US2003202769A1PendingUtilityA1
High density fiber terminator/connector
Assignee: SIWAVE INC A DELAWARE CORPPriority: Jun 13, 2000Filed: May 29, 2003Published: Oct 30, 2003
Est. expiryJun 13, 2020(expired)· nominal 20-yr term from priority
G02B 6/3692G02B 6/3885G02B 6/3818G02B 6/3652G02B 6/32G02B 6/3834G02B 6/3644G02B 6/3672
43
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Claims
Abstract
A high density fiber terminator/connector and methods of making the high density fiber terminator/connector are provided. One method comprises using deep reactive ion etching to etch a plurality of holes in a silicon substrate and placing a fiber in at least one hole.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An optical fiber assembly comprising a substrate with at least one hole and one alignment groove formed in the substrate, the hole configured to receive a tip of a fiber and alignment groove configured to align an object in place.
2 . The optical fiber assembly of claim 1 , wherein the object is an alignment pin
3 . The optical fiber assembly of claim 1 , wherein the object is a lens array
4 . The optical fiber assembly of claim 1 , wherein the object is a diffraction grating
5 . The optical fiber assembly of claim 1 , wherein the object is a microelectronic mechanical system
6 . The optical fiber assembly of claim 1 , wherein the object is a second optical fiber assembly
7 . The optical fiber assembly of claim 1 , wherein the alignment groove has a depth of less than about one-fourth of a total thickness of the substrate.
8 . The optical fiber assembly of claim 1 , wherein the alignment groove is etched through an entire thickness of the substrate.
9 . An optical fiber assembly comprising a substrate with at least one hole and a plurality of flaps in the substrate around a hole, the hole configured to receive a tip of a fiber and the flaps configured to align the fiber in the hole.
10 . A method of making an optical fiber assembly, the method comprising:
using deep reactive ion etching to etch at least one hole in a silicon substrate, wherein the hole is sized to fit an optical fiber; etching an alignment groove in said silicon substrate that is aligned with said hole; and placing an optical fiber in the hole.Join the waitlist — get patent alerts
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