Compositions including a collection layer
Abstract
Systems and methods are described for compositions, apparatus and/or electronic devices. A composition, includes a composition layer defining a first surface and a second surface, the composition layer including a collection layer that is located closer to the first surface than to the second surface. An apparatus, includes a semiconductor absorber layer defining a first surface and a second surface; and an electrode layer coupled to the first surface of the semiconductor absorber layer, wherein the semiconductor absorber layer includes a collection layer that is located closer to the first surface than to the second surface. A electronic device includes a semiconductor structure for absorbing, the semiconductor structure for absorbing defining a first surface and a second surface; and an electrode structure for conducting coupled to the second surface of the semiconductor structure, where the semiconductor structure includes a collection layer that is located closer to the first surface than to the second surface.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A composition, comprising: a composition layer defining a first surface and a second surface, the composition layer including a collection layer that is located closer to the first surface than to the second surface.
2 . The composition of claim 1 , wherein the collection layer is located adjacent the first surface.
3 . The composition of claim 1 , wherein the collection layer includes a sodium impurity containing layer
4 . The composition of claim 3 , wherein the sodium impurity containing layer includes sodium containing precipitates.
5 . The composition of claim 4 , wherein the sodium containing precipitates include NaInSe 2 .
6 . The composition of claim 1 , wherein the collection layer includes a copper impurity containing layer.
7 . The composition of claim 6 , wherein the copper impurity containing layer includes copper containing precipitates.
8 . The composition of claim 7 , wherein the copper containing precipitates include Cu 2 Se.
9 . The composition of claim 1 , wherein the composition layer includes a semiconductor layer.
10 . The composition of claim 9 , wherein the semiconductor layer includes copper, indium and selenium.
11 . The composition of claim 10 , wherein the semiconductor layer includes aluminum, gallium and sulphur.
12 . The composition of claim 1 , further comprising an electrode layer coupled to the first surface of the composition layer.
13 . The composition of claim 12 , wherein the electrode layer includes at least one metal selected from the group consisting of Mo and Ti.
14 . The composition of claim 1 , further comprising a group 3 rich adhesion layer located between the composition layer and the electrode layer.
15 . The composition of claim 12 , further comprising a substrate coupled to the electrode layer.
16 . The composition of claim 15 , further comprising a diffusion barrier layer located between the composition layer and the substrate.
17 . The composition of claim 1 , wherein the composition layer includes a residual template.
18 . The composition of claim 17 , wherein the residual template is located closer to the second surface than to the first surface
19 . The composition of claim 1 , further comprising a buffer layer coupled to the second surface of the composition layer.
20 . The composition of claim 19 , further comprising a window layer coupled to the buffer layer.
21 . A photovoltaic device comprising the composition of claim 1 .
22 . An electrical power generation system comprising the photovoltaic device of claim 21 .
23 . An electronic device comprising the composition of claim 1 .
24 . A photodiode comprising the composition of claim 1 .
25 . An apparatus, comprising a semiconductor absorber layer defining a first surface and a second surface; and
an electrode layer coupled to the first surface of the semiconductor absorber layer, wherein the semiconductor absorber layer includes a collection layer that is located closer to the first surface than to the second surface.
26 . The apparatus of claim 1 , wherein the collection layer is located adjacent the first surface.
27 . The apparatus of claim 25 , wherein the collection layer includes a sodium impurity containing layer
28 . The apparatus of claim 27 , wherein the sodium impurity containing layer includes sodium containing precipitates.
29 . The apparatus of claim 28 , wherein the sodium containing precipitates include NaInSe 2 .
30 . The apparatus of claim 25 , wherein the collection layer includes a copper impurity containing layer.
31 . The apparatus of claim 30 , wherein the copper impurity containing layer includes copper containing precipitates.
32 . The apparatus of claim 31 , wherein the copper containing precipitates include Cu 2 Se.
33 . The apparatus of claim 25 , wherein the semiconductor absorber layer includes copper, indium and selenium.
34 . The apparatus of claim 33 , wherein the semiconductor layer includes aluminum, gallium and sulphur.
35 . The apparatus of claim 25 , wherein the electrode layer includes at least one metal selected from the group consisting of Mo and Ti.
36 . The apparatus of claim 25 , further comprising a substrate coupled to the electrode layer.
37 . The apparatus of claim 25 , wherein the semiconductor absorber layer includes a residual template.
38 . The apparatus of claim 37 , wherein the residual template is located closer to the second surface than to the first surface
39 . The apparatus of claim 25 , further comprising a group 3 rich adhesion layer located between the semiconductor absorber layer and the electrode layer.
40 . The apparatus of claim 25 , further comprising a substrate coupled to the electrode layer and a diffusion barrier layer located between the semiconductor absorber layer and the substrate.
41 . The apparatus of claim 25 , further comprising a buffer layer coupled to the second surface of the semiconductor absorber layer.
42 . The apparatus of claim 41 , further comprising a window layer coupled to the buffer layer.
43 . A photovoltaic device comprising the apparatus of claim 25 .
44 . An electrical power generation system comprising the photovoltaic device of claim 43 .
45 . An electronic device comprising the apparatus of claim 25 .
46 . A photodiode comprising the apparatus of claim 25 .
47 . A electronic device, comprising:
a semiconductor means for absorbing, the semiconductor means for absorbing defining a first surface and a second surface; and an electrode means for conducting coupled to the second surface of the semiconductor means, wherein the semiconductor means includes a collection layer that is located closer to the first surface than to the second surface.
48 . The electronic device of claim 47 , wherein the collection layer is located adjacent the first surface.
49 . The electronic device of claim 47 , wherein the collection layer includes a sodium impurity containing layer
50 . The electronic device of claim 49 , wherein the sodium impurity containing layer includes sodium containing precipitates.
51 . The electronic device of claim 50 , wherein the sodium containing precipitates include NaInSe 2 .
52 . The electronic device of claim 47 , wherein the collection layer includes a copper impurity containing layer.
53 . The electronic device of claim 52 , wherein the copper impurity containing layer includes copper containing precipitates.
54 . The electronic device of claim 53 , wherein the copper containing precipitates include Cu 2 Se.
55 . The electronic device of claim 47 , wherein the semiconductor means includes copper, indium and selenium.
56 . The electronic device of claim 55 , wherein the semiconductor means includes aluminum, gallium and sulphur.
57 . The electronic device of claim 47 , wherein the electrode means includes at least one metal selected from the group consisting of Mo and Ti.
58 . The electronic device of claim 47 , further comprising a means for providing a substrate coupled to the electrode means.
59 . The electronic device of claim 58 , further comprising a barrier means for inhibiting diffusion located between the semiconductor means and the means for providing a substrate.
60 . The electronic device of claim 47 , wherein the semiconductor means for absorbing includes a residual template.
61 . The electronic device of claim 60 , wherein the residual template is located closer to the second surface than to the first surface
62 . The electronic device of claim 47 , further comprising a group 3 rich means for adhering located between the semiconductor means and the electrode means.
63 . The electronic device of claim 47 , further comprising a means for defining a semiconductor junction coupled to the composition layer.
64 . The electronic device of claim 63 , further comprising an optically transmitting means for providing lateral conductivity coupled to the means for defining a semiconductor junction.
65 . A photovoltaic device comprising the electronic device of claim 47
66 . An electrical power generation system comprising the photovoltaic device of claim 65 .
67 . A photodiode comprising the electronic device of claim 47.Join the waitlist — get patent alerts
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