Taper machine using inertial control of parts

Abstract

A method for packaging electronic chips into the compartments of a carrier tape includes feeding a chip into a preselected position with respect to a movable vacuum head, taking custody of the chip by way of a vacuum in the vacuum head, moving the vacuum head in a single motion toward the carrier tape without substantially altering the direction of movement of the vacuum head, and interrupting the vacuum in the vacuum head to release the chip into a compartment of the tape. The chips may be feed by gravity feed. The preselected position may be within a slot in a body, and the body may be bifurcated to provide access for the vacuum head to the slot. The body may be moved aside after the vacuum head has taken custody of the chip to remove a support surface or floor from under the chip. The chip may then be moved downwardly, either directly on along an arcuate path, in a single motion to position the chip in the tape compartment.

1 . A method for packaging electronic chips into the compartments of a carrier tape, the method comprising: 
 feeding a chip into a preselected position with respect to a movable vacuum head;    taking custody of the chip by way of a vacuum in the vacuum head;    moving the vacuum head in a single motion toward the carrier tape without substantially altering the direction of movement of the vacuum head;    wherein the act of moving the vacuum head includes pivoting the vacuum head only along a single arcuate path; and    interrupting the vacuum in the vacuum head to release the chip into a compartment of the tape.    
     
     
         2 . The method of  claim 1 , wherein said act of feeding a chip includes providing a plurality of chips, singulating the chips with a stop to permit a single chip at a time to pass by the stop, and sliding the singulated chip along an inclined surface under the influence of gravity to the preselected position with respect to the vacuum head.  
     
     
         3 . The method of  claim 1 , further comprising: 
 providing a body defining a slot having a floor surface, wherein said act of feeding includes providing a chip in the slot, and wherein said act of taking custody includes positioning the head adjacent the chip in the slot to expose the chip to the vacuum in the head; and    after taking custody of the chip, removing the floor surface from under the chip, wherein said act of moving the vacuum head includes moving the vacuum head substantially downwardly in the direction of the weight of the chip.    
     
     
         4 . The method of  claim 1 , wherein said feeding a chip step includes supporting the chip under the movable vacuum head with a support surface, the method further comprising removing the support surface from under the chip prior to said act of moving the vacuum head.  
     
     
         5 . A method for packaging electronic chips into the compartments of a carrier tape, the method comprising: 
 feeding a chip into a preselected position with respect to a movable vacuum head;    taking custody of the chip by way of a vacuum in the vacuum head;    moving the vacuum head in a single motion toward the carrier tape without substantially altering the direction of movement of the vacuum head;    interrupting the vacuum in the vacuum head to release the chip into a compartment of the tape; and    providing a body having a nose profile surface, wherein the vacuum head includes a cam follower adapted to follow the nose profile surface in response to movement of the body, and wherein said act of moving the vacuum head includes causing the vacuum head to pivot about the cam follower by moving the body.    
     
     
         7 . The method of  claim 1 , wherein said act of moving the vacuum head includes displacing the head only in a vertical direction.  
     
     
         8 . A method for packaging electronic chips into the compartments of a carrier tape, the method comprising: 
 feeding a chip into a preselected position with respect to a movable vacuum head;    taking custody of the chip by way of a vacuum in the vacuum head;    moving the vacuum head in a single motion toward the carrier tape without substantially altering the direction of movement of the vacuum head;    wherein said act of moving the vacuum head includes pivoting the vacuum head in response to rotation of an output shaft of a motor; and    interrupting the vacuum in the vacuum head to release the chip into a compartment of the tape.    
     
     
         10 . An apparatus for transferring electronic chips from a chip feeding mechanism to a carrier tape having compartments, the apparatus comprising: 
 a vacuum head adapted to take custody of a chip by way of a vacuum applied through the head; and    means for moving the vacuum head in a single motion toward the carrier tape without substantially altering the direction of movement of the vacuum head;    wherein said means for moving includes a body having a nose profile surface, and wherein said vacuum head includes a cam member movable along said nose profile surface in response to movement of said body.    
     
     
         11 . In a system for handling electrical circuit units and including a circuit unit loading station, transport means for moving said circuit units to said loading station, and wherein said loading station includes a selectively operable vacuum unit and a circuit unit receiver operatively associated with said vacuum unit, the improvement comprising 
 said vacuum unit supported for movement in a predetermined plane,    said circuit unit receiver located in said plane,    means for moving said vacuum unit in said plane toward and away from said receiver,    means for positioning a circuit unit in said loading station, in said plane, and below said vacuum unit,    means for producing a vacuum at said vacuum unit to attach said circuit unit to said vacuum unit for movement therewith, and    means for moving said vacuum unit with said circuit unit attached thereto toward said receiver and interrupting said vacuum to release said circuit unit when it is positioned within said receiver.    
     
     
         12 . The combination of  claim 11 , wherein said receiver is positioned below said transport means.  
     
     
         13 . The combination of  claim 11 , wherein said vacuum unit moves along an arcuate path in said plane toward and away from said receiver.  
     
     
         14 . The combination of  claim 11 , wherein said means for moving said vacuum unit includes 
 a cam follower supported for movement in said plane,    a circuit unit moving module including a cam surface supported for engagement with and movement relative to said cam follower and a support surface aligned with the path of movement of said circuit units on said transport means to receive and engage a circuit unit and support said engaged circuit unit adjacent said vacuum unit,    said cam surface being movable to effect movement of said cam follower in said plane and simultaneously removing said support surface as said circuit unit is attached to said vacuum unit, and    wherein said vacuum unit moves in an arcuate path when moving toward and away from said receiver.