Planarization system with multiple polishing pads

Abstract

A chemical mechanical planarization system and method for planarizing wafers is provided. The system generally includes a transfer corridor, at least one corridor robot, one or more polishing modules and at least one loading device. The corridor robot is disposed in the transfer corridor and is positionable between a first end and a second end of the transfer corridor. The loading device is adapted to transfer workpieces between the transfer corridor and the polishing modules. Generally, the loading device includes at least one load cup. The one or more polishing modules each include one or more polishing heads for holding workpieces during processing.

What is claimed is:  
     
         1 . A polishing system comprising: 
 a plurality of polishing modules arranged in a linear orientation;    a substrate cleaner; and    a first robot positioned between the substrate cleaner and polishing modules, the first robot laterally positionable in a direction parallel to the linear orientation of the polishing modules and adapted to transfer a substrate between at least two of the plurality of polishing modules.    
     
     
         2 . The polishing system of  claim 1 , wherein the plurality of polishing modules further comprise four polishing heads, each polishing head adapted to retain a substrate during processing.  
     
     
         3 . The polishing system of  claim 2 , wherein the polishing modules further comprise four load cups aligned parallel to the orientation of the polishing modules, the load cups adapted to transfer substrates between the polishing heads and the first robot.  
     
     
         4 . The polishing system of  claim 1  further comprising: 
 factory interface adapted to accept a plurality of substrate storage cassettes; and  
 a second robot disposed in the factory interface and adapted to transfer substrates between the cassettes and the first robot.  
 
     
     
         5 . The polishing system of  claim 1  further comprising a rail disposed between the substrate cleaner and the plurality of polishing modules, wherein the first robot is slidably coupled to the rail and adapted to be selectively positioned along the rail.  
     
     
         6 . The polishing system of  claim 5  further comprising a second robot slidably coupled to the rail.  
     
     
         7 . The polishing system of  claim 1 , wherein the substrate cleaner has an orientation parallel to the orientation of the polishing modules.  
     
     
         8 . The polishing system of  claim 4  further comprising: 
 a third robot disposed at an end of the substrate cleaner opposite the factory interface.  
 
     
     
         9 . A polishing system comprising: 
 a plurality of polishing modules defining a first linear orientation;    four polishing heads adapted to retain substrates during processing in the polishing modules;    a substrate cleaner having an orientation parallel to the first orientation of the polishing modules;    a first robot positioned between the substrate cleaner and polishing modules, the first robot laterally positionable in a direction parallel to the first orientation of the polishing modules and adapted to selectively position a substrate adjacent each of the plurality of polishing modules;    four load cups aligned parallel to the first orientation of the polishing modules, and adapted to transfer substrates between the polishing heads and the first robot;    factory interface adapted to accept a plurality of substrate storage cassettes; and    a second robot disposed in the factory interface and adapted to transfer substrates between the cassettes and the first robot.    
     
     
         10 . The polishing system of  claim 9  further comprising a rail disposed between the substrate cleaner and the plurality of polishing modules, wherein the first robot is slidably coupled to the rail and adapted to be selectively positioned along the rail.  
     
     
         11 . The polishing system of  claim 10  further comprising a third robot slidably coupled to the rail.  
     
     
         12 . The polishing system of  claim 9  further comprising: 
 a third robot disposed at an end of the substrate cleaner opposite the factory interface.  
 
     
     
         13 . A method of polishing a substrate, comprising: 
 moving a substrate, retained in a transfer device, in a first direction to position the substrate proximate a first load cup selected from a plurality of load cups aligned parallel to the first direction;    moving the substrate in a second direction perpendicular to the first direction to a first polishing module;    polishing the substrate in the first polishing module;    moving the substrate in a third direction that is opposite the second direction to the transfer device;    moving the substrate retained in the transfer device to position the substrate proximate a second load cup selected from the plurality of load cups;    moving the substrate in the second direction to a second polishing module; and    polishing the substrate in the second polishing module.    
     
     
         14 . The method of  claim 13  further comprising: 
 moving the substrate in the third direction to the transfer device; and  
 moving the substrate in the third direction to a cleaning module.  
 
     
     
         15 . The method of  claim 14  further comprising: 
 moving a substrate through the cleaning module in a fourth direction that is opposite the first direction.  
 
     
     
         16 . The method of  claim 13  further comprising: 
 polishing a second substrate in the second polishing module;  
 polishing a third substrate in a third polishing module; and  
 polishing a fourth substrate in a fourth polishing module, wherein the second, third and fourth substrates are polished while the first substrate is polished in the first polishing module.  
 
     
     
         17 . The method of  claim 13 , wherein the step of moving the substrate proximate the second load cup further comprises moving the transfer device in the first direction.  
     
     
         18 . The method of  claim 13 , wherein the step of moving the substrate proximate the second load cup further comprises moving the transfer device in a third direction that is opposite the first direction.