US2003203209A1PendingUtilityA1

System and method of laser sintering dies and dies sintered by laser sintering

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Assignee: CHIPBOND TECHNOLOGY CORPPriority: Jul 5, 2001Filed: May 21, 2003Published: Oct 30, 2003
Est. expiryJul 5, 2021(expired)· nominal 20-yr term from priority
Inventors:Lu-Chen HwanDang-Cheng Yiu
H10P 54/00Y10S438/974B23K 26/3576Y10S438/964Y10T428/31
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Claims

Abstract

A laser sintering system is provided for sintering a die having a serrate edge. The laser sintering system comprises a laser generator for generating a laser beam and a movable carriage for carrying said die. The laser beam sinters the serrate edge of said die into a smooth edge. A method of sintering a die, the die having a serrate edge, comprises the following steps of providing a die and using a laser beam sintering the serrate edge of said die into a smooth edge. A die has a smooth edge sintered by a laser beam.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A die, said die having a smooth edge sintered by a laser beam.  
     
     
         2 . The die of  claim 1 , wherein said die having a first surface and a second surface respectively having a coating layer.  
     
     
         3 . The die of  claim 1 , wherein said laser beam is a CO 2  laser beam.  
     
     
         4 . The die of  claim 1 , wherein said laser beam is a Nd-YAG laser beam.  
     
     
         5 . The die of  claim 1 , wherein said laser beam is an Excimer laser beam.

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