse agent is selected from at least one of the compounds including water, formamide, methylformamide and methylacetamide.  
     
     
         10 . The process according to  claim 8 , wherein said remover includes an inhibitor for suppressing residues.  
     
     
         11 . The process according to  claim 8 , wherein said additive includes quaternaryammoniumfluoride.  
     
     
         12 . The process according to  claim 8 , wherein said additive includes tetramethylammoniumfluoride.  
     
     
         13 . The process according to  claim 8 , wherein the concentration of said additive is between 0.001 to 0.1 weight percent.  
     
     
         14 . The process according to  claim 10 , wherein said inhibitor includes polyhydric alcohol.  
     
     
         15 . The process according to  claim 14 , wherein said polyhydric alcohol is a dihydric alcohol.  
     
     
         16 . The process according to  claim 14 , wherein said dihydric alcohol is a propylene glycol.  
     
     
         17 . A composition for removing residue from the microstructure of an object, comprising: 
 carbon dioxide, a fluoride containing additive, a co-solvent or mixture of co-solvents capable of dissolving the fluoride containing additive, and an inhibitor.    
     
     
         18 . The composition according to  claim 17 , wherein the fluoride containing additive is a quaternary ammonium fluoride.  
     
     
         19 . The composition according to  claim 18 , wherein the quaternary ammonium fluoride is tetramethylammonium fluoride.  
     
     
         20 . The composition according to  claim 17 , wherein the co-solvent or mixture of co-solvents is ethanol, methanol, n-propanol, isopropanol, n-butanol or dimethylacetamide.  
     
     
         21 . The composition according to  claim 20 , wherein the co-solvent is a mixture of ethanol and dimethylacetamide.  
     
     
         22 . The composition according to  claim 17 , wherein the inhibitor is propylene glycol.  
     
     
         23 . A composition for removing residue from the microstructure of an object, comprising: 
 carbon dioxide, tetramethylammoniumfluoride, ethanol, dimethylacetamide, and propylene glycol.