Hole fill composition and method for filling holes in a substrate

Abstract

A composition usable in hole filling of a metal layer and to planarize the metal layer is provided. The metal layer is part of a substrate which can be part of a multilayer printed circuit board or chip carrier. The composition comprises a fluoropolymer dielectric metal, a filler material, and a coupling agent, the filler material having at least a partial coating of the coupling agent.

We claim:  
     
         1 . A hole fill composition comprising: 
 a fluoropolymer dielectric material;    a filler material; and    a coupling agent, said filler material having at least a partial coating of said coupling agent thereon.    
     
     
         2 . The composition of  claim 1  wherein said fluoropolymer dielectric material is selected from the group consisting of polymers of tetrafluoroethylene and its copolymers including tetrafluoroethylene and perfluoroalkoxy, tetrafluoroethylene and ethylene, and tetrafluoroethylene and at least 65 mole % of perfluoro-2,2-dimethyl-1,3-di-oxide; hexafluoropropylene; perfluoro-2-2-dimethyl-1,3 dioxide; polymers and copolymers of trifluorochloroethylene including trifluorochloroethylene and ethylene; polymers of perfluoroalkyl vinyl ether; and perfluorinated ethylene-propylene copolymers.  
     
     
         3 . The composition of  claim 1  wherein said fluoropolymer dielectric material comprises about 40 percent by weight to about 90 percent by weight of said composition.  
     
     
         4 . The composition of  claim 1  wherein said filler material comprises about 9 percent by weight to about 60 percent by weight of said composition.  
     
     
         5 . The composition of  claim 1  wherein said coupling agent comprises about 1 percent by weight to about 10 percent by weight of said composition.  
     
     
         6 . The invention of  claim 1  wherein said composition has a pH of about 8 to about 11.  
     
     
         7 . A hole fill composition comprising: 
 a fluoropolymer dielectric material;    a surfactant;    a filler material; and    a coupling agent, said filler material having at least a partial coating of said coupling agent thereon.    
     
     
         8 . The composition of  claim 7  wherein said surfactant comprises a non-ionic surface active agent.  
     
     
         9 . A hole fill composition comprising: 
 a fluoropolymer dielectric material;    a silica filler material; and    a coupling agent, said filler material having at least a partial coating of said coupling agent thereon.    
     
     
         10 . The composition of  claim 9  wherein said fluoropolymer dielectric material is selected from the group consisting of polymers of tetrafluoroethylene and its copolymers, including tetrafluoroethylene and perfluoroalkoxy, tetrafluoroethylene and ethylene, and tetrafluoroethylene and at least 65 mole % of perfluoro-2,2-dimethyl-1,3-di-oxide; hexafluoropropylene; perfluoro-2-2-dimethyl-1,3 dioxide; polymers and copolymers of trifluorochloroethylene including trifluorochloroethylene and ethylene; polymers of perfluoroalkyl vinyl ether; and perfluorinated ethylene-propylene copolymers.  
     
     
         11 . The composition of  claim 9  wherein said fluoropolymer dielectric material comprises about 40 percent by weight to about 90 percent by weight of said composition.  
     
     
         12 . The composition of  claim 9  wherein said silica of said silica filler is selected from the group consisting of crystalline silica, fumed silica, synthetic silica, precipitated silica, and amorphous silica.  
     
     
         13 . The composition of  claim 9  wherein said silica filler material comprises about 9 percent by weight to about 60 percent by weight of said composition.  
     
     
         14 . The composition of  claim 9  wherein said silica of said silica filler material is comprised of particles, each particle having a size of from about 0.1 micron to about 40 microns.  
     
     
         15 . The composition of  claim 14  wherein said particles of silica are substantially spherical or spheroidal.  
     
     
         16 . The composition of  claim 9  wherein said coupling agent comprises about 1 percent by weight to about 10 percent by weight of said composition.  
     
     
         17 . The invention of  claim 9  wherein said composition has a pH of about 8 to about 11.  
     
     
         18 . A hole fill composition comprising: 
 a fluoropolymer dielectric material;    a surfactant;    a silica filler material; and    a coupling agent, said filler material having at least a partial coating of said coupling agent thereon.    
     
     
         19 . The composition of  claim 18  wherein said surfactant comprises a non-ionic surface active agent.  
     
     
         20 . A hole fill composition comprising: 
 a fluoropolymer dielectric material;    a filler material; and    a fluorosilane coupling agent, said filler material having at least a partial coating of said coupling agent thereon.    
     
     
         21 . The composition of  claim 20  wherein said fluoropolymer dielectric material is selected from the group consisting of polymers of tetrafluoroethylene and its copolymers, including tetrafluoroethylene and perfluoroalkoxy, tetrafluoroethylene and ethylene, and tetrafluoroethylene and at least 65 mole % of perfluoro-2,2-dimethyl-1,3-di-oxide; hexafluoropropylene; perfluoro-2-2-dimethyl-1,3 dioxide; polymers and copolymers of trifluorochloroethylene including trifluorochloroethylene and ethylene; polymers of perfluoroalkyl vinyl ether; and perfluorinated ethylene-propylene copolymers.  
     
     
         22 . The composition of  claim 20  wherein said fluoropolymer dielectric material comprises about 40 percent by weight to about 90 percent by weight of said composition.  
     
     
         23 . The composition of  claim 20  wherein said filler material comprises about 9 percent by weight to about 60 percent by weight of said composition.  
     
     
         24 . The composition of  claim 20  wherein said fluorosilane coupling agent includes alkoxy or halo groups attached to an Si group.  
     
     
         25 . The composition of  claim 20  wherein said fluorosilane coupling agent comprises about 1 percent by weight to about 10 percent by weight of said composition.  
     
     
         26 . The invention of  claim 20  wherein said composition has a pH of about 8 to about 11.  
     
     
         27 . A hole fill composition comprising: 
 a fluoropolymer dielectric material;    a surfactant;    a filler material; and    a fluorosilane coupling agent, said filler material having at least a partial coating of said coupling agent thereon.    
     
     
         28 . The composition of  claim 27  wherein said surfactant comprises a non-ionic surface active agent.