Removable modular cell for electro-chemical plating

Abstract

The present invention relates to a method and apparatus for depositing metal on a substrate. More particularly, one embodiment of the metal deposition cell comprising a cell base, an anode, and a cell top. The cell base at least partially defines an interior recess. The anode mounted within the interior recess to the cell base. The cell top is removably mounted to the cell base. In one embodiment, a method of removing a modular metal deposition cell from a deposition cell mount is provided. The modular metal deposition cell comprises a cell top and a cell bottom. The method comprises unfastening a fastener that secures the cell top to the cell bottom, and also fastens the cell top and the cell bottom to the deposition cell mount. The cell top or the cell bottom is then removed from the deposition cell mount.

1 . An electrochemical plating cell, comprising: 
 a lower cell body defining a first fluid containing volume, the first fluid containing volume having a base and upstanding wall that defines an opening;    an upper cell body removably secured to the lower cell body over the opening and defining a second fluid containing volume; and    an anode positioned in the first fluid containing volume.    
     
     
         2 . The electrochemical plating cell of  claim 1 , wherein the first fluid containing volume is in fluid communication with the second fluid containing volume.  
     
     
         3 . The electrochemical plating cell of  claim 2 , wherein the first fluid containing volume is separated from the second fluid containing volume by a diffusion member.  
     
     
         4 . The electrochemical plating cell of  claim 3 , wherein the diffusion member is a fluid permeable porous disk.  
     
     
         5 . The electrochemical plating cell of  claim 4 , wherein the porous disk comprises a porous ceramic material.  
     
     
         6 . The electrochemical plating cell of  claim 1 , wherein an upper portion of the upstanding wall comprises an annular recess forming an overflow weir.  
     
     
         7 . The electrochemical plating cell of  claim 6 , comprising a disk shaped diffusion member sized to be received in the annular recess.  
     
     
         8 . The electrochemical plating cell of  claim 1 , wherein an upper portion of the upstanding wall defines an opening sized to receive substrates therein for processing.  
     
     
         9 . The electrochemical plating cell of  claim 8 , wherein the upper portion of the upstanding wall comprises an overflow weir.  
     
     
         10 . The electrochemical plating cell of  claim 1 , further comprising a removable fastener that connects the cell base to the cell top.  
     
     
         11 . A modular plating cell, comprising: 
 a lower cell body comprising a base member having an annular upstanding wall extending therefrom;    an upper cell body comprising a wall detachably secured at a lower portion thereof to an upper surface of the annular upstanding wall, the upper and lower cell bodies cooperatively defining a fluid volume; and    a diffusion member positioned across the fluid volume.    
     
     
         12 . The modular plating cell of  claim 11 , comprising an anode positioned in the lower cell body.  
     
     
         13 . The modular plating cell of  claim 11 , wherein the upper cell body comprises an annular weir positioned on a top portion of the upstanding wall.  
     
     
         14 . The modular plating cell of  claim 11 , wherein the lower cell body comprises a first annular flange positioned on the upper surface of the annular upstanding wall and the upper cell body comprises a second annular flange positioned on a lower portion of the wall, the first annular flange being configured to engage the second annular flange to secure the upper cell body to the lower cell body.  
     
     
         15 . The modular plating cell of  claim 12 , wherein the first and second annular flanges cooperatively form a detachable fastener.  
     
     
         16 . The modular plating cell of  claim 15 , wherein the detachable fastener comprises a bolted joint.  
     
     
         17 . An electrochemical plating cell, comprising: 
 first cell means for confining electrolyte;    second cell means for confining electrolyte and receiving a substrate therein;    diffusing means disposed at least partially between the first and second cell means to selectively provide fluid communication between the first and second cell means; and    substrate support means for positioning a substrate in the second cell means.    
     
     
         18 . The electrochemical plating cell of  claim 17 , wherein the first cell means comprises a lower cell body defining a first fluid containing volume and the second cell means comprises an upper cell body defining a second fluid containing volume.  
     
     
         19 . The electrochemical plating cell of  claim 18 , wherein the first cell means is detachably connected to the second cell means.  
     
     
         20 . The electrochemical plating cell of  claim 19 , further comprising an anode disposed in the first cell means.  
     
     
         21 . The electrochemical plating cell of  claim 20 , wherein the diffusing means comprises a fluid permeable porous plate.  
     
     
         22 . The electrochemical plating cell of  claim 21 , wherein the diffusing means comprises a ceramic plate.  
     
     
         23 . The electrochemical plating cell of  claim 17 , further comprising an anode disposed in the first cell means.  
     
     
         24 . The electrochemical plating cell of  claim 23 , wherein the diffusing means is a permeable porous plate.  
     
     
         25 . The electrochemical plating cell of  claim 24 , wherein the diffusing means is comprised of ceramic.  
     
     
         26 . The electrochemical plating cell of  claim 24 , wherein the first cell means comprises a lower cell body defining a first fluid containing volume and the second cell means comprises an upper cell body defining a second fluid containing volume and the diffusing means is disposed between the lower cell body and the upper cell body and the upper body defines an opening an upper end thereof.