System and method for processor power delivery and thermal management

Abstract

A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.

What is claimed is:  
     
         1 . An apparatus for providing power to a power dissipating device, comprising: 
 a first circuit board having a power conditioner circuit, the first circuit board having a first side and a second side having a plurality of first circuit board contacts thereon, the first circuit board contacts including a first set of first circuit board contacts communicatively coupled to a first power conditioner circuit connector and a second set of first circuit board contacts communicatively coupled to a second power conditioning circuit connector;    a second circuit board having: 
 the power dissipating device mounted thereto;  
 a plurality of second circuit board contacts disposed on a first side of the second circuit board, the second circuit board contacts including a first set of second circuit board contacts communicatively coupled to a power dissipating device first connector and a second set of second circuit board contacts communicatively coupled to a second connector of the power dissipating device;  
   a plurality of z-axis compliant conductors disposed at least partially between the first circuit board contacts and the second circuit board contacts; and 
 wherein the plurality of z-axis compliant conductors includes a first set of z-axis compliant conductors in contact with and disposed between the first set of first circuit board contacts and the first set of second circuit board contacts, and a second set of z-axis compliant conductors disposed in contact with and between the second set of first circuit board contacts and the second set of second circuit board contacts, and  
   wherein the first set of first circuit board contacts, the first set of z-axis compliant conductors, and the first set of second circuit board contacts define a plurality of first paths from the first circuit board to the second circuit board and wherein the second set of circuit board contacts, the second set of z-axis compliant conductors, and the second set of second circuit board contacts define a plurality of second paths from the first circuit board to the second circuit board.