Apparatus and process for precise encapsulation of flip chip interconnects

Abstract

A method for encapsulating flip chip interconnects includes applying a limited quantity of encapsulating resin to the interconnect side of an integrated circuit chip, and thereafter bringing the chip together with a substrate under conditions that promote the bonding of bumps on the interconnect side of the chip with bonding pads on the substrate. In some embodiments, the step of applying resin to the chip includes dipping the interconnect side of the chip to a predetermined depth in a pool of resin, and then withdrawing the chip from the resin pool. In some embodiments the step of applying resin to the chip includes providing a reservoir having a bottom, providing a pool of resin in the reservoir to a shallow depth over the reservoir bottom, dipping the chip into the resin pool so that the bumps contact the reservoir bottom, and then withdrawing the chip from the resin pool. Also, apparatus for applying a precise volume of encapsulating resin to a chip, includes a reservoir having a bottom, and means for dispensing a pool of encapsulating resin to a predetermined depth over the reservoir bottom.

What is claimed is:  
     
         1 . Apparatus for applying a precise volume of encapsulating resin to an integrated circuit chip, comprising a reservoir having a bottom and means for dispensing a pool of encapsulating resin to a predetermined depth over the reservoir bottom.  
     
     
         2 . Apparatus of  claim 1  per wherein the reservoir is at least deep enough to accommodate a pool having a predetermined depth that approximates a bump standoff height on the chip.  
     
     
         3 . Apparatus of  claim 1  wherein the means for dispensing the resin pool comprises means for dispensing a measured volume of resin into the reservoir.  
     
     
         4 . Apparatus of  claim 1  wherein the means for dispensing the resin pool comprises means for dispensing an excess of resin into the reservoir, and means for removing the excess.