Polishing device and polishing method for semiconductor wafer

Abstract

A polishing device includes a polishing surface plate which is driven rotatively, a polishing cloth attached on a surface of the polishing surface plate, an abrasive feeding mechanism feeding abrasive on the polishing cloth, a wafer holding mechanism holding a semiconductor wafer, and a guide member arranged on the polishing cloth and having a groove to allow the abrasive to pass therethrough and guide the abrasive to an inward side of the polishing surface plate.

What is claimed is:  
     
         1 . A polishing device for a semiconductor wafer, comprising: 
 a polishing surface plate driven rotatively;    a polishing member attached on a surface of said polishing surface plate;    an abrasive feeding mechanism feeding abrasive on said polishing member;    a wafer holding mechanism holding a semiconductor wafer on said polishing member; and    a guide member arranged on said polishing member and having a groove to allow said abrasive to pass therethrough and guide said abrasive to an inward side of said polishing surface plate.    
     
     
         2 . The polishing device for a semiconductor wafer according to  claim 1 , wherein 
 at least one of wall surfaces of said guide member, which are opposing to define said groove, is extended in a direction inclined from a tangential direction of a periphery of said polishing surface plate which is located directly below said guide member to an inward side of said polishing surface plate.    
     
     
         3 . The polishing device for a semiconductor wafer according to  claim 1 , wherein 
 said groove has a first aperture located on a side facing said semiconductor wafer and a second aperture located on a side distant from said semiconductor wafer, and    width of said first aperture is made larger than that of said second aperture.    
     
     
         4 . The polishing device for a semiconductor wafer according to  claim 1 , wherein 
 said groove is not provided on a portion of said guide member which is located on the central portion of said polishing surface plate, and said groove is provided on a portion which is located on the portion near the periphery of said polishing surface plate.    
     
     
         5 . The polishing device for a semiconductor wafer according to  claim 1 , wherein 
 a plurality of said grooves are provided, and widths of said grooves are made larger in a portion nearer to the periphery of said polishing surface plate.    
     
     
         6 . A polishing method of polishing a semiconductor wafer, including the step of pressing said semiconductor wafer against a polishing member attached on a surface of a rotating polishing surface plate while supplying abrasive on said polishing member; wherein 
 said polishing member has a guide member arranged thereon, the guide member guides said abrasive towards the side of said semiconductor wafer while allowing said abrasive to pass through said guide member, and said semiconductor wafer is polished while guiding said abrasive which has passed through said guide member to an inward side of said polishing surface plate.